摘要:
A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.
摘要:
A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.
摘要:
A method of making a micro-fluid ejection head structure. The method can include positioning a semiconductor substrate having a fluid feed slot over a nozzle plate film in a bonding orientation therewith such that the substrate overlies the nozzle plate film and the device side of the substrate is substantially downwardly facing so that gravitational forces inhibit deformation of portions of the nozzle plate film toward the device side of the substrate.
摘要:
A substantially inorganic planarization layer for a micro-fluid ejection head substrate and method therefor. The planarization layer includes a plurality of layers composed of one or more dielectric compounds and at least one spin on glass (SOG) layer having a total thickness ranging from about 1 microns to about 15 microns deposited over a second metal layer of the micro-fluid ejection head substrate. A top most layer of the planarization layer is selected from one or more of the dielectric compounds and a hard mask material.
摘要:
A device surface of a substrate is dry-sprayed with a polymeric material (e.g., a photoresist) to provide a spray-coated layer on the surface of the substrate. The spray-coated layer has a thickness ranging from about 0.5 to about 20 microns. Flow features are formed (e.g., imaged and developed) in the spray-coated layer. A nozzle plate layer is applied to the spray-coated layer. The nozzle plate layer has a thickness ranging from about 5 to about 40 microns and contains nozzle holes formed therein to provide the micro-fluid ejection head structure.
摘要:
Methods of making micro-fluid ejection head structures. One of the methods includes providing a substrate having a plurality fluid ejection actuators on a device surface thereof. The device surface of the substrate also has a thick film layer comprising at least one of fluid flow channels and fluid ejection chambers therein. A removable anti-reflective material is applied to at least one or more exposed portions of the device surface of the substrate. A nozzle layer is applied adjacent to the thick film layer. The nozzle layer is imaged to provide a plurality of nozzles in the nozzle layer, and the non-reflective material is removed from the exposed portions of the device surface of the substrate.
摘要:
Improved photoimaged nozzle members for a micro-fluid ejection head, micro-fluid ejection heads containing such nozzle members, and methods for making any of the same. One such nozzle member is provided by a photoresist nozzle layer applied adjacent a thick film layer on a substrate having fluid ejector actuators. The photoresist nozzle layer has a plurality of nozzles therein. The nozzles are formed in the nozzle layer from an exit surface of the nozzle layer to an entrance surface of the nozzle layer. The nozzles have a reentrant hole profile with a wall angle greater than about 40 up to about 30° measured from an axis orthogonal to a plane defined by the exit surface of the nozzle layer.
摘要:
A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.
摘要:
A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.
摘要:
Micro-fluid ejection head structures, methods of making micro-fluid ejection head structures having improved operability, and methods for improving the durability of micro-fluid ejection head structures are provided. One such micro-fluid ejection head structure includes a micro-fluid ejection head having a substrate and nozzle plate assembly adhesively attached adjacent to a substrate support using a substrate adhesive. The nozzle plate is adhesively attached adjacent to the substrate with a nozzle plate adhesive. A thermally, UV or other cure mechanism encapsulant material is attached adjacent to the ejection head and substrate support. Each of the substrate adhesive, and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.