公开(公告)号：US20070218653A1

公开(公告)日：2007-09-20

申请号：US11750960

申请日：2007-05-18

申请人： John de Larios ,  Mike Ravkin ,  Carl Woods ,  Fritz Redeker ,  James Garcia

发明人： John de Larios ,  Mike Ravkin ,  Carl Woods ,  Fritz Redeker ,  James Garcia

IPC分类号： H01L21/02

CPC分类号： H01L21/67051 ,  B08B3/04 ,  G03F7/30 ,  H01L21/67028 ,  H01L21/67034 ,  Y10S134/902

摘要： Methods for processing substrate through a head that is configured to be placed in close non-contact proximity to a surface of a substrate are provided. One method includes applying a first fluid onto the surface of the substrate from conduits in the head when the head is in close proximity to the surface of the substrate and removing the first fluid from the surface of the substrate. The removing is processed just as first fluid is applied to the surface of the substrate, and the removing ensures that the applied first fluid is contained between a surface of the head and the surface of the substrate and the first fluid being applied and removed defines a controlled meniscus. The method further includes moving the controlled meniscus over different regions of the surface of the substrate when movement of the head or the substrate is dictated. The moving of the controlled meniscus enables processing of part or all of the surface of the substrate using the first fluid.

摘要翻译： 提供了通过头部处理基板的方法，该头被配置为与基板的表面紧密非接触地放置。 一种方法包括当头部紧邻衬底的表面并从衬底的表面去除第一流体时，将第一流体施加到衬底表面上的管道中。 当第一流体被施加到基板的表面上时，移除被处理，并且移除确保所施加的第一流体被包含在头部的表面和基底的表面之间，并且被施加和移除的第一流体限定了 受控半月板 所述方法还包括当限制头部或基底的运动时，将受控弯液面移动到衬底的表面的不同区域上。 受控弯液面的移动使得能够使用第一流体处理基板的部分或全部表面。

公开(公告)号：US20070087950A1

公开(公告)日：2007-04-19

申请号：US11519354

申请日：2006-09-11

申请人： Mikhail Korolik ,  Erik Freer ,  John de Larios ,  Katrina Mikhaylichenko ,  Mike Ravkin ,  Fritz Redeker

发明人： Mikhail Korolik ,  Erik Freer ,  John de Larios ,  Katrina Mikhaylichenko ,  Mike Ravkin ,  Fritz Redeker

IPC分类号： B08B3/00 ,  B08B7/00 ,  C11D7/32

CPC分类号： C11D11/0047 ,  B08B7/02 ,  C11D1/146 ,  C11D3/2079 ,  C11D9/02 ,  C11D17/0013 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/31133 ,  H01L21/6708 ,  H01L21/67086

摘要： Cleaning compounds, apparatus, and methods to remove contaminants from a substrate surface are provided. An exemplary cleaning compound to remove particulate contaminants from a semiconductor substrate surface is provided. The cleaning compound includes a viscous liquid with a viscosity between about 1 cP to about 10,000 cP. The cleaning compound also includes a plurality of solid components dispersed in the viscous liquid, the plurality of solid components interact with the particulate contaminants on the substrate surface to remove the particulate contaminants from the substrate surface.

摘要翻译： 提供了清除化合物，设备和从基材表面除去污染物的方法。 提供了从半导体衬底表面去除颗粒污染物的示例性清洁化合物。 清洁化合物包括粘度在约1cP至约10,000cP之间的粘性液体。 清洁化合物还包括分散在粘性液体中的多个固体组分，多个固体组分与基底表面上的颗粒污染物相互作用以从基底表面去除颗粒污染物。

公开(公告)号：US07234477B2

公开(公告)日：2007-06-26

申请号：US10261839

申请日：2002-09-30

申请人： John M. de Larios ,  Mike Ravkin ,  Carl Woods ,  Fritz Redeker ,  James P. Garcia ,  Afshin Nickhou

发明人： John M. de Larios ,  Mike Ravkin ,  Carl Woods ,  Fritz Redeker ,  James P. Garcia ,  Afshin Nickhou

IPC分类号： B08B3/00 ,  F26B5/04

CPC分类号： H01L21/67051 ,  B08B3/04 ,  G03F7/30 ,  H01L21/67028 ,  H01L21/67034 ,  Y10S134/902

摘要： One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously.

