Voltage identifier sorting
    1.
    发明授权
    Voltage identifier sorting 有权
    电压标识符排序

    公开(公告)号:US07739573B2

    公开(公告)日:2010-06-15

    申请号:US11621766

    申请日:2007-01-10

    IPC分类号: G01R31/30

    摘要: A voltage identifier (VID) sorting system is provided that optimizes processor power and operating voltage guardband at a constant processor frequency. The VID sorting system determines a voltage versus current curve for the processor. The VID sorting system then uses the voltage versus current characteristics to calculate the power for each VID to determine an acceptable range of VIDs within the maximum power criteria. The VID sorting system then tests VIDs in the range and selects a VID from the range to optimize for minimum power and/or maximum voltage guardband at a constant processor frequency.

    摘要翻译: 提供了一种电压标识符(VID)分类系统,其以恒定的处理器频率优化处理器功率和工作电压保护带。 VID分选系统确定处理器的电压与电流曲线。 然后,VID分选系统使用电压与电流特性来计算每个VID的功率,以确定最大功率标准内的VID的可接受范围。 VID分类系统然后测试该范围内的VID,并从该范围中选择一个VID,以在恒定的处理器频率下对最小功率和/或最大电压保护带进行优化。

    Voltage Identifier Sorting
    2.
    发明申请
    Voltage Identifier Sorting 有权
    电压标识符排序

    公开(公告)号:US20080168318A1

    公开(公告)日:2008-07-10

    申请号:US11621766

    申请日:2007-01-10

    IPC分类号: G01R31/30 G06F11/00

    摘要: A voltage identifier (VID) sorting system is provided that optimizes processor power and operating voltage guardband at a constant processor frequency. The VID sorting system determines a voltage versus current curve for the processor. The VID sorting system then uses the voltage versus current characteristics to calculate the power for each VID to determine an acceptable range of VIDs within the maximum power criteria. The VID sorting system then tests VIDs in the range and selects a VID from the range to optimize for minimum power and/or maximum voltage guardband at a constant processor frequency.

    摘要翻译: 提供了一种电压标识符(VID)分类系统,其以恒定的处理器频率优化处理器功率和工作电压保护带。 VID分选系统确定处理器的电压与电流曲线。 然后,VID分选系统使用电压与电流特性来计算每个VID的功率,以确定最大功率标准内的VID的可接受范围。 VID分类系统然后测试该范围内的VID,并从该范围中选择一个VID,以在恒定的处理器频率下对最小功率和/或最大电压保护带进行优化。

    UTILIZING NETWORKED 3D VOLTAGE REGULATION MODULES (VRM) TO OPTIMIZE POWER AND PERFORMANCE OF A DEVICE
    3.
    发明申请
    UTILIZING NETWORKED 3D VOLTAGE REGULATION MODULES (VRM) TO OPTIMIZE POWER AND PERFORMANCE OF A DEVICE 有权
    利用网络化的3D电压调节模块(VRM)优化设备的功率和性能

    公开(公告)号:US20120159203A1

    公开(公告)日:2012-06-21

    申请号:US13399799

    申请日:2012-02-17

    IPC分类号: G06F1/26

    CPC分类号: G06F1/26

    摘要: A method, system, and computer program for using an array of networked 3D voltage regulation modules (VRMs) to optimize power usage by components on a voltage island in real time is presented. The networked VRM devices work in parallel to supply adequate power to connected voltage islands, and to supplement other VRMs in the system that may require additional power in the case of a critical event.

    摘要翻译: 提出了一种使用网络化的三维电压调节模块阵列(VRM)来实时优化电压岛上部件功率使用的方法,系统和计算机程序。 联网的VRM设备并行工作,为连接的电压岛提供足够的电力,并补充系统中可能需要额外功率的重要事件的其他VRM。

    Optimizing voltage on a power plane using a networked voltage regulation module array
    6.
    发明授权
    Optimizing voltage on a power plane using a networked voltage regulation module array 失效
    使用网络电压调节模块阵列优化电源平面上的电压

    公开(公告)号:US08341434B2

    公开(公告)日:2012-12-25

    申请号:US12037743

    申请日:2008-02-26

    IPC分类号: G06F1/00

    CPC分类号: G06F1/26

    摘要: A method, system, and computer program for using an array of networked 3D voltage regulation modules (VRMs) to optimize power usage by components on a voltage island in real time is presented. The networked VRM devices work in parallel to supply adequate power to connected voltage islands, and to supplement other VRMs in the system that may require additional power in the case of a critical event.

