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1.发明授权In-line image sensor in combination with linear variable filter based spectrophotometer 有权联机图像传感器与线性可变滤波器分光光度计相结合公开(公告)号：US08368002B2
公开(公告)日：2013-02-05
申请号：US12580028
申请日：2009-10-15
CPC分类号： G01J3/2803 , G01J3/12 , G01J3/26 , G01J3/51 , G01J3/513 , G01J2003/1234
摘要： A photosensitive apparatus including a full width array of photosensors and a first photosensor chip. The first photosensor chip including a linear array of photosensors having a plurality of pixels arranged in a long direction and a linear variable filter adapted to transmit at least ten unique bandwidths of wavelengths of light along a length of the linear variable filter where the linear variable filter is fixedly secured to the linear array. Each respective pixel receives a unique bandwidth of wavelengths of light as a light passes through the linear variable filter and the length is aligned with the long direction. The full width array of photosensors is arranged perpendicular to a process direction of a printing device.
摘要翻译： 一种感光装置，包括全光束传感器阵列和第一光电传感器芯片。 第一光传感器芯片包括具有沿长方向布置的多个像素的光电传感器的线性阵列和适于沿着线性可变滤波器的长度传输至少十个唯一的波长波长的线性可变滤波器，其中线性可变滤波器 固定地固定在线性阵列上。 当光线通过线性可变滤波器并且长度与长方向对准时，每个像素接收光的波长的唯一带宽。 光传感器的全宽阵列垂直于打印装置的处理方向布置。
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公开(公告)号：US06927381B2
公开(公告)日：2005-08-09
申请号：US10656622
申请日：2003-09-05
申请人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
发明人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
CPC分类号： H01L27/14645 , H01L27/14621
摘要： A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.
摘要翻译： 用于在整个可见光谱上记录图像的光敏成像装置包括一组光敏元件，其在约600nm处具有围绕光谱的橙色部分的峰值响应。 峰响应通过组合响应，在一种情况下，与允许红色或红外波长的滤波器相关联的光电传感器以及与允许橙色波长和更长的滤波器相关联的光电传感器的响应。 在另一种情况下，光电传感器被构造为衰减更长的波长，其与允许橙色和较长波长的滤波器组合可以模拟在光谱的橙色部分周围的峰值行为。
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3.发明授权Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon 失效使用U形槽作为使用V形槽的替代方案来防止在硅中切割引起的损坏公开(公告)号：US06955989B2
公开(公告)日：2005-10-18
申请号：US09996681
申请日：2001-11-30
申请人： Alain E. Perregaux , Paul A. Hosier , Josef E. Jedlicka , Nicholas J. Salatino , Jagdish C. Tandon
发明人： Alain E. Perregaux , Paul A. Hosier , Josef E. Jedlicka , Nicholas J. Salatino , Jagdish C. Tandon
IPC分类号： B28D5/02 , H01L21/301 , H01L21/3065 , H01L21/302
摘要： The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.
摘要翻译： 本公开内容涉及通过将第二蚀刻步骤通过将第二蚀刻步骤修改为干蚀刻而不是湿蚀刻将芯片芯片切割方法修改为U形沟槽轮廓导致通过消除更昂贵的直接成本节省 工艺步骤，以及剥离显影的光致抗蚀剂层的需要。 此外，进入U形凹槽轮廓可实现额外的间接和更大的成本节省，这是由于加工量增加，产量提高和金属层缺陷减少。
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公开(公告)号：US5696626A
公开(公告)日：1997-12-09
申请号：US542247
申请日：1995-10-12
IPC分类号： H01L31/0216 , H04N1/04
CPC分类号： H01L31/02162
摘要： A photosensitive chip, such as used in a scanner or facsimile, defines a linear array of photosites, each photosite being covered with a filter formed from a cured translucent liquid. At the critical ends of the chip, between the end photosite in the array and the edge of the chip, there is provided a ridge which protrudes over the thickness of the filter. This ridge maintains the physical integrity of the filter.
摘要翻译： 诸如用于扫描仪或传真机中的感光芯片限定了一种线性阵列的光斑，每个光斑都被由固化的半透明液体形成的过滤器覆盖。 在芯片的临界端，在阵列中的端部闪光和芯片的边缘之间，设置有突出于过滤器厚度的脊。 该脊保持过滤器的物理完整性。
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公开(公告)号：US06646248B2
公开(公告)日：2003-11-11
申请号：US09841279
申请日：2001-04-24
申请人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
发明人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
IPC分类号： H01L2700
CPC分类号： H01L27/14645 , H01L27/14621
摘要： A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.
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公开(公告)号：US5119181A
公开(公告)日：1992-06-02
申请号：US681809
申请日：1991-04-08
IPC分类号： H04N1/48
CPC分类号： H04N1/486
摘要： A color chip construction especially adapted for use in fabricating full width arrays in which the individual chip photosites consisting of a blue, green, and red photodiode shaped and positioned to provide a rectangular photosite with square sides that enhance butting of the color chip with other like color chips to form full width color arrays.
