Semiconductor active matrix circuit
    1.
    发明授权
    Semiconductor active matrix circuit 失效
    半导体有源矩阵电路

    公开(公告)号:US5789762A

    公开(公告)日:1998-08-04

    申请号:US526935

    申请日:1995-09-12

    CPC分类号: H01L27/1214

    摘要: It is intended to provide a semiconductor circuit including thin-film transistors (TFTs) having a small leak current and TFTs capable of operating at high speed, and a method for manufacturing such a circuit. A material containing a catalyst element is selectively formed so as to be in close contact with an amorphous silicon film, or a catalyst element is selectively introduced into an amorphous silicon film. The amorphous silicon film thus processed is crystallized by illumination with laser light or strong light equivalent to it. A crystalline silicon area with a small amount of catalyst element is used for TFTs in a pixel circuit and a crystalline silicon area with a large amount of catalyst element is used for TFTs in peripheral circuits of an active matrix circuit.

    摘要翻译: 旨在提供一种具有漏电流小的薄膜晶体管(TFT)和能够高速工作的TFT的半导体电路及其制造方法。 选择性地形成含有催化剂元素的材料以与非晶硅膜紧密接触,或者将催化剂元素选择性地引入到非晶硅膜中。 这样处理的非晶硅膜通过照射激光或相当于其的强光而结晶。 具有少量催化剂元素的晶体硅区域用于像素电路中的TFT,并且具有大量催化剂元素的晶体硅区域用于有源矩阵电路的外围电路中的TFT。

    Method of crystallizing a silicon film
    2.
    发明授权
    Method of crystallizing a silicon film 失效
    硅膜结晶方法

    公开(公告)号:US5851862A

    公开(公告)日:1998-12-22

    申请号:US839940

    申请日:1997-04-18

    CPC分类号: H01L21/2026 H01L27/1214

    摘要: A film having a high thermal conductivity material such as aluminum nitride is formed on a substrate, and then a silicon film is formed. When a laser light or an intense light corresponding to the laser light is irradiated to the silicon film, since the aluminum nitride film absorbs heat, a portion of the silicon film near the aluminum nitride film is solidified immediately. However, since a solidifying speed is slow in another portion of the silicon film, crystallization progresses from the portion near the aluminum nitride film. When a substrate temperature is 400.degree. C. or higher at laser irradiation, since a solidifying speed is decreased, a crystallinity of the silicon film is increased. Also, when the substrate is thin, the crystallinity of the silicon film is increased.

    摘要翻译: 在基板上形成具有高导热性的材料如氮化铝的膜,然后形成硅膜。 当激光或与激光对应的强光照射到硅膜时,由于氮化铝膜吸收热量,所以在氮化铝膜附近的一部分硅膜立即固化。 然而,由于硅膜的另一部分的固化速度慢,所以结晶从氮化铝膜附近的部分进行。 当激光照射下的基板温度为400℃以上时,由于凝固速度降低,因此硅膜的结晶性提高。 此外,当基板薄时,硅膜的结晶度增加。

    Semiconductor device and method for producing the same
    3.
    发明授权
    Semiconductor device and method for producing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US6133583A

    公开(公告)日:2000-10-17

    申请号:US176898

    申请日:1998-10-22

    CPC分类号: H01L21/2026 H01L27/1214

    摘要: A film having a high thermal conductivity material such as aluminum nitride is formed on a substrate, and then a silicon film is formed. When a laser light or an intense light corresponding to the laser light is irradiated to the silicon film, since the aluminum nitride film absorbs heat, a portion of the silicon film near the aluminum nitride film is solidified immediately. However, since a solidifying speed is slow in another portion of the silicon film, crystallization progresses from the portion near the aluminum nitride film. When a substrate temperature is 400.degree. C. or higher at laser irradiation, since a solidifying speed is decreased, a crystallinity of the silicon film is increased. Also, when the substrate is thin, the crystallinity of the silicon film is increased.

