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公开(公告)号：US5195678A
公开(公告)日：1993-03-23
申请号：US810979
申请日：1991-12-20
CPC分类号： G05D9/02 , F16N19/006 , G05D23/08
摘要： A fluid level control valve has a base with an aperture formed therethrough. A cover is movably disposed over the aperture and is biased by a thermostatic element in a direction tending to close the aperture. The thermostatic element is a generally U-shaped strip having one end mounted on the base with its opposite end biased against the cover. The cover is adapted to pivot about one hinge at temperatures below a selected temperature value and pivot about a second hinge at temperatures above the selected value. A second embodiment particularly adapted to accommodate different flow rates employs a movable first hinge location.
摘要翻译： 一个液位控制阀具有一个底部，其中形成有一个通孔。 盖可移动地设置在孔的上方，并且由趋向于关闭孔的方向由恒温元件偏置。 恒温元件是一般为U形的条，其一端安装在基座上，其相对端抵靠盖。 盖适于在低于所选温度值的温度下围绕一个铰链枢转，并且在高于选定值的温度下围绕第二铰链枢转。 特别适于适应不同流量的第二实施例采用可移动的第一铰链位置。
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公开(公告)号：US6003778A
公开(公告)日：1999-12-21
申请号：US134966
申请日：1998-08-17
CPC分类号： G05D9/04 , F16N19/006 , Y10T428/125
摘要： An oil level control valve (10) has a molded base (12) having an oil receiving aperture (12d) formed through a bottom wall (12e) with a circumscribing generally rectangular cover plate seat in which a cover plate (14) is removably received. A thermostatic element (16) in the form of a generally rectangular sheet is fastened to posts (12f) extending upwardly from sidewalls of the base by means of peg portions (12g, 12h) received through holes in the sheet and heat staked to the posts. The thermostatic element allows the cover plate to move away from the seat for optimum oil flow at low temperature conditions and restricts the valve opening as temperature of the oil increases to accommodate an increase in oil volume due to expansion in order to maintain the fluid level in the main sump of a transmission housing by allowing an increase in the fluid level of an auxiliary sump in accordance with target values for different flow rates. A second embodiment (10') shows the addition of a snap-on bracket (20) for convenient mounting of the control along with an associated installation tab (12k) for handling purposes.
摘要翻译： 油位控制阀（10）具有模制底座（12），该模制底座（12）具有通过底壁（12e）形成的接油孔（12d），该底壁（12e）具有外接的大致矩形的盖板座，盖板（14）可移除地被接收 。 通常由矩形片材形式的恒温元件（16）被固定到通过从片材的侧壁向上延伸的柱子（12f），所述栓子部分（12g，12h）通过孔中的孔被接收并被热定形成柱 。 恒温元件允许盖板远离座椅移动，以在低温条件下实现最佳油流量，并且当油温度升高时限制阀开度，以适应由于膨胀引起的油体积的增加，以便保持流体水平 通过允许根据不同流量的目标值增加辅助油底壳的液面来增加变速器壳体的主油槽。 第二实施例（10'）示出了用于方便地安装控制器以及用于处理目的的相关联的安装突片（12k）的卡扣式支架（20）的添加。
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公开(公告)号：US5209399A
公开(公告)日：1993-05-11
申请号：US897185
申请日：1992-06-11
CPC分类号： G05D23/08 , F16H57/0447 , F16K31/002 , F16N19/006 , F16H57/0409 , F16H57/045 , F16H59/72 , F16N2250/08
摘要： A fluid level control valve has a base with a precisely controlled aperture formed therein which mounts on a transmission oil reservoir. A cover is pivotably disposed over the aperture and is biased by a thermostatic element in a direction tending to close the aperture. The thermostatic element is an elongated flat strip having each end captured by a bracket formed in each end of the base. A calibration post is precisely positioned on the cover to work with the brackets to place the thermostatic element in the desired position to provide a preselected force on the cover. The base has legs extending from the periphery of the controlled aperture for precisely attaching the valve to the housing of the transmission oil reservoir.