    摘要翻译: 提出了一种使用网络化的三维电压调节模块阵列(VRM)来实时优化电压岛上部件功率使用的方法,系统和计算机程序。 联网的VRM设备并行工作,为连接的电压岛提供足够的电力,并补充系统中可能需要额外功率的重要事件的其他VRM。

    High dynamic range imaging cell with electronic shutter extensions
    7.
    发明授权
    High dynamic range imaging cell with electronic shutter extensions 有权
    具有电子快门延伸功能的高动态范围成像单元

    公开(公告)号:US07948535B2

    公开(公告)日:2011-05-24

    申请号:US11948463

    申请日:2007-11-30

    IPC分类号: H04N3/14 H04N5/335

    摘要: A pixel sensor cell of improved dynamic range and a design structure including the pixel sensor cell embodied in a machine readable medium are provided. The pixel cell comprises a coupling transistor that couples a capacitor device to a photosensing region (e.g., photodiode) of the pixel cell, the photodiode being coupled to a transfer gate and one terminal of the coupling transistor. In operation, the additional capacitance is coupled to the pixel cell photodiode when the voltage on the photodiode is drawn down to the substrate potential. Thus, the added capacitance is only connected to the imager cell when the cell is nearing its charge capacity. Otherwise, the cell has a low capacitance and low leakage. In an additional embodiment, a terminal of the capacitor is coupled to a “pulsed” supply voltage signal that enables substantially full depletion of stored charge from the capacitor to the photosensing region during a read out operation of the pixel sensor cell. In various embodiments, the locations of the added capacitance and photodiode may be interchanged with respect to the coupling transistor. In addition, the added capacitor of the pixel sensor cell allows for a global shutter operation.

    摘要翻译: 提供了改进的动态范围的像素传感器单元和包括体现在机器可读介质中的像素传感器单元的设计结构。 像素单元包括将电容器器件耦合到像素单元的光敏区域(例如,光电二极管)的耦合晶体管,光电二极管耦合到传输栅极和耦合晶体管的一个端子。 在操作中,当光电二极管上的电压向下拉到衬底电位时,附加电容耦合到像素单元光电二极管。 因此,当电池接近其充电容量时,所添加的电容仅连接到成像器单元。 否则,电池具有低电容和低泄漏。 在另外的实施例中,电容器的端子耦合到“脉冲”电源电压信号,其在像素传感器单元的读出操作期间使存储的电荷从电容器到光敏区域基本上完全耗尽。 在各种实施例中,增加的电容和光电二极管的位置可以相对于耦合晶体管互换。 此外,像素传感器单元的附加电容允许全局快门操作。

    High dynamic range imaging cell with electronic shutter extensions
    8.
    发明授权
    High dynamic range imaging cell with electronic shutter extensions 有权
    具有电子快门扩展功能的高动态范围成像单元

    公开(公告)号:US07719590B2

    公开(公告)日:2010-05-18

    申请号:US11687245

    申请日:2007-03-16

    IPC分类号: H04N5/232

    摘要: A pixel sensor cell of improved dynamic range comprises a coupling transistor that couples a capacitor device to a photosensing region (e.g., photodiode) of the pixel cell, the photodiode being coupled to a transfer gate and one terminal of the coupling transistor. In operation, the additional capacitance is coupled to the pixel cell photodiode when the voltage on the photodiode is drawn down to the substrate potential. Thus, the added capacitance is only connected to the imager cell when the cell is nearing its charge capacity. Otherwise, the cell has a low capacitance and low leakage. In an additional embodiment, a terminal of the capacitor is coupled to a “pulsed” supply voltage signal that enables substantially full depletion of stored charge from the capacitor to the photosensing region during a read out operation of the pixel sensor cell. In various embodiments, the locations of the added capacitance and photodiode may be interchanged with respect to the coupling transistor. In addition, the added capacitor of the pixel sensor cell allows for a global shutter operation.

