Method for preparing nanoporous carbons with enhanced mechanical strength and the nanoporous carbons prepared by the method
    1.
    发明授权
    Method for preparing nanoporous carbons with enhanced mechanical strength and the nanoporous carbons prepared by the method 有权
    通过该方法制备具有增强机械强度的纳米多孔碳和纳米多孔碳的方法

    公开(公告)号:US07326396B2

    公开(公告)日:2008-02-05

    申请号:US10325884

    申请日:2002-12-23

    IPC分类号: C01B31/02

    摘要: The present invention relates to a method for preparing nanoporous carbons with enhanced mechanical strength and the nanoporous carbons prepared by the method, and more specifically, to a method for preparing a nanoporous carbon, comprising the steps of (i) synthesizing a mesoporous silica template not being subjected to any calcination process; (ii) incorporating a mixture of a monomer for addition polymerization and initiator, or a mixture of a monomer for condensation polymerization and acid catalyst into the as-synthesized mesoporous silica template, and reacting the mixture to obtain a polymer-silica composite; and (iii) carbonizing the polymer-silica composite at a high temperature to obtain a carbon-silica composite, from which the silica template is then removed using a solvent.According to the preparation method of the present invention, the nanoporous carbons having uniform size of mesopores, high surface area and high mechanical stability can be prepared at low preparation cost through a simplified preparation process. Therefore, the nanoporous carbons of the present invention can be used as catalysts, catalyst supports, separating agents, hydrogen reserving materials, adsorbents, membranes and membrane fillers in various application fields.

    摘要翻译: 本发明涉及一种制备具有增强的机械强度的纳米多孔碳的方法和通过该方法制备的纳米多孔碳,更具体地涉及一种制备纳米多孔碳的方法,其包括以下步骤:(i)合成中孔二氧化硅模板, 经受任何煅烧过程; (ii)将加成聚合单体和引发剂的混合物,或用于缩聚的单体和酸催化剂的混合物混合到合成的介孔二氧化硅模板中,并使混合物反应以获得聚合物 - 二氧化硅复合材料; 和(iii)在高温下碳化聚合物 - 二氧化硅复合材料以获得碳 - 二氧化硅复合材料,然后使用溶剂除去二氧化硅模板。 根据本发明的制备方法,可以通过简化的制备方法以低的制备成本制备具有均匀尺寸的介孔,高表面积和高机械稳定性的纳米多孔碳。 因此,本发明的纳米多孔碳可用作各种应用领域中的催化剂,催化剂载体,分离剂,储氢材料,吸附剂,膜和膜填料。

    Method for forming insulating film between interconnect layers in microelectronic devices
    3.
    发明授权
    Method for forming insulating film between interconnect layers in microelectronic devices 有权
    在微电子器件中在互连层之间形成绝缘膜的方法

    公开(公告)号:US06660822B2

    公开(公告)日:2003-12-09

    申请号:US09895158

    申请日:2001-07-02

    IPC分类号: C08G7718

    摘要: The present invention provides a method for forming insulating film between interconnect layers in microelectronic devices, said method comprising the steps of: preparing siloxane-based resins by hydrolyzing and polycondensing the compound represented by the following formula (1), with or without the compound represented by the following formula (2), in an organic solvent in the presence of a catalyst and water; coating a silicon substrate with the siloxane-based resins dissolved in an organic solvent; and heat-curing the resulting coating film:  RSiX1X2X3  [2] in which, R is hydrogen atom, C1˜C3 alkyl group, C3˜C10 cycloalkyl group, or C6˜C15 aryl group; X1, X2 and X3 are independently C1˜C3 alkyl group, C1˜C10 alkoxy group, or halogen atom; n is an integer ranging from 3 to 8; and m is an integer ranging from 1 to 10.

    摘要翻译: 本发明提供了一种在微电子器件中在互连层之间形成绝缘膜的方法,所述方法包括以下步骤:通过将下式(1)表示的化合物水解和缩聚来制备硅氧烷基树脂,所述化合物或不含有化合物 通过下式(2)在有机溶剂中在催化剂和水的存在下反应; 用溶解在有机溶剂中的硅氧烷基树脂涂覆硅衬底; 对所得涂膜进行热固化,其中R为氢原子,C1〜C3烷基,C3〜C10环烷基或C6〜C15芳基; X1,X2和X3独立为C1〜C3烷基,C1 〜C10烷氧基或卤原子; n为3〜8的整数, andm为1〜10的整数。