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公开(公告)号：US06752878B2
公开(公告)日：2004-06-22
申请号：US09956386
申请日：2001-09-19
IPC分类号： C23C2200
摘要： A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous wetting agent composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between layers in multilayer circuit boards.
摘要翻译： 一种用于处理微粗化金属表面以改善金属表面和聚合物材料之间的结合的方法。 该方法包括在用粘附促进组合物形成微粗糙化转化涂覆的金属表面后，用水性润湿剂组合物对微粗糙化转化涂覆的金属表面进行后处理。 该方法可用于电路板工业中以改善多层电路板中的层之间的结合。
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公开(公告)号：US06372055B1
公开(公告)日：2002-04-16
申请号：US09511543
申请日：2000-02-23
IPC分类号： C23C2248
摘要： Disclosed are methods for replenishing adhesion promoting baths from an unstable state without discarding the bath. Methods of adhesion promoting substrates, such as printed wiring boards, using the replenished baths are also disclosed.
摘要翻译： 公开了从不稳定状态补充粘附促进浴的方法，而不排除浴液。 还公开了使用补充浴的粘附促进基材例如印刷线路板的方法。
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3.发明授权Process for treating adhesion promoted metal surfaces with an organo-silcon post-treatment 失效用于处理粘合的方法利用有机硅氧烷后处理促进金属表面公开(公告)号：US06743303B2
公开(公告)日：2004-06-01
申请号：US10003625
申请日：2001-11-02
申请人： Joseph R. Montano , John P. Cahalen
发明人： Joseph R. Montano , John P. Cahalen
IPC分类号： C23C2282
CPC分类号： C09D4/00 , C23C22/08 , C23C22/68 , C23C22/83 , C23C2222/20 , H05K3/383 , H05K3/389 , C08G77/00
摘要： A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous organo-silicon wetting composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. Suitable organo-silicons include organosilanes, organosiloxanes, organosilizanes and the like. The method can be employed in the circuit board industry to improve bonding between layers in multilayer circuit boards.
摘要翻译： 一种用于处理微粗化金属表面以改善金属表面和聚合物材料之间的结合的方法。 该方法包括在用粘合促进组合物形成微粗糙化转化涂覆的金属表面后，用含水有机硅润湿组合物对微粗糙化转化涂覆的金属表面进行后处理。 合适的有机硅包括有机硅烷，有机硅氧烷，有机硅烷等。 该方法可用于电路板工业中以改善多层电路板中的层之间的结合。
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公开(公告)号：US06616976B2
公开(公告)日：2003-09-09
申请号：US09995890
申请日：2001-11-28
IPC分类号： B05D136
CPC分类号： C23C22/83 , B05D7/14 , B05D7/148 , C08L63/00 , C09J5/02 , C09J2400/163 , C09J2463/00 , C23C22/52 , C23F1/18 , H05K3/383 , H05K3/385 , H05K3/386 , H05K3/4626 , H05K2201/0355 , H05K2201/0358 , H05K2203/0759 , H05K2203/0789 , H05K2203/0796 , H05K2203/124
摘要： A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an epoxy resin composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between innerlayers in a multiplayer circuit board.
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公开(公告)号：US06521139B1
公开(公告)日：2003-02-18
申请号：US09632736
申请日：2000-08-04
申请人： Masaki Kondo , Joseph R. Montano
发明人： Masaki Kondo , Joseph R. Montano
IPC分类号： C23F100
CPC分类号： H05K3/383 , C23F1/18 , H05K3/385 , H05K3/4611 , H05K2203/0796 , H05K2203/124
摘要： A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer are disclosed. The composition includes hydrogen peroxide, inorganic acid, at least two corrosion inhibitors.
摘要翻译： 公开了一种用于处理金属表面以增加其表面粗糙度以用于随后粘合到聚合物层的方法和组合物。 该组合物包括过氧化氢，无机酸，至少两种腐蚀抑制剂。
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