摘要翻译： 提供了一种衬底制备系统的许多实施例之一，其包括具有头表面的头部，其头表面靠近衬底的表面。 该系统还包括用于通过头部将第一流体输送到基底表面的第一导管和用于通过头部将第二流体输送到基底表面的第二导管，其中第二流体不同于第一流体 流体。 该系统还包括第三导管，用于从基板的表面移除第一流体和第二流体中的每一个，其中第一导管，第二导管和第三导管基本上同时作用。

公开(公告)号：US07387689B2

公开(公告)日：2008-06-17

申请号：US11750960

申请日：2007-05-18

申请人： John M. de Larios ,  Mike Ravkin ,  Carl Woods ,  Fritz Redeker ,  James P. Garcia

发明人： John M. de Larios ,  Mike Ravkin ,  Carl Woods ,  Fritz Redeker ,  James P. Garcia

IPC分类号： B08B3/00 ,  F26B5/04

CPC分类号： H01L21/67051 ,  B08B3/04 ,  G03F7/30 ,  H01L21/67028 ,  H01L21/67034 ,  Y10S134/902

摘要： Methods for processing substrate through a head that is configured to be placed in close non-contact proximity to a surface of a substrate are provided. One method includes applying a first fluid onto the surface of the substrate from conduits in the head when the head is in close proximity to the surface of the substrate and removing the first fluid from the surface of the substrate. The removing is processed just as first fluid is applied to the surface of the substrate, and the removing ensures that the applied first fluid is contained between a surface of the head and the surface of the substrate and the first fluid being applied and removed defines a controlled meniscus. The method further includes moving the controlled meniscus over different regions of the surface of the substrate when movement of the head or the substrate is dictated. The moving of the controlled meniscus enables processing of part or all of the surface of the substrate using the first fluid.

摘要翻译： 提供了通过头部处理基板的方法，该头被配置为与基板的表面紧密非接触地放置。 一种方法包括当头部紧邻衬底的表面并从衬底的表面去除第一流体时，将第一流体施加到衬底表面上的管道中。 当第一流体被施加到基板的表面上时，移除被处理，并且移除确保所施加的第一流体被包含在头部的表面和基底的表面之间，并且被施加和移除的第一流体限定了 受控半月板 所述方法还包括当限制头部或基底的运动时，将受控弯液面移动到衬底的表面的不同区域上。 受控弯液面的移动使得能够使用第一流体处理基板的部分或全部表面。

公开(公告)号：US20050145265A1

公开(公告)日：2005-07-07

申请号：US10882835

申请日：2004-06-30

申请人： Michael Ravkin ,  Michael Smith ,  John de Larios ,  Fritz Redeker ,  Mikhail Korolik ,  Christian DiPietro

发明人： Michael Ravkin ,  Michael Smith ,  John de Larios ,  Fritz Redeker ,  Mikhail Korolik ,  Christian DiPietro

IPC分类号： B08B3/00 ,  B08B3/04 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306

CPC分类号： H01L21/67051 ,  C25D5/08 ,  C25D17/00 ,  C25D17/001 ,  H01L21/67023 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/67063 ,  Y10S134/902

摘要： Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the surface, applying a fluid from the head to the surface while the head is in proximity to the surface of the substrate to define the fluid layer, and removing the fluid from the surface through the proximity head by a vacuum. The fluid travels along the fluid layer between the head and the substrate at a velocity that increases as the head is in closer proximity to the surface.

摘要翻译： 在许多实施例中，在一个实施例中，公开了一种用于处理衬底的方法，其包括在衬底的表面上产生流体层，流体层限定流体弯液面。 该产生包括将头部移动到靠近表面的位置，将流体从头部施加到表面，同时头部靠近基底的表面以限定流体层，并且通过邻近头部从表面移除流体 通过真空。 流体沿着头部和基底之间的流体层以随着头部更接近表面而增加的速度行进。

公开(公告)号：US20050133061A1

公开(公告)日：2005-06-23

申请号：US10816337

申请日：2004-03-31

申请人： John de Larios ,  Aleksander Owczarz ,  Alan Schoepp ,  Fritz Redeker

发明人： John de Larios ,  Aleksander Owczarz ,  Alan Schoepp ,  Fritz Redeker

IPC分类号： B08B3/00 ,  H01L21/00 ,  B08B1/02

CPC分类号： B08B3/003 ,  H01L21/67028 ,  H01L21/67046 ,  Y10S134/902

摘要： An apparatus for use in processing a substrate includes a brush enclosure extending over a length. The brush enclosure is configured to be disposed over a surface of the substrate and has an open region that is configured to be disposed in proximity to the substrate. The open region extends over the length of the brush enclosure and enables foam from within the brush enclosure to contact the surface of the substrate. A substrate cleaning system and method for cleaning a substrate are also described.

