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公开(公告)号:US5418186A
公开(公告)日:1995-05-23
申请号:US275550
申请日:1994-07-15
申请人: Jong-han Park , Chun-geun Park , Seon-ho Ha
发明人: Jong-han Park , Chun-geun Park , Seon-ho Ha
CPC分类号: H01L24/12 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/03912 , H01L2224/0401 , H01L2224/05558 , H01L2224/05624 , H01L2224/1147 , H01L2224/11901 , H01L2224/13007 , H01L2224/13099 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01094 , H01L2924/014 , H01L2924/05042 , H01L2924/19043 , H01L2924/3025
摘要: A method for manufacturing a bump on a semiconductor comprising the steps of: forming metal pad on a portion of a surface of a substrate, forming a barrier metal layer over the surface of the substrate such that the barrier metal layer cover the metal pad, forming a photoresist layer over the barrier metal layer, forming an opening in the photoresist layer to expose a portion of the barrier metal layer overlaying the metal pad, forming a chip bump in the opening, selectively removing the photoresist layer using the bump as a mask, such that residual portions of the photoresist layer remain, and such that portions of the barrier metal layer are exposed, etching the exposed portions of the barrier metal layer using the residual photoresist layer as a mask, and removing the residual photoresist layer.
摘要翻译: 一种用于制造半导体上的凸块的方法,包括以下步骤:在衬底的表面的一部分上形成金属焊盘,在衬底的表面上形成阻挡金属层,使得阻挡金属层覆盖金属焊盘,形成 在所述阻挡金属层上方的光致抗蚀剂层,在所述光致抗蚀剂层中形成开口以暴露覆盖所述金属焊盘的所述阻挡金属层的一部分,在所述开口中形成芯片凸块,使用所述凸块作为掩模选择性地去除所述光致抗蚀剂层, 使得光致抗蚀剂层的残留部分保留,并且使得阻挡金属层的部分暴露,使用残留的光致抗蚀剂层作为掩模蚀刻阻挡金属层的暴露部分,并除去残留的光致抗蚀剂层。
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公开(公告)号:US6058375A
公开(公告)日:2000-05-02
申请号:US954584
申请日:1997-10-20
申请人: Jong-han Park
发明人: Jong-han Park
IPC分类号: G06F3/14 , B65G61/00 , G06F3/0482 , G06F17/50 , G06Q10/00 , G06Q10/06 , G06Q50/00 , G06F17/60
摘要: An automatic accounting processor and method far automatically performing an accounting procedure for transaction data on a real time basis through menu selection and input or a data communication network on a computer system, by standardizing, formulating and compounding a management control business of an enterprise. The automatic accounting processor includes a transmitter/receiver, a display/input unit, a storage unit, a processing unit, and an output unit. The automatic accounting processor and method allows an automatic accounting procedure without an accounting knowledge. Also, an accounting procedure and a balancing operation procedure are performed on a real time basis, by automatically controlling errors generated during the accounting procedure, thereby realizing an effective management control.
摘要翻译: 通过菜单选择和输入或计算机系统上的数据通信网络,通过标准化,制定和组合企业的管理控制业务,自动计费处理器和方法能够实时地实时地执行事务数据的计费过程。 自动会计处理器包括发送器/接收器,显示器/输入单元,存储单元,处理单元和输出单元。 自动会计处理器和方法允许没有会计知识的自动会计过程。 此外,通过自动控制在计费过程中产生的错误,实时地执行计费过程和平衡操作过程,从而实现有效的管理控制。
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公开(公告)号:US07916361B2
公开(公告)日:2011-03-29
申请号:US12113805
申请日:2008-05-01
申请人: Jong-han Park
发明人: Jong-han Park
CPC分类号: H04N1/00572 , H04N1/00578 , H04N1/00588 , H04N1/00591 , H04N1/00602 , H04N1/00612 , H04N1/00615
摘要: A double side image scanner includes a frame, a two-way roll feeder, a one-way roll feeder and an image sensor. The frame includes a track that has an entrance, a scanning line joined to the entrance and a circuit line joined to the scanning line. The circuit line is designed to return the medium to the scanning line. The circuit line has a junction point where the circuit line meets with the scanning line, an inlet through which the medium comes into the circuit line from the scanning line and an outlet through which the medium goes out of the circuit line toward the scanning line. A driving means mounted to the frame for driving the two-way roll feeder and the one-way roll feeder. The image sensor obtains image data by scanning the front and rear surfaces of the medium.