摘要翻译： 液位控制阀具有形成在其中的精确控制的孔的底座，其安装在变速箱油箱上。 盖可枢转地设置在孔的上方，并且由沿着倾向于闭合孔的方向的恒温元件偏置。 恒温元件是细长的扁平条带，每个端部由形成在基座的每个端部中的支架捕获。 校准柱精确地定位在盖上以与支架一起工作，以将恒温元件放置在期望的位置以在盖上提供预选力。 基座具有从受控孔的周边延伸的腿，用于将阀精确地附接到变速箱油箱的壳体。
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4.发明授权Circuit system, a composite metal material for use therein, and a method for making the material 失效电路系统，其中使用的复合金属材料及其制造方法
公开(公告)号：US4894293A
公开(公告)日：1990-01-16
申请号：US166290
申请日：1988-03-10
IPC分类号： C22C9/00 , H01B1/02 , H01L23/14 , H01L23/373 , H05K1/05
CPC分类号： H01L23/142 , H01L23/3733 , H01L2224/48227 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , H05K1/05 , Y10T428/12486
摘要： A circuit system has a semiconductor device mounted on a substrate which includes a composite metal material comprising a plurality of discrete elements of ferrous metal material such as an alloy of 36 percent nickel and the balance iron having a relatively low coefficient of thermal expansion, the discrete elements being copper-coated by electroless copper plating or the like and being pressed together and heated for sintering or diffusion-bonding the copper coatings together to form a continuous copper matrix having the discrete elements secured in dispersed relation therein for providing the composite metal material with a coefficient of thermal expansion relatively much lower than that of the copper material, the heating of the coated particles for diffusion bonding thereof being regulated for forming the continuous copper matrix while leaving the copper material of the matrix substantially free of nickel, ferrous or other constituents diffused therein from the discrete elements for providing the composite material with improved thermal conductivity.
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5.发明授权Composite material, a heat-dissipating member using the material in a circuit system, the circuit system 失效复合材料，使用电路系统中的材料的散热构件，电路系统
公开(公告)号：US5050040A
公开(公告)日：1991-09-17
申请号：US520291
申请日：1990-05-07
IPC分类号： H01L23/14 , H01L23/373
CPC分类号： H01L23/142 , H01L23/3733 , H01L2224/32245 , Y10T428/12486
摘要： A novel composite metal material comprises a ferrous metal of relatively low thermal expansion properties and a silver metal substantially free of ferrous constituents having a relatively high thermal conductivity which cooperate in a novel way to provide the composite material with an effective thermal expansion coefficient corresponding to that of various silicon or gallium arsenide semiconductor devices and the like for reliably mounting the devices while also providing paths of high conductivity silver metal extending through the composite material to provide improved heat-dissipation from the semiconductor devices. A circuit system mounts a semiconductor device using the novel composite metal material alone, bonded to other support materials, or formed into a selected shape. In one preferred embodiment, the composite material is used in a novel heat-dissipating member having components of different shape which are bonded together. One component formed of the novel composite material has a selected shape for compactly mounting the semiconductor device and the second component is formed of high thermal conductivity metal and has a different shape particularly adapted to receive heat from the silver paths and to facilitate heat-dissipation from the member.
摘要翻译： 一种新颖的复合金属材料包括具有相对较低热膨胀性能的黑色金属和基本上不含具有相对高热导率的铁成分的银金属，以新颖的方式配合以提供对应于该复合材料的有效热膨胀系数 各种硅或砷化镓半导体器件等用于可靠地安装器件，同时还提供延伸穿过复合材料的高导电性银金属的路径，以提供来自半导体器件的改进的散热。 电路系统使用单独的新型复合金属材料安装半导体器件，结合到其它支撑材料，或形成为选定的形状。 在一个优选实施例中，复合材料用于具有结合在一起的具有不同形状的部件的新型散热构件。 由新型复合材料形成的一个部件具有用于紧凑地安装半导体器件的选定形状，并且第二部件由高导热性金属形成，并且具有不同的形状，特别适合于从银路径接收热量并促进散热 会员
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公开(公告)号：US5039335A
公开(公告)日：1991-08-13
申请号：US260970
申请日：1988-10-21
IPC分类号： H05K7/20 , H01L23/14 , H01L23/373
CPC分类号： H01L23/142 , H01L23/3733 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2224/92247 , Y10T428/12486
摘要： A novel composite metal material comprises a ferrous metal of relatively low thermal expansion properties and a silver metal substantially free of ferrous constituents having a relatively high thermal conductivity which cooperate in a novel way to provide the composite material with an effective thermal expansion coefficient corresponding to that of various silicon or gallium arsenide semiconductor devices and the like for reliably mounting the devices while also providing paths of high conductivity silver metal extending through the composite material to provide improved heat-dissipation from the semiconductor devices. A circuit system mounts a semiconductor device using the novel composite metal material alone, bonded to other support materials, or formed into a selected shape. In one preferred embodiment, the composite material is used in a novel heat-dissipating member having components of different shape which are bonded together. One component formed of the novel composite material has a selected shape for compactly mounting the semiconductor device and the second component is formed of high thermal conductivity metal and has a different shape particularly adapted to receive heat from the silver paths and to facilitate heat-dissipation from the member. Novel methods for making the member and the composite material are shown.