摘要翻译： 特别适用于制造全宽阵列的彩色芯片结构，其中由蓝色，绿色和红色光电二极管组成的单个芯片光电二极管形成并定位成提供具有方形侧面的矩形光泽，以增强与其他类似物的颜色芯片对接 彩色芯片组成全彩色阵列。
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公开(公告)号：US5031032A
公开(公告)日：1991-07-09
申请号：US501584
申请日：1990-03-30
CPC分类号： H04N1/486
摘要： A color chip construction especially adapted for use in fabricating full width arrays in which the individual chip photosites consisting of a blue, green, and red photodiode shaped and positioned to provide a rectangular photosite with square sides that enhance butting of the color chip with other like color chips to form full width color arrays.
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公开(公告)号：US06998595B2
公开(公告)日：2006-02-14
申请号：US09802792
申请日：2001-03-08
IPC分类号： H01L27/00
CPC分类号： H01L27/14687 , H01L27/14621 , H01L27/14623 , H01L27/14632 , H01L27/14685
摘要： An architecture and manufacturing method for photosensitive chips, such as used in office equipment and digital cameras, involves creating grooves between chip areas in a wafer, and then placing a light-transmissive planar layer over the main surface of the wafer. The planar layer, which may be acrylic-based, creates a substantially planar surface over both the photosites in the chip areas and the grooves. The planar layer in turn supports one or more light-transmissive filtering layers. The arrangement avoids damage to the filtering layers when the wafer is diced along the grooves.
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9.发明授权Electro optical devices with reduced filter thinning on the edge pixel photosites and method of producing same 有权具有减少滤光器薄膜边缘像素光电子的光学器件及其制造方法公开(公告)号：US06255133B1
公开(公告)日：2001-07-03
申请号：US09641292
申请日：2000-08-18
IPC分类号： H01L21302
CPC分类号： H01L27/14601 , H01L27/14632 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to electro optical devices with a reduced filter thinning on the edge pixels and a method for reducing the thinning of filter layers on the pixels closest to the edge of an electro optical device such as a photosensitive chip, as would be used, for example, in a full-color digital copier or scanner. A semiconductor wafer includes a main surface defining a plurality of chip areas and tab regions separated by grooves, wherein the chip areas include inner photosites, outer photosites and bonding pads. A plurality of dams are deposited over the main surface in the tab regions, and a clear layer is deposited over the main surface exclusive of the bonding pads. Alternatively, a clear layer is deposited over the main surface exclusive of the bonding pads, and a plurality of tabs is then deposited in the tab regions on the main surface. A first primary color filter layer is deposited over at least first inner photosite and first outer photosite, and the first primary color filter layer transmits a primary color.
摘要翻译： 本发明涉及在边缘像素上具有减小的滤光器薄化的电光装置，以及用于减少最接近诸如感光芯片的光电装置的边缘的像素上的滤光层的薄化的方法， 例如，在全色数字复印机或扫描仪中。 半导体晶片包括限定由凹槽分开的多个芯片区域和突片区域的主表面，其中所述芯片区域包括内部光斑，外部光电子和键合焊盘。 在突片区域的主表面上沉积多个堤坝，并且在主表面之外沉积清晰层，而不包括粘合垫。 或者，在除了接合焊盘之外的主表面上沉积透明层，然后将多个突片沉积在主表面上的突片区域中。 第一原色滤色器层沉积在至少第一内部光泽和第一外部光泽上，并且第一原色滤色器层透过原色。
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10.发明授权Process for separating image sensor dies and the like from a wafer that minimizes silicon waste 失效用于从使硅废料最小化的晶片分离图像传感器管芯等的工艺
公开(公告)号：US5128282A
公开(公告)日：1992-07-07
申请号：US787445
申请日：1991-11-04
IPC分类号： H01L21/304 , H01L31/18
CPC分类号： H01L21/304 , H01L31/1804 , Y02E10/547
摘要： A process for separating image sensor dies and the like from a wafer in which pairs of separation grooves separating each row of dies are formed in the active side of the wafer, with the tab between each groove pair being substantially equal to the width of the dicing blade, cutting a single bottom groove in the inactive side of the wafer opposite to and spanning each pair of separation grooves, and aligning the dicing blade with the midpoint of the wall of one groove in each pair of grooves so as to cut between the rows of dies. In a second embodiment, a two-pass separation process is enabled in which the tab between separation grooves is slightly larger than the width of the dicing blade, with the dicing blade first aligned with the midpoint of one separation groove to cut one row of dies from the wafer together with part of the tab, with the blade realigned with the midpoint of the other separate groove to cut a second row of dies and the remainder of the tab.
摘要翻译： 用于从晶片分离图像传感器管芯等的工艺，其中在晶片的有源侧形成有分隔每一列管芯的隔离槽对，每个槽对之间的突片基本上等于切割宽度 切割晶片的不活动侧的单个底槽，与每对分隔槽相对并跨越每对分隔槽，并将切割刀片与每对槽中的一个槽的壁的中点对准，以便在行之间切割 的死亡。 在第二实施例中，能够进行双路分离处理，其中分离槽之间的突片略大于切割刀片的宽度，其中切割刀片首先与一个分隔槽的中点对齐，以切割一排模具 从晶片与片的一部分一起，刀片与另一个分开的凹槽的中点重新对准，以切割第二排模具和突片的其余部分。
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