    摘要翻译: 在基板上形成具有高导热性的材料如氮化铝的膜,然后形成硅膜。 当激光或与激光对应的强光照射到硅膜时,由于氮化铝膜吸收热量,所以在氮化铝膜附近的一部分硅膜立即固化。 然而,由于硅膜的另一部分的固化速度慢,所以结晶从氮化铝膜附近的部分进行。 当激光照射下的基板温度为400℃以上时,由于凝固速度降低,因此硅膜的结晶性提高。 此外,当基板薄时,硅膜的结晶度增加。

    Method for producing semiconductor device
    4.
    发明授权
    Method for producing semiconductor device 失效
    半导体器件的制造方法

    公开(公告)号:US06700133B1

    公开(公告)日:2004-03-02

    申请号:US09664352

    申请日:2000-09-18

    IPC分类号: H01L2976

    摘要: A film having a high thermal conductivity material such as aluminum nitride is formed on a substrate, and then a silicon film is formed. When a laser light or an intense light corresponding to the laser light is irradiated to the silicon film, since the aluminum nitride film absorbs heat, a portion of the silicon film near the aluminum nitride film is solidified immediately. However, since a solidifying speed is slow in another portion of the silicon film, crystallization progresses from the portion near the aluminum nitride film. When a substrate temperature is 400° C. or higher at laser irradiation, since a solidifying speed is decreased, a crystallinity of the silicon film is increased. Also, when the substrate is thin, the crystallinity of the silicon film is increased.

    摘要翻译: 在基板上形成具有高导热性的材料如氮化铝的膜,然后形成硅膜。 当激光或与激光对应的强光照射到硅膜时,由于氮化铝膜吸收热量,所以在氮化铝膜附近的一部分硅膜立即固化。 然而,由于硅膜的另一部分的固化速度慢,所以结晶从氮化铝膜附近的部分进行。 当激光照射下的基板温度为400℃以上时,由于凝固速度降低,因此硅膜的结晶性提高。 此外,当基板薄时,硅膜的结晶度增加。

    Semiconductor thin film and semiconductor device
    5.
    发明授权
    Semiconductor thin film and semiconductor device 失效
    半导体薄膜和半导体器件

    公开(公告)号:US06452211B1

    公开(公告)日:2002-09-17

    申请号:US09095027

    申请日:1998-06-09

    IPC分类号: H01L2904

    摘要: A semiconductor thin film having extremely superior crystallinity and a semiconductor device using the semiconductor thin film having high performance are provided. The semiconductor thin film is manufactured in such a manner that after an amorphous semiconductor thin film is crystallized by using a catalytic element, a heat treatment is carried out in an atmosphere containing a halogen element to remove the catalytic element. The thus obtained crystalline semiconductor thin film has substantially {110} orientation. The concentration of C, N, and S remaining in the final semiconductor thin film is less than 5×1018 atoms/cm3, and the concentration of O is less than 1.5×1019 atoms/cm3.

    摘要翻译: 提供了具有非常优异的结晶度的半导体薄膜和使用具有高性能的半导体薄膜的半导体器件。 制造半导体薄膜,使得在通过使用催化剂元素使无定形半导体薄膜结晶之后,在含有卤素元素的气氛中进行热处理以除去催化元素。 由此获得的晶体半导体薄膜基本上具有{110}取向。 残留在最终半导体薄膜中的C,N和S的浓度小于5×1018原子/ cm3,O的浓度小于1.5×1019原子/ cm3。

    Semiconductor thin film and semiconductor device
    6.
    发明授权
    Semiconductor thin film and semiconductor device 有权
    半导体薄膜和半导体器件

    公开(公告)号:US06693300B2

    公开(公告)日:2004-02-17

    申请号:US10227407

    申请日:2002-08-26

    IPC分类号: H01L2976

    摘要: A semiconductor thin film having extremely superior crystallinity and a semiconductor device using the semiconductor thin film having high performance are provided. The semiconductor thin film is manufactured in such a manner that after an amorphous semiconductor thin film is crystallized by using a catalytic element, a heat treatment is carried out in an atmosphere containing a halogen element to remove the catalytic element. The thus obtained crystalline semiconductor thin film has substantially {110} orientation. The concentration of C, N, and S remaining in the final semiconductor thin film is less than 5×1018 atoms/cm3, and the concentration of O is less than 1.5×1019 atoms/cm3.

    摘要翻译: 提供了具有非常优异的结晶度的半导体薄膜和使用具有高性能的半导体薄膜的半导体器件。 制造半导体薄膜,使得在通过使用催化剂元素使无定形半导体薄膜结晶之后,在含有卤素元素的气氛中进行热处理以除去催化元素。 由此获得的晶体半导体薄膜基本上具有{110}取向。 残留在最终半导体薄膜中的C,N和S的浓度小于5×10 18原子/ cm 3,O的浓度小于1.5×10 19原子/ cm 3。