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公开(公告)号：US20130076570A1
公开(公告)日：2013-03-28
申请号：US13334966
申请日：2011-12-22
IPC分类号： H01Q1/38
CPC分类号： H01Q9/045 , H01L2224/16227 , H01L2224/16235 , H01L2924/15192 , H01L2924/19106 , H01Q21/065
摘要： There is provided an RF module performing radio communications and allowing for a significantly reduced distance between an antenna and a semiconductor chip. To this end, the RF module includes a semiconductor chip; and a substrate including an anntenna unit formed by a circuit pattern thereon, and having a surface on which the semiconductor chip is mounted to be electrically connected to the antenna unit.
摘要翻译： 提供了RF模块执行无线电通信并且允许天线和半导体芯片之间的距离显着减小。 为此，RF模块包括半导体芯片; 以及包括由其上的电路图案形成的天线单元的基板，并且具有安装半导体芯片以与天线单元电连接的表面。
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公开(公告)号：US20130084904A1
公开(公告)日：2013-04-04
申请号：US13331631
申请日：2011-12-20
申请人： Joun Sup Park , Myeong Woo Han
发明人： Joun Sup Park , Myeong Woo Han
IPC分类号： H04W84/12
CPC分类号： H04W28/22
摘要： There are provided an apparatus and a method for super high-speed wireless communications. The apparatus includes a signal processor transmitting data to be transmitted through a predetermined super high-speed communications network when the super high-speed communications network is connected and transmitting data to be transmitted through a predetermined high-speed communications network when the super high-speed communications network is disconnected; a super high-speed wireless communications unit converting the data transmitted from the signal processor to a super high-speed wireless signal suitable for transmission through the super high-speed communications network; and a high-speed wireless communications unit converting the data transmitted from the signal processor to a high-speed wireless signal suitable for transmission through the high-speed communications network.
摘要翻译： 提供了一种用于超高速无线通信的装置和方法。 该装置包括信号处理器，当超高速通信网络连接时，通过预定的超高速通信网络发送要发送的数据，并且当超高速通信网络超高速通信网络发送要通过预定的高速通信网络发送的数据时 通信网络断开; 超高速无线通信单元将从信号处理器发送的数据转换为适合于通过超高速通信网络传输的超高速无线信号; 以及高速无线通信单元，将从信号处理器发送的数据转换成适合于通过高速通信网络传输的高速无线信号。
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公开(公告)号：US08849345B2
公开(公告)日：2014-09-30
申请号：US13331631
申请日：2011-12-20
申请人： Joun Sup Park , Myeong Woo Han
发明人： Joun Sup Park , Myeong Woo Han
CPC分类号： H04W28/22
摘要： There are provided an apparatus and a method for super high-speed wireless communications. The apparatus includes a signal processor transmitting data to be transmitted through a predetermined super high-speed communications network when the super high-speed communications network is connected and transmitting data to be transmitted through a predetermined high-speed communications network when the super high-speed communications network is disconnected; a super high-speed wireless communications unit converting the data transmitted from the signal processor to a super high-speed wireless signal suitable for transmission through the super high-speed communications network; and a high-speed wireless communications unit converting the data transmitted from the signal processor to a high-speed wireless signal suitable for transmission through the high-speed communications network.
摘要翻译： 提供了一种用于超高速无线通信的装置和方法。 该装置包括信号处理器，当超高速通信网络连接时，通过预定的超高速通信网络发送要发送的数据，并且当超高速通信网络超高速通信网络发送要通过预定的高速通信网络发送的数据时 通信网络断开; 超高速无线通信单元将从信号处理器发送的数据转换为适合于通过超高速通信网络传输的超高速无线信号; 以及高速无线通信单元，将从信号处理器发送的数据转换成适合于通过高速通信网络传输的高速无线信号。
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4.发明授权Semiconductor device package with integrated antenna for wireless applications 有权具有集成天线的半导体器件封装，用于无线应用公开(公告)号：US09245858B2
公开(公告)日：2016-01-26
申请号：US13238622
申请日：2011-09-21
申请人： Myeong Woo Han , Do Jae Yoo , Jung Aun Lee , Jung Ho Yoon , Chul Gyun Park
发明人： Myeong Woo Han , Do Jae Yoo , Jung Aun Lee , Jung Ho Yoon , Chul Gyun Park
IPC分类号： H01L31/0203 , H01L33/52 , H01L31/18 , H01L23/66 , H01L23/31 , H01L21/56 , H01L23/00 , H01Q1/22 , H01Q23/00 , H01Q5/40
CPC分类号： H01L23/66 , H01L21/4853 , H01L21/56 , H01L21/561 , H01L21/78 , H01L23/3121 , H01L24/24 , H01L24/73 , H01L24/82 , H01L24/97 , H01L2223/6677 , H01L2223/6683 , H01L2224/48091 , H01L2924/01029 , H01L2924/15787 , H01L2924/181 , H01Q1/2283 , H01Q5/40 , H01Q23/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip.