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公开(公告)号：US5126511A
公开(公告)日：1992-06-30
申请号：US640796
申请日：1991-01-14
IPC分类号： H01L21/00
CPC分类号： H01L21/67126 , H01L2224/48091
摘要： A method of forming an enclosure for an electric circuit and the enclosure wherein there is provided a boat of material having a bottom and side wall, placing a material having a substantially higher thermal conductivity and a lower melting point than that of the boat in the boat bottom, heating the material to a temperature above the melting point thereof and below the melting point of the boat to cause the material to flow along the bottom to form a layer of the material thereon and join the layer to the bottom and side wall and removing a sufficient amount of the bottom of said boat to expose the layer. In accordance with a second embodiment, a depression is formed in the bottom, and when the material flows along the bottom, it fills the depression and becomes joined to the bottom. Plural such depressions can be provided. The exterior portion of the bottom is removed to expose the material if the depressions do not extend completely through the bottom. In accordance with a third embodiment, a block of metal with a hole therethrough is provided, and filled with a material having a higher thermal conductivity than the block of metal and a melting point below that of the block of metal. The block of metal with material therein is heated to a temperature between the melting point of the material and the block of metal to fill the hole with the metal and join the metal to the block of material. The block is formed into plural smaller blocks and a side wall and a cover are formed around the filled hole.
摘要翻译： 一种形成用于电路和外壳的外壳的方法，其中提供了具有底壁和侧壁的材料船，将具有比船在船中的导热性更低的熔点的材料放置在船中 底部，将材料加热到高于其熔点并低于船的熔点的温度，以使材料沿着底部流动以在其上形成一层材料，并将该层连接到底部和侧壁并除去 足够量的所述船的底部暴露该层。 根据第二实施例，在底部形成凹陷，并且当材料沿着底部流动时，其填充凹陷并且接合到底部。 可以提供多个这样的凹陷。 如果凹陷不完全穿过底部，则移除底部的外部部分以露出材料。 根据第三实施例，提供具有穿过其中的孔的金属块，并且填充具有比金属块更高的导热性并且熔点低于金属块的熔点的材料。 将其中具有材料的金属块加热到材料的熔点和金属块之间的温度，以用金属填充孔并将金属连接到材料块。 该块形成为多个较小的块，并且在填充孔周围形成侧壁和盖。
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公开(公告)号：US5036584A
公开(公告)日：1991-08-06
申请号：US365631
申请日：1989-06-13
IPC分类号： H01L21/00
CPC分类号： H01L21/67126 , H01L2224/48091 , H01L2224/48247 , Y10T29/49222
摘要： A method of forming an enclosure for an electric circuit and the enclosure wherein there is provided a boat of material having a bottom and side wall, placing a material having a substantially higher thermal conductivity and a lower melting point than that of the boat in the boat bottom, heating the material to a temperature above the melting point thereof and below the melting point of the boat to cause the material to flow along the bottom to form a layer of the material thereon and join the layer to the bottom and side wall and removing a sufficient amount of the bottom of said boat to expose the layer. In accordance with a second embodiment, a depression is formed in the bottom, and when the material flows along the bottom, it fills the depression and become joined to the bottom. Plural such depressions can be provided. The exterior portion of the bottom is removed to expose the material if the depressions do not extend completely through the bottom. In accordance with a third embodiment, a block of metal with a hole therethrough is provided, and filled with a material having a higher thermal conductivity than the block of metal and a melting point below that of the block of metal. The block of metal with material therein is heated to a temperature between the melting point of the material and the block of metal to fill the hole with the metal and join the metal to the block of material. The block is formed into plural smaller blocks and a side wall and a cover are formed around the filled hole.