摘要翻译： 用于处理衬底的装置包括在一定长度上延伸的刷子外壳。 电刷外壳被配置为设置在基板的表面上方，并且具有被配置为设置在基板附近的开放区域。 开放区域在刷子外壳的长度上延伸，并使来自刷子外壳内的泡沫能够接触基板的表面。 还描述了用于清洁衬底的衬底清洁系统和方法。

公开(公告)号：US08535451B2

公开(公告)日：2013-09-17

申请号：US12240300

申请日：2008-09-29

申请人： John M. de Larios ,  Mike Ravkin ,  Jeffrey Farber ,  Mikhail Korolik ,  Fritz Redeker ,  Aleksander Owczarz

发明人： John M. de Larios ,  Mike Ravkin ,  Jeffrey Farber ,  Mikhail Korolik ,  Fritz Redeker ,  Aleksander Owczarz

IPC分类号： B08B1/04

CPC分类号： B08B3/003 ,  H01L21/67028 ,  H01L21/67046 ,  Y10S134/902

摘要： An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer. such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer. is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.

摘要翻译： 公开了一种装置和方法，其中具有含有污染物的表面的半导体衬底被清洁或以其它方式用泡沫进行化学处理。 半导体晶片被支撑在刚性支撑件（或泡沫层）上，并且在半导体晶片被支撑的同时在半导体晶片的相对表面上提供泡沫。 接触半导体晶片的泡沫使用形式加压以产生卡住的泡沫。 形式与半导体晶圆之间的相对移动。 例如平行于和/或垂直于半导体晶片的顶表面的振荡。 然后在卡住的泡沫与半导体晶片接触的同时引发，以除去不期望的污染物和/或以其它方式化学处理使用泡沫的半导体晶片的表面。

公开(公告)号：US20110061687A1

公开(公告)日：2011-03-17

申请号：US12949762

申请日：2010-11-18

申请人： Katrina Mikhaylichenko ,  Mike Ravkin ,  Fritz Redeker ,  John M. de Larios ,  Erik M. Freer ,  Mikhail Korolik

发明人： Katrina Mikhaylichenko ,  Mike Ravkin ,  Fritz Redeker ,  John M. de Larios ,  Erik M. Freer ,  Mikhail Korolik

IPC分类号： B08B3/00

CPC分类号： H01L21/02057 ,  C25D5/34 ,  C25D7/12 ,  H01L21/288 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/76841

摘要： Apparatuses for preparing a surface of a substrate using a proximity head includes a carrier to hold and move the substrate along an axis and a proximity head having a head surface with a plurality of outlet ports defined thereon. The proximity head is defined to be positioned proximate and over the carrier and the surface of the substrate. A length of the head surface of the proximity head is defined to be greater than a diameter of the substrate and at least partially overlapping over the carrier when the substrate is present. The proximity head includes a first set of outlet ports in a first region defining a first applicator that is configured to apply a non-Newtonian fluid between a surface of the carrier and the head surface of the proximity head. A second set of outlet ports in a second region of the proximity head defines a second applicator that is configured to apply a first chemistry to the surface of the substrate when present. The second region is adjacent to the first region. A third set of outlet ports in a third region of the proximity head defines a third applicator that is configured to apply the non-Newtonian fluid between the head surface of the proximity head and the surface of the substrate when present. The third region is defined adjacent to the second region. A fourth set of outlet ports is defined in the second region of the proximity head to substantially remove the first chemistry from the surface of the substrate when present.

