公开(公告)号：US20090281381A1

公开(公告)日：2009-11-12

申请号：US12435163

申请日：2009-05-04

Applicant: Tomoya TAKENAKA ,  Masatoshi HOMAN ,  Yasuteru ASAKAWA ,  Jun'ichi KIMURA ,  Susumu FUKUSHIMA ,  Motoyoshi KITAGAWA

Inventor： Tomoya TAKENAKA ,  Masatoshi HOMAN ,  Yasuteru ASAKAWA ,  Jun'ichi KIMURA ,  Susumu FUKUSHIMA ,  Motoyoshi KITAGAWA

IPC: A61B1/04 ,  H01Q9/04

CPC classification number: A61B1/041 ,  A61B1/00016 ,  A61B1/0607 ,  A61B1/0638

Abstract: An antenna to be embedded in a capsule type medical device. The antenna includes an antenna conductor, and a sheet-like antenna substrate which at least partly electrically contacts with the antenna conductor. The antenna is formed by closely attaching the antenna conductor and the sheet-like antenna substrate.

Abstract translation: 嵌入胶囊型医疗装置中的天线。 天线包括天线导体和至少部分地与天线导体电接触的片状天线基板。 天线通过紧密地连接天线导体和片状天线基板而形成。

公开(公告)号：US20120320559A1

公开(公告)日：2012-12-20

申请号：US13587258

申请日：2012-08-16

Applicant: Jun'ichi KIMURA

Inventor： Jun'ichi KIMURA

IPC: H05K9/00

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/1815 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/09972 ,  H01L2924/00

Abstract: A module includes a circuit board, a first and a second circuit block mounted on the top surface of the circuit board, and a first boundary formed between these circuit blocks. The module further includes a first metal piece and a resin part. The first metal piece is mounted on the first boundary. The resin part is provided, on its upper surface, with a first groove in a position corresponding to the first metal piece. The first groove includes a first exposed portion in which the first metal piece is partially exposed from the resin part and is connected to a shielded conductor.

Abstract translation: 模块包括电路板，安装在电路板的顶表面上的第一和第二电路块以及在这些电路块之间形成的第一边界。 该模块还包括第一金属片和树脂部。 第一个金属片安装在第一个边界上。 树脂部分在其上表面上设置有与第一金属片对应的位置的第一凹槽。 第一凹槽包括第一暴露部分，其中第一金属片部分地从树脂部分露出并连接到屏蔽导体。

公开(公告)号：US20120306063A1

公开(公告)日：2012-12-06

申请号：US13587297

申请日：2012-08-16

Applicant: Jun'ichi KIMURA ,  Tomohide Ogura ,  Takayuki Hiruma ,  Misao Kanba ,  Masahisa Nakaguchi ,  Motoyoshi Kitagawa

Inventor： Jun'ichi KIMURA ,  Tomohide Ogura ,  Takayuki Hiruma ,  Misao Kanba ,  Masahisa Nakaguchi ,  Motoyoshi Kitagawa

IPC: H01L21/56 ,  H01L23/28 ,  H01L21/78

CPC classification number: H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00015 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a method of manufacturing a high-frequency module, a resin substrate with a high frequency circuit including an electronic component mounted thereon is placed so that the electronic component faces a resin bath. A resin which is in a non-flowable state in the resin bath is softened until the resin becomes flowable, and air in space formed between the resin substrate and the resin is sucked. The resin substrate is brought into contact with a liquid surface of the resin. The resin is pressurized and allowed to flow into a gap between the resin substrate and the electronic component. The resin is cured so that a resin portion is formed on the resin substrate. A shield metal film is formed on a surface of the resin portion.

Abstract translation: 在制造高频模块的方法中，放置具有安装在其上的电子部件的具有高频电路的树脂基板，使得电子部件面向树脂浴。 在树脂浴中处于不可流动状态的树脂软化直到树脂流动，并且吸入树脂基板和树脂之间形成的空间中的空气。 使树脂基板与树脂的液面接触。 树脂被加压并允许流入树脂基板和电子部件之间的间隙。 树脂固化，使树脂部分形成在树脂基板上。 在树脂部分的表面上形成屏蔽金属膜。