摘要翻译： 半导体器件封装设有用于无线应用的集成天线。 半导体器件封装包括其上安装有半导体芯片的衬底; 覆盖半导体芯片的保护层; 安装在保护层上的金属图案; 以及连接半导体芯片和金属图案的第一连接构件。 根据该结构，半导体器件封装能够容易地制造，同时最小化用作天线的金属图案与半导体芯片之间的电距离。
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公开(公告)号：US08736031B2
公开(公告)日：2014-05-27
申请号：US13200406
申请日：2011-09-23
申请人： Jung Aun Lee , Myeong Woo Han , Do Jae Yoo , Chul Gyun Park
发明人： Jung Aun Lee , Myeong Woo Han , Do Jae Yoo , Chul Gyun Park
IPC分类号： H01L23/552
CPC分类号： H01L23/66 , H01L23/3121 , H01L2223/6677 , H01L2224/48195 , H01L2224/48227 , H01L2924/3025 , H01Q1/2283 , H01Q9/0414 , H01L2924/00
摘要： There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.
摘要翻译： 提供了一种半导体封装，更具体地说，提供一种包括嵌入在其内部的天线的半导体封装。 半导体封装包括：半导体芯片; 主天线，其设置成与半导体芯片相邻并与其电连接; 密封半导体芯片和主天线的密封部; 以及形成在密封部分的外表面上并且连接到主天线的辅助天线。
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公开(公告)号：US09397403B2
公开(公告)日：2016-07-19
申请号：US13333398
申请日：2011-12-21
申请人： Myeong Woo Han , Jung Aun Lee
发明人： Myeong Woo Han , Jung Aun Lee
摘要： There is provided a dipole antenna. The dipole antenna according to embodiments of the present invention includes: a substrate having a predetermined dielectric constant; and an antenna unit including at least one pair of electrodes and feed lines disposed on one surface of the substrate, wherein the electrodes receive current through the feed lines to generate a signal radiated in a direction in parallel with the one surface of the substrate.
摘要翻译： 提供偶极子天线。 根据本发明的实施例的偶极天线包括：具有预定介电常数的衬底; 以及天线单元，其包括设置在所述基板的一个表面上的至少一对电极和馈电线，其中所述电极接收通过所述馈电线的电流，以产生沿与所述衬底的所述一个表面平行的方向辐射的信号。
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公开(公告)号：US20130169376A1
公开(公告)日：2013-07-04
申请号：US13420267
申请日：2012-03-14
申请人： Myeong Woo Han , Jung Aun Lee , Kook Joo Lee , Moonil Kim
发明人： Myeong Woo Han , Jung Aun Lee , Kook Joo Lee , Moonil Kim
IPC分类号： H01P5/10
CPC分类号： H01P5/10
摘要： There is provided a differential mode amplifier driving circuit, including: a first port having one end connected to a single signal; a second port having one end connected to a differential signal; a first transmission line having one end grounded; and a third port having one end connected to the first transmission line and the other end connected to the differential signal.
摘要翻译： 提供了一种差模放大器驱动电路，包括：第一端口，其一端连接到单个信号; 第二端口，其一端连接到差分信号; 一端接地的第一传输线; 以及第三端口，其一端连接到第一传输线，另一端连接到差分信号。
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公开(公告)号：US20130127669A1
公开(公告)日：2013-05-23
申请号：US13362776
申请日：2012-01-31
申请人： Myeong Woo Han , Jung Aun Lee , Nam Heung Kim
发明人： Myeong Woo Han , Jung Aun Lee , Nam Heung Kim
IPC分类号： H01Q9/04
CPC分类号： H01Q9/0485
摘要： There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.
摘要翻译： 提供一种电介质天线，包括：多层基板，其具有形成在其预定表面的至少一部分中的开口; 插入所述多层基板中的电介质腔，以通过所述开口辐射电磁波信号; 馈电线馈送电介质腔; 以及至少一个金属图案，其形成在介电腔的内部或其表面上，从而与馈电线电磁耦合。
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公开(公告)号：US20130015563A1
公开(公告)日：2013-01-17
申请号：US13200406
申请日：2011-09-23
申请人： Jung Aun Lee , Myeong Woo Han , Do Jae Yoo , Chul Gyun Park
发明人： Jung Aun Lee , Myeong Woo Han , Do Jae Yoo , Chul Gyun Park
IPC分类号： H01L23/552
CPC分类号： H01L23/66 , H01L23/3121 , H01L2223/6677 , H01L2224/48195 , H01L2224/48227 , H01L2924/3025 , H01Q1/2283 , H01Q9/0414 , H01L2924/00
摘要： There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.
摘要翻译： 提供了一种半导体封装，更具体地说，提供一种包括嵌入在其内部的天线的半导体封装。 半导体封装包括：半导体芯片; 主天线，其设置成与半导体芯片相邻并与其电连接; 密封半导体芯片和主天线的密封部; 以及形成在密封部分的外表面上并且连接到主天线的辅助天线。
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公开(公告)号：US09184505B2
公开(公告)日：2015-11-10
申请号：US13362776
申请日：2012-01-31
申请人： Myeong Woo Han , Jung Aun Lee , Nam Heung Kim
发明人： Myeong Woo Han , Jung Aun Lee , Nam Heung Kim
IPC分类号： H01Q9/04
CPC分类号： H01Q9/0485
摘要： There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.
摘要翻译： 提供一种电介质天线，包括：多层基板，其具有形成在其预定表面的至少一部分中的开口; 插入所述多层基板中的电介质腔，以通过所述开口辐射电磁波信号; 馈电线馈送电介质腔; 以及至少一个金属图案，其形成在介电腔的内部或其表面上，从而与馈电线电磁耦合。
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