摘要翻译： 用于使用接近头来制备基底表面的装置包括：载体，用于沿着轴保持和移动基底;以及接近头，具有头表面，其上限定有多个出口。 接近头被限定为位于载体和基底的表面附近和上方。 接近头部的头表面的长度被限定为大于衬底的直径，并且当衬底存在时至少部分地重叠在载体上。 邻近头部包括在第一区域中的第一组出口端口，所述第一区域限定第一施用器，其被构造成在载体的表面和邻近头部的头部表面之间施加非牛顿流体。 在邻近头部的第二区域中的第二组出口端口限定第二施加器，其被配置为当存在时将第一化学物质施加到衬底的表面。 第二区域与第一区域相邻。 接近头部的第三区域中的第三组出口限定了第三施加器，其被配置为当存在时将非牛顿流体施加在邻近头部的头部表面和基底表面之间。 第三区域被定义为与第二区域相邻。 第四组出口端口限定在邻近头部的第二区域中，以在存在时从衬底的表面基本上移除第一化学物质。

公开(公告)号：US20100317556A1

公开(公告)日：2010-12-16

申请号：US12862072

申请日：2010-08-24

申请人： Mikhail Korolik ,  Erik M. Freer ,  John M. de Larios ,  Katrina Mikhaylichenko ,  Mike Ravkin ,  Fritz Redeker

发明人： Mikhail Korolik ,  Erik M. Freer ,  John M. de Larios ,  Katrina Mikhaylichenko ,  Mike Ravkin ,  Fritz Redeker

IPC分类号： C11D3/43

CPC分类号： C11D11/0047 ,  B08B7/02 ,  C11D1/146 ,  C11D3/2079 ,  C11D9/02 ,  C11D17/0013 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/31133 ,  H01L21/6708 ,  H01L21/67086

摘要： A cleaning compound is disclosed for removing particulate contaminants from a semiconductor substrate surface. The cleaning compound includes a liquid and carboxylic acid solid components dispersed in a substantially uniform manner in the liquid. A concentration of the carboxylic acid solid components in the liquid exceeds a solubility limit of the carboxylic acid solid components in the liquid. In one embodiment, a concentration of the carboxylic acid solid components in the liquid is within a range extending from about 3 percent by weight to about 5 percent by weight. In one embodiment, the carboxylic acid solid components are defined by a carbon number of at least four. The carboxylic acid solid components are defined to interact with the particulate contaminants on the semiconductor substrate surface to remove the particulate contaminants from the semiconductor substrate surface. The cleaning compound is viscous and may be formed as a gel.

摘要翻译： 公开了用于从半导体衬底表面去除微粒污染物的清洁化合物。 清洁化合物包括以基本均匀的方式分散在液体中的液体和羧酸固体组分。 液体中羧酸固体组分的浓度超过了液体中羧酸固体组分的溶解度极限。 在一个实施方案中，液体中羧酸固体组分的浓度在约3重量％至约5重量％的范围内。 在一个实施方案中，羧酸固体组分由至少四个的碳数定义。 羧酸固体组分被定义为与半导体衬底表面上的颗粒污染物相互作用以从半导体衬底表面去除颗粒污染物。 清洁化合物是粘稠的并且可以形成为凝胶。

公开(公告)号：US20100313918A1

公开(公告)日：2010-12-16

申请号：US12862091

申请日：2010-08-24

申请人： Mikhail Korolik ,  Erik M. Freer ,  John M.de Larios ,  Katrina Mikhaylichenko ,  Mike Ravkin ,  Fritz Redeker

发明人： Mikhail Korolik ,  Erik M. Freer ,  John M.de Larios ,  Katrina Mikhaylichenko ,  Mike Ravkin ,  Fritz Redeker

IPC分类号： B08B3/04 ,  B08B3/08

CPC分类号： C11D11/0047 ,  B08B7/02 ,  C11D1/146 ,  C11D3/2079 ,  C11D9/02 ,  C11D17/0013 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/31133 ,  H01L21/6708 ,  H01L21/67086

摘要： A substrate holder is defined to support a substrate. A rotating mechanism is defined to rotate the substrate holder. An applicator is defined to extend over the substrate holder to dispense a cleaning material onto a surface of the substrate when present on the substrate holder. The applicator is defined to apply a downward force to the cleaning material on the surface of the substrate. In one embodiment the cleaning material is gelatinous.

摘要翻译： 衬底支架限定为支撑衬底。 限定旋转机构以旋转衬底保持器。 施加器限定为在衬底保持器上延伸以在存在于衬底保持器上时将清洁材料分配到衬底的表面上。 施加器被限定为向衬底表面上的清洁材料施加向下的力。 在一个实施方案中，清洁材料是凝胶状的。