In-vehicle communications apparatus
    1.
    发明申请
    In-vehicle communications apparatus 审中-公开
    车载通信装置

    公开(公告)号:US20100198459A1

    公开(公告)日:2010-08-05

    申请号:US12654474

    申请日:2009-12-22

    IPC分类号: G06F19/00

    CPC分类号: H04W52/267

    摘要: Application data generated by an ECU is wireless transmitted by a transmission device in a subject vehicle so as to periodically change a communications distance by changing, every transmission timing, at least one of (i) a transmission rate, which is used in transforming a transmission packet into a transmission signal in a modulation section, and (ii) a transmission power, which is configured by an amplification section to amplify the transmission signal. As a result, the data transmission from the subject vehicle can be made (i) in high repetition times with respect to a nearby vehicle having a greater risk of collision (i.e., time to collision being shorter), and (ii) in low repetition times with respect to a distant vehicle having a less risk of collision (i.e., time to collision being longer).

    摘要翻译: 由ECU生成的应用数据由本车辆中的发送装置进行无线发送,以通过在每个发送定时改变以下中的至少一个来周期性地改变通信距离:(i)用于变换传输的传输速率 分组到调制部分中的发送信号,以及(ii)发送功率,其由放大部分配置以放大发送信号。 因此,能够以相当于碰撞风险较大的附近车辆(即,碰撞时间较短)的高重复次数(i)进行来自主车辆的数据传输,(ii)以低重复 相对于具有较小碰撞风险的远距离车辆(即,碰撞时间更长)的时间。

    Oxide all-solid-state battery
    2.
    发明授权

    公开(公告)号:US10461337B2

    公开(公告)日:2019-10-29

    申请号:US15903092

    申请日:2018-02-23

    摘要: An oxide all-solid-state battery excellent in lithium ion conductivity and joint strength between an anode active material layer and solid electrolyte layer thereof. In the oxide all-solid-state battery, the solid electrolyte layer is a layer mainly containing a garnet-type oxide solid electrolyte sintered body represented by the following formula (1): (Lix-3y-z, Ey, Hz)LαMβOγ; a solid electrolyte interface layer is disposed between the anode active material layer and the solid electrolyte layer; the solid electrolyte interface layer contains at least a Si element and an O element; and a laminate containing at least the anode active material layer, the solid electrolyte interface layer and the solid electrolyte layer has peaks at positions where 2θ=32.3°±0.5°, 37.6°±0.5°, 43.8°±0.5°, and 57.7°±0.5° in a XRD spectrum obtained by XRD measurement using CuKα irradiation.

    Polishing apparatus and method of reconditioning polishing pad
    4.
    发明授权
    Polishing apparatus and method of reconditioning polishing pad 有权
    抛光装置和修补抛光垫的方法

    公开(公告)号:US07708621B2

    公开(公告)日:2010-05-04

    申请号:US12051156

    申请日:2008-03-19

    申请人: Toshiya Saito

    发明人: Toshiya Saito

    IPC分类号: B24B1/00

    CPC分类号: B24B53/017 B24B47/00

    摘要: This polishing apparatus includes a head that holds a semiconductor wafer, a polishing pad that polishes a surface to be polished of the semiconductor wafer held by the head, and a dresser that reconditions the polishing pad by cutting the polishing pad. The polishing apparatus polishes a surface to be polished of the semiconductor wafer while causing the head and the polishing pad to rotate and reconditions the polishing pad by use of the dresser before and after polishing the surface to be polished. The polishing apparatus of the present invention supports at least two dressers so that the dressers can rotate on their own axes and further includes a dresser oscillator that causes the dressers to oscillate simultaneously on the polishing pad.

    摘要翻译: 该抛光装置包括保持半导体晶片的头部,抛光由头部保持的半导体晶片抛光的表面的抛光垫,以及通过切割抛光垫来重新研磨抛光垫的修整器。 抛光装置在抛光抛光表面之前和之后,通过使用修整器使头部和抛光垫旋转并重新调整抛光垫,抛光半导体晶片的待抛光表面。 本发明的抛光装置支撑至少两个修整器,使得修整器可以在其自身的轴线上旋转,并且还包括修整器振荡器,其使修整器同时在抛光垫上摆动。

    Polishing equipment having a longer operating time length
    5.
    发明申请
    Polishing equipment having a longer operating time length 审中-公开
    抛光设备具有较长的操作时间长度

    公开(公告)号:US20060283839A1

    公开(公告)日:2006-12-21

    申请号:US11455176

    申请日:2006-06-19

    申请人: Toshiya Saito

    发明人: Toshiya Saito

    CPC分类号: B24B37/26

    摘要: A polishing equipment includes a polishing head mounting thereon a wafer and a polishing pad having a polishing surface for polishing the wafer. The polishing surface has a groove for guiding slurry on the polishing surface. The groove has a depth larger in the intermediate area of the polishing surface than in the central area and peripheral area of the polishing surface, in consideration of a higher abrasion rate of the polishing surface in the intermediate area in which the polishing surface is abraded in a larger amount.