    摘要翻译: 改进的动态范围的像素传感器单元包括将电容器器件耦合到像素单元的光敏区域(例如光电二极管)的耦合晶体管,光电二极管耦合到传输门和耦合晶体管的一个端子。 在操作中,当光电二极管上的电压向下拉到衬底电位时,附加电容耦合到像素单元光电二极管。 因此,当电池接近其充电容量时,所添加的电容仅连接到成像器单元。 否则,电池具有低电容和低泄漏。 在另外的实施例中,电容器的端子耦合到“脉冲”电源电压信号,其在像素传感器单元的读出操作期间使存储的电荷从电容器充分耗尽。 在各种实施例中,增加的电容和光电二极管的位置可以相对于耦合晶体管互换。 此外,像素传感器单元的附加电容允许全局快门操作。

    Method of manufacturing dual orientation wafers
    9.
    发明授权
    Method of manufacturing dual orientation wafers 失效
    制造双取向晶圆的方法

    公开(公告)号:US07344962B2

    公开(公告)日:2008-03-18

    申请号:US11160365

    申请日:2005-06-21

    IPC分类号: H01L21/36

    摘要: Disclosed is a method of manufacturing dual orientation wafers. A trench is formed in a multi-layer wafer to a silicon substrate with a first crystalline orientation. The trench is filled with a silicon material (e.g., amorphous silicon or polysilicon trench). Isolation structures are formed to isolate the silicon material in the trench from a semiconductor layer with a second crystalline orientation. Additional isolation structures are formed within the silicon material in the trench and within the semiconductor layer. A patterned amorphization process is performed on the silicon material in the trench and followed by a recrystallization anneal such that the silicon material in the trench recrystallizes with the same crystalline orientation as the silicon substrate. The resulting structure is a semiconductor wafer with isolated semiconductor areas on the same plane having different crystalline orientations as well as isolated sections within each semiconductor area for device formation.

    摘要翻译: 公开了制造双取向晶片的方法。 在多层晶片中形成具有第一晶体取向的硅衬底的沟槽。 沟槽填充有硅材料(例如,非晶硅或多晶硅沟槽)。 形成隔离结构以将沟槽中的硅材料与具有第二晶体取向的半导体层隔离。 另外的隔离结构形成在沟槽内和半导体层内的硅材料内。 对沟槽中的硅材料进行图案化非晶化处理,然后进行再结晶退火,使得沟槽中的硅材料以与硅衬底相同的结晶取向重结晶。 所得到的结构是在具有不同晶体取向的同一平面上的隔离半导体区域以及用于器件形成的每个半导体区域内的隔离部分的半导体晶片。

    Method of manufacturing dual orientation wafers
    10.
    发明授权
    Method of manufacturing dual orientation wafers 有权
    制造双取向晶圆的方法

    公开(公告)号:US07799609B2

    公开(公告)日:2010-09-21

    申请号:US11955436

    申请日:2007-12-13

    IPC分类号: H01L21/00 H01L29/04

    摘要: Disclosed is a method of manufacturing dual orientation wafers. A trench is formed in a multi-layer wafer to a silicon substrate with a first crystalline orientation. The trench is filled with a silicon material (e.g., amorphous silicon or polysilicon trench). Isolation structures are formed to isolate the silicon material in the trench from a semiconductor layer with a second crystalline orientation. Additional isolation structures are formed within the silicon material in the trench and within the semiconductor layer. A patterned amorphization process is performed on the silicon material in the trench and followed by a recrystallization anneal such that the silicon material in the trench recrystallizes with the same crystalline orientation as the silicon substrate. The resulting structure is a semiconductor wafer with isolated semiconductor areas on the same plane having different crystalline orientations as well as isolated sections within each semiconductor area for device formation.

    摘要翻译: 公开了制造双取向晶片的方法。 在多层晶片中形成具有第一晶体取向的硅衬底的沟槽。 沟槽填充有硅材料(例如,非晶硅或多晶硅沟槽)。 形成隔离结构以将沟槽中的硅材料与具有第二晶体取向的半导体层隔离。 另外的隔离结构形成在沟槽内和半导体层内的硅材料内。 对沟槽中的硅材料进行图案化非晶化处理,然后进行再结晶退火,使得沟槽中的硅材料以与硅衬底相同的结晶取向重结晶。 所得到的结构是在具有不同晶体取向的同一平面上的隔离半导体区域以及用于器件形成的每个半导体区域内的隔离部分的半导体晶片。