Integrated bus bar/multilayer ceramic capacitor module
    3.
    发明授权
    Integrated bus bar/multilayer ceramic capacitor module 失效
    集成母线/多层陶瓷电容器模块

    公开(公告)号:US5142439A

    公开(公告)日:1992-08-25

    申请号:US751455

    申请日:1991-08-28

    IPC分类号: H01G4/38 H02M7/00

    CPC分类号: H01G4/38 H02M7/003

    摘要: A high-voltage, low-volume capacitor module, having a minimal amount of inherent stray inductance, and being configured so as to allow its integration into an electrical system in a manner which minimizes any stray inductance introduced by interconnection wiring. This is accomplished by integrating the capacitor into the bus bars of the voltage convertor, thereby eliminating the need for separate interconnecting wiring and reducing the overall amount of stray inductance evident within the system in which the capacitor is employed.

    摘要翻译: 一种高电压,低体积电容器模块,其具有最小量的固有杂散电感,并且被配置为允许以将互连布线引入的任何杂散电感最小化的方式集成到电气系统中。 这通过将电容器集成到电压转换器的母线中来实现,从而不需要单独的互连布线并且减少在使用电容器的系统内明显的杂散电感的总体量。

    Process for manufacturing capacitive devices and capacitive devices
manufactured by the process
    4.
    发明授权
    Process for manufacturing capacitive devices and capacitive devices manufactured by the process 失效
    用于制造由该工艺制造的电容器件和电容器件的工艺

    公开(公告)号:US4733328A

    公开(公告)日:1988-03-22

    申请号:US943526

    申请日:1986-12-18

    申请人: Daniel C. Blazej

    发明人: Daniel C. Blazej

    CPC分类号: H01G4/35 H01G4/06 Y10T29/435

    摘要: This invention relates to a laminated capacitive element for use in electrical devices such as filtered connectors, said element comprising a laminated body of a metal substrate having one or more layered structures heat bonded to all or a portion of the surfaces thereof, said structures comprising a non-conductive layer composed of a sintered finely divided non-conductive material heat bonded to said metal substrate and a metal conductive layer composed of sintered finely divided metal heat bonded to said sintered non-conductive material.

    摘要翻译: 本发明涉及一种用于诸如滤波连接器的电气设备中的层叠电容元件,所述元件包括具有一个或多个分层结构的金属基板的层叠体,该层叠体与其全部或一部分表面热粘合,所述结构包括 由与所述金属基板热合的烧结的细分非导电材料构成的非导电层以及与所述烧结的非导电材料热粘接的烧结细分金属组成的金属导电层。