    摘要翻译: 抛光设备包括其上安装有晶片的抛光头和具有用于抛光晶片的抛光表面的抛光垫。 抛光表面具有用于在抛光表面上引导浆料的凹槽。 考虑到在抛光表面被磨损的中间区域中的研磨表面的较高的磨耗率,凹槽在抛光表面的中间区域中比在研磨表面的中心区域和周边区域中的深度更大 更大的数量。

    Communication control system with ad hoc wireless communication function
    7.
    发明授权
    Communication control system with ad hoc wireless communication function 有权
    具有无线通信功能的通信控制系统

    公开(公告)号:US08913544B2

    公开(公告)日:2014-12-16

    申请号:US13569272

    申请日:2012-08-08

    摘要: In a communication control apparatus wirelessly communicable with a plurality of wireless communication units respectively installed in a plurality of vehicles, a first determiner determines at least one wireless communication unit in a number of wireless communication units in the plurality of wireless communication units as a first enabling unit that enables wireless communications with the communication control apparatus if information transmitted from the at least one wireless communication unit is second type information including a piece of vehicle information that includes at least the identifier of the corresponding vehicle. A second determiner determines a wireless communication unit in the remaining one or more wireless communication units as a second enabling unit, which enables wireless communications with the communication control apparatus, if information transmitted from the wireless communication unit is not included in the information transmitted from the first enabling unit.

    摘要翻译: 在与分别安装在多个车辆中的多个无线通信单元无线通信的通信控制装置中,第一确定器确定多个无线通信单元中的多个无线通信单元中的至少一个无线通信单元作为第一启用 单元,其能够与通信控制装置进行无线通信,如果从至少一个无线通信单元发送的信息是包括至少包括对应车辆的标识符的车辆信息的第二类型信息。 第二确定器将剩余的一个或多个无线通信单元中的无线通信单元确定为第二启用单元,其能够与通信控制装置进行无线通信,如果从无线通信单元发送的信息不包括在从 第一个启用单元。

    Polishing apparatus including separate retainer rings
    9.
    发明授权
    Polishing apparatus including separate retainer rings 有权
    抛光设备包括单独的固定环

    公开(公告)号:US07662025B2

    公开(公告)日:2010-02-16

    申请号:US12010109

    申请日:2008-01-22

    申请人: Toshiya Saito

    发明人: Toshiya Saito

    IPC分类号: B24B49/00

    CPC分类号: B24B37/32 B24B37/30

    摘要: A polishing apparatus includes a polishing pad for polishing a wafer and a polishing head for holding the wafer. The polishing head includes a retainer ring, a membrane sheet, and a head body. The retainer ring retains the wafer in a horizontal direction. The membrane sheet depresses the wafer to the polishing pad. The head body supports the retainer ring and the membrane sheet. The retainer ring includes a fixed retainer ring and a released retainer ring. The released retainer ring is interposed between the inner periphery of the fixed retainer ring and the periphery of the wafer to retain the wafer in the horizontal direction.

    摘要翻译: 抛光装置包括用于抛光晶片的抛光垫和用于保持晶片的抛光头。 抛光头包括保持环,膜片和头体。 保持环将晶片保持在水平方向。 膜片将晶片压下到抛光垫。 头部主体支撑保持环和膜片。 保持环包括固定的保持环和释放的保持环。 释放的保持环插入在固定保持环的内周和晶片周边之间,以将晶片保持在水平方向。

    Polishing device
    10.
    发明申请
    Polishing device 有权
    抛光装置

    公开(公告)号:US20070270089A1

    公开(公告)日:2007-11-22

    申请号:US11798524

    申请日:2007-05-15

    申请人: Toshiya Saito

    发明人: Toshiya Saito

    IPC分类号: B24B29/00

    CPC分类号: B24B37/30

    摘要: A polishing device includes a polishing pad for polishing a wafer and a polishing head for holding the wafer. The polishing head has a retainer ring for retaining the wafer in the in-plane direction of the wafer, a membrane sheet for pressing the wafer against the polishing pad, and a head body for supporting the retainer ring and the membrane sheet. The retainer ring has a subordinate retainer member having a ring portion and a plurality of fins extending from the ring portion to retain the peripheral surface of the wafer. The subordinate retainer member has a thickness equal to the thickness of the wafer. The membrane sheet has a diameter larger than the wafer, and presses the wafer and the vicinity of the inner edge of the subordinate retainer member.

    摘要翻译: 抛光装置包括用于抛光晶片的抛光垫和用于保持晶片的抛光头。 抛光头具有用于将晶片保持在晶片的面内方向的保持环,用于将晶片压靠在抛光垫上的膜片,以及用于支撑保持环和膜片的头本体。 保持环具有从下部保持构件,其具有环部分和从环部延伸以保持晶片的周边表面的多个翅片。 从属保持构件的厚度等于晶片的厚度。 膜片的直径大于晶片,并且压迫晶片和从属保持器构件的内边缘附近。