摘要翻译： 一种形成用于电路和外壳的外壳的方法，其中提供了具有底壁和侧壁的材料船，将具有比船在船中的导热性更低的熔点的材料放置在船中 底部，将材料加热到高于其熔点并低于船的熔点的温度，以使材料沿着底部流动以在其上形成一层材料，并将该层连接到底部和侧壁并除去 足够量的所述船的底部暴露该层。 根据第二实施例，在底部形成凹部，当材料沿着底部流动时，其填充凹陷并且接合到底部。 可以提供多个这样的凹陷。 如果凹陷不完全穿过底部，则移除底部的外部部分以露出材料。 根据第三实施例，提供具有穿过其中的孔的金属块，并且填充具有比金属块更高的导热性并且熔点低于金属块的熔点的材料。 将其中具有材料的金属块加热到材料的熔点和金属块之间的温度，以用金属填充孔并将金属连接到材料块。 该块形成为多个较小的块，并且在填充孔周围形成侧壁和盖。
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公开(公告)号：US5579995A
公开(公告)日：1996-12-03
申请号：US449860
申请日：1995-05-24
CPC分类号： F25B41/062 , B60H1/00485 , G05D23/025
摘要： A flow regulating valve for air conditioning systems is shown in which a body member (26, 26a-26e) is provided with a passageway (28, 28a-28f) which results in regulating flow of refrigerant into the evaporator of the air conditioning system under normal conditions. Under severe operating conditions, e.g., high ambient temperature and low or idle speeds, the system refrigerant pressure rises. This increases pressure in the evaporator and an increase in the saturation temperature of refrigerant in the evaporator. This increase in temperature is sensed by a thermostatic metal element (44, 80, 88) of the regulating valve which moves to increase restriction to the flow of the refrigerant fluid through the valve thereby decreasing pressure of the refrigerant entering the evaporator. In several embodiments the thermostatic metal element is in the form of a helix (44) with one end fixed to the body member and the opposite end attached to a sleeve (38, 38d) in certain embodiments and an end cap (54, 60, 68) in other embodiments to rotate the sleeve or end cap to restrict fluid flow in an auxiliary passage. In other embodiments the thermostatic metal element is a relatively straight strip (80, 88) having one end fixed to the body member and its opposite end, in one embodiment, movable toward and away from an auxiliary inlet port (34) and in another embodiment the opposite end is attached to a block (94) having a relatively smaller effective passage (29e) movable into and out of alignment with a larger passage (31e) to change the effective level of flow restriction.
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公开(公告)号：US5479786A
公开(公告)日：1996-01-02
申请号：US219070
申请日：1994-03-29
CPC分类号： F25B41/062 , B60H1/00485 , G05D23/025
摘要： A flow regulating valve for air conditioning systems is shown in which a body member (26, 26a-26e) is provided with a passageway (28, 28a-28f) which results in regulating flow of refrigerant into the evaporator of the air conditioning system under normal conditions. Under severe operating conditions, e.g., high ambient temperature and low or idle speeds, the system refrigerant pressure rises. This increases pressure in the evaporator and an increase in the saturation temperature of refrigerant in the evaporator. This increase in temperature is sensed by a thermostatic metal element (44, 80, 88) of the regulating valve which moves to increase restriction to the flow of the refrigerant fluid through the valve thereby decreasing pressure of the refrigerant entering the evaporator. In several embodiments the thermostatic metal element is in the form of a helix (44) with one end fixed to the body member and the opposite end attached to a sleeve (38, 38d) in certain embodiments and an end cap (54, 60, 68) in other embodiments to rotate the sleeve or end cap to restrict fluid flow in an auxiliary passage. In other embodiments the thermostatic metal element is a relatively straight strip (80, 88) having one end fixed to the body member and its opposite end, in one embodiment, movable toward and away from an auxiliary inlet port (34) and in another embodiment the opposite end is attached to a block (94) having a relatively smaller effective passage (29e) movable into and out of alignment with a larger passage (31e) to change the effective level of flow restriction.
摘要翻译： 示出了用于空调系统的流量调节阀，其中主体构件（26,26a-26e）设置有通道（28,28a-28f），该通道导致制冷剂流入空调系统的蒸发器中 正常条件 在严苛的操作条件下，例如高环境温度和低或怠速，系统制冷剂压力升高。 这增加了蒸发器中的压力和蒸发器中制冷剂的饱和温度的升高。 由调节阀的恒温金属元件（44,80,88）检测温度的这种升高，该恒温金属元件（44,80,88）移动以增加对通过阀的制冷剂流体的流动的限制，从而降低进入蒸发器的制冷剂的压力。 在几个实施例中，恒温金属元件是螺旋形（44）的形式，其中一端固定到本体构件，并且在某些实施例中相对端连接到套筒（38,38d），端盖（54,60， 在其它实施例中，为了旋转套管或端盖以限制辅助通道中的流体流动。 在其它实施例中，恒温金属元件是相对直的条带（80,88），其一端固定到本体构件及其相对端，在一个实施例中可朝向和远离辅助入口（34）移动，并且在另一实施例中 相对端附接到具有相对较小的有效通道（29e）的块（94），所述有效通道（29e）能够与更大的通道（31e）移动和脱离对准以改变有效的流动限制水平。
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