摘要翻译: 双面图像扫描器包括框架,双向滚筒进给器,单向滚筒进给器和图像传感器。 框架包括具有入口的轨道,连接到入口的扫描线和连接到扫描线的电路线。 电路线被设计成将介质返回到扫描线。 电路线具有电路线与扫描线接合的接合点,介质从扫描线进入电路线的入口和介质从电路线向扫描线离开的出口。 驱动装置,安装在框架上,用于驱动双向辊供料器和单向辊供料器。 图像传感器通过扫描介质的前表面和后表面来获得图像数据。
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公开(公告)号:US06476494B1
公开(公告)日:2002-11-05
申请号:US09438727
申请日:1999-11-11
申请人: Nam-jung Hur , Yong-hwan Kwon , Jong-han Park
发明人: Nam-jung Hur , Yong-hwan Kwon , Jong-han Park
IPC分类号: H01L23488
CPC分类号: H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/1147 , H01L2224/13099 , H01L2924/01004 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2224/05639 , H01L2924/00014 , H01L2224/05111 , H01L2224/05147 , H01L2224/05155
摘要: Silver-tin alloy solder bumps are fabricated by forming a masked underbump metallurgy layer on a microelectronic substrate, to define exposed portions of the underbump metallurgy layer, plating silver on the exposed portions of the underbump metallurgy, plating tin on the silver and reflowing to form silver-tin alloy solder bumps. Accordingly, silver-tin alloy is not plated. Rather, individual layers of silver and tin are plated, and then reflowed to form silver-tin alloy solder bumps.
摘要翻译: 通过在微电子基板上形成掩模的下凸点冶金层来制造银锡合金焊料凸块,以限定底部焊接冶金层的暴露部分,在底部焊接冶金的暴露部分上镀银,在锡上镀锡并回流以形成 银锡合金焊锡凸块。 因此,银 - 锡合金不被电镀。 相反,银和锡的各层被镀覆,然后回流以形成银 - 锡合金焊料凸块。
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公开(公告)号:US6013572A
公开(公告)日:2000-01-11
申请号:US63716
申请日:1998-04-21
申请人: Nam-jung Hur , Yong-hwan Kwon , Jong-han Park
发明人: Nam-jung Hur , Yong-hwan Kwon , Jong-han Park
IPC分类号: G01N21/88 , G01N21/956 , H01L21/60 , H01L23/48 , H01L21/44
CPC分类号: H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/1147 , H01L2224/13099 , H01L2924/01004 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14
摘要: Silver-tin alloy solder bumps are fabricated by forming a masked underbump metallurgy layer on a microelectronic substrate, to define exposed portions of the underbump metallurgy layer, plating silver on the exposed portions of the underbump metallurgy, plating tin on the silver and reflowing to form silver-tin alloy solder bumps. Accordingly, silver-tin alloy is not plated. Rather, individual layers of silver and tin are plated, and then reflowed to form silver-tin alloy solder bumps.
摘要翻译: 通过在微电子基板上形成掩模的下凸点冶金层来制造银锡合金焊料凸块,以限定底部焊接冶金层的暴露部分,在底部焊接冶金的暴露部分上镀银,在锡上镀锡并回流以形成 银锡合金焊锡凸块。 因此,银 - 锡合金不被电镀。 相反,银和锡的各层被镀覆,然后回流以形成银 - 锡合金焊料凸块。
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