摘要:
Epoxy resin compositions used in preparation of laminates for electronic applications are free of the solvents typically needed in current industrial practice. The use of certain mono-substituted dicyandiamides makes possible the elimination of such solvents since all of the components are soluble in epoxy resin to an extent which provides uniform properties in the cured laminates.
摘要:
This invention relates to an improved, high-yield process for producing cyclic siloxane in a biphasic reaction solvent mixture comprising an alkane, an alcohol and water.
摘要:
The resins resulting from converting dicyclopentadiene-phenol adducts to their corresponding vinylbenzyl ethers are an excellent matrix in which to embed fibers to produce a composite. Such resins, especially as a blend of materials with varying molecular weight distribution, are amorphous materials whose glass transition temperature is well under the curing temperature, and whose solubility permits solutions with high solids content so as to afford coatings with high resin content. The extensively crosslinked polymer resulting from therma, photochemical, or free radical initiated polymerization has excellent thermal and electrical properties for use in multilayer circuit boards.
摘要:
Oligomeric condensation products of certain diketones and phenols can be end-capped with a vinylbenzyl moiety and certain other moieties, especially alkyl groups, to afford thermosetting resins particularly valuable in making laminated circuit boards. Resins prepared by the reaction of 1 molar proportion of diacetylbenzene with from 3.5 to 4.0 molar proportions of phenol and end-capped with from 50 to 100% vinylbenzyl groups with the remainder being alkyls of 1 through 11 carbon atoms are particularly useful.
摘要:
The resins resulting from converting the phenol-formaldehyde type condensation products of dicyclopentadiene-phenol adducts with selected aldehydes and ketones to their corresponding vinylbenzyl ethers are an excellent matrix in which to embed fibers to produce a composite. Such resins, especially as a blend of materials with varying molecular weight distribution, are amorphous materials whose glass transition temperature is well under the curing temperature, and whose solubility permits solutions with high solids content so as to afford coatings with high resin content. The extensively crosslinked polymer resulting from thermal, photochemical, or free radical initiated polymerization has excellent thermal and electrical properties for use in multilayer circuit boards.
摘要:
A curing agent for epoxy resins having improved solubility characteristics has the formula ##STR1## where R is --CH.sub.2 C.sub.6 H.sub.4 X or --CH.sub.2 CH.sub.2 C.sub.6 H.sub.4 X,and X is either --H, --CH.sub.3, --OCH.sub.3, --OH, or --NY,and where Y is --H or CH.sub.3.Such substituted cyanoguanidines are soluble in various solvents and do not require the use of undesirable solvents necessary with cyanoguanidine (dicyanodiamide) itself.
摘要翻译:具有改善的溶解度特性的环氧树脂的固化剂具有式“IMAGE”,其中R是-CH 2 C 6 H 4 X或-CH 2 CH 2 C 6 H 4 X,X是-H,-CH 3,-OCH 3,-OH或-NY,其中Y是 - H或CH3。 这种取代的氰基胍可溶于各种溶剂中,并且不需要使用氰基胍(二氰基二酰胺)本身所需的不需要的溶剂。
摘要:
A two-component bonding agent composition. The composition contains: (a) an isocyanate component comprising a difunctional isocyanate-terminated prepolymer having polymerized residues of at least one difunctional aromatic isocyanate and at least one difunctional polymer of ethylene oxide, propylene oxide or a combination thereof; (b) a polyol component comprising a triglyceride having hydroxyl functional groups; and (c) an adhesion promoter.
摘要:
A predetermined pattern of a dielectric polymer is formed on a substrate from a prepolymer which is an ether of the oligomeric condensation product of a dihydric phenol and formaldehyde having the formula ##STR1##
摘要:
A class of di-ortho-substituted bismaleimides undergo uncatalyzed Michael addition with polyhydric phenols to afford chain-extended bismaleimides having a significantly wider processing window than the non-extended parent. The fully cured resins show improved fracture toughness, generally have comparable or superior dielectric constant and dielectric loss, and show no degradation in other properties such as resistance to moisture, to methylene chloride, and coefficient of thermal expansion.
摘要:
A predetermined pattern of a dielectric polymer is formed on a substrate from a prepolymer which is an ether of the reaction product of a dicyclopentadiene and a phenol.