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公开(公告)号：US09704649B2
公开(公告)日：2017-07-11
申请号：US13105926
申请日：2011-05-12
申请人： Junichi Saito , Toshihiko Kobayashi , Makoto Ogawa , Akihiro Motoki , Kenichi Kawasaki , Tatsuo Kunishi
发明人： Junichi Saito , Toshihiko Kobayashi , Makoto Ogawa , Akihiro Motoki , Kenichi Kawasaki , Tatsuo Kunishi
摘要： In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.
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公开(公告)号：US07589952B2
公开(公告)日：2009-09-15
申请号：US12109371
申请日：2008-04-25
IPC分类号： H01G4/228
CPC分类号： H01G4/2325 , H01G4/30 , Y10T29/435
摘要： A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.
摘要翻译： 例如，多层电子器件包括层压体和形成在层叠体的端面上的外部电极，该多个电子器件在层叠体的端面附着有多个粒径为1μm以上的导电粒子之后， 通过喷砂法或刷子抛光法。 外部电极由通过电镀或无电镀形成的电镀膜限定。
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3.发明授权公开(公告)号：US08102640B2
公开(公告)日：2012-01-24
申请号：US12405405
申请日：2009-03-17
CPC分类号： H01G4/005 , H01G4/12 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A monolithic ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes extending between the ceramic layers and also includes external electrodes disposed on the laminate. The internal electrodes are partly exposed at surfaces of the laminate and are electrically connected to each other with the external electrodes. The external electrodes include first plating layers and second plating layers. The first plating layers are in direct contact with the internal electrodes. The second plating layers are located outside the first plating layers and contain glass particles dispersed therein.
摘要翻译： 单片陶瓷电子部件包括层压体，其包括多个层叠的陶瓷层和在陶瓷层之间延伸的多个内部电极，并且还包括设置在层叠体上的外部电极。 内部电极部分地暴露在层压体的表面处并且与外部电极彼此电连接。 外部电极包括第一镀层和第二镀层。 第一镀层与内部电极直接接触。 第二镀层位于第一镀层的外侧，并含有分散在其中的玻璃粒子。
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公开(公告)号：US08315036B2
公开(公告)日：2012-11-20
申请号：US12405399
申请日：2009-03-17
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12 , H01G4/232 , Y10T29/435
摘要： A ceramic electronic component includes a ceramic body and a plurality of external electrodes disposed at a surface of the ceramic body. The external electrodes include a plating layer containing glass particles each coated with a metal film. The plating layer is formed by co-deposition of a plating metal and the metal-coated glass particles.
摘要翻译： 陶瓷电子部件包括陶瓷体和设置在陶瓷体的表面的多个外部电极。 外部电极包括含有各自涂覆有金属膜的玻璃颗粒的镀层。 镀层通过电镀金属和金属涂覆的玻璃颗粒的共沉积形成。
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公开(公告)号：US08400754B2
公开(公告)日：2013-03-19
申请号：US12631924
申请日：2009-12-07
CPC分类号： H01G4/00 , C23C18/1632 , C23C18/1657 , C23C18/31 , C25D1/00 , C25D1/10 , H01G4/232 , H01G4/30 , H01G13/006 , Y10T29/43
摘要： A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.
摘要翻译： 陶瓷电容器的制造方法使陶瓷元件体芯片的至少一部分的表面与预先形成在模具部件中的镀层接触，并对陶瓷元件体芯片进行热处理 从而在陶瓷元件主体芯片的至少一部分的表面上形成由镀层形成的外部导体层。 因此，陶瓷电子部件的制造方法和装置精确而精确地控制外部导体层的厚度小，并且容易控制外部导体层的长度。
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公开(公告)号：US20090049679A1
公开(公告)日：2009-02-26
申请号：US11909736
申请日：2006-02-01
IPC分类号： H01M4/00
CPC分类号： C25D5/54 , C25D3/30 , C25D11/34 , H01G4/005 , H01G4/1227 , H01G13/00 , Y10T29/42 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/4902
摘要： A method for manufacturing a ceramic electronic component having excellent solderability is provided. In this method, the elution of barium from the ceramic electronic component and the adhesion of ceramic electronic components in tin plating are reduced. The method for manufacturing a ceramic electronic component includes the steps of providing an electronic component of barium-containing ceramic and forming an electrode on the outer surface of the electronic component, the electrode being electroplated with tin. In this method, a plating bath used in the tin plating has a tin ion concentration A in the range of 0.03 to 0.51 mol/L, a sulfate ion concentration B in the range of 0.005 to 0.31 mol/L, a molar ratio B/A of less than one, and a pH in the range of 6.1 to 10.5.
摘要翻译： 提供了具有优异的可焊性的陶瓷电子部件的制造方法。 在该方法中，钡从陶瓷电子部件的洗脱以及陶瓷电子部件在镀锡中的粘附性降低。 制造陶瓷电子部件的方法包括以下步骤：提供含钡陶瓷的电子部件，并在电子部件的外表面上形成电极，电极用锡电镀。 在该方法中，镀锡中使用的镀浴的锡离子浓度A为0.03〜0.51mol / L，硫酸根离子浓度B为0.005〜0.31mol / L，摩尔比B / A小于1，pH范围为6.1至10.5。
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公开(公告)号：US20080123249A1
公开(公告)日：2008-05-29
申请号：US12030360
申请日：2008-02-13
申请人： Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
发明人： Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/2325 , Y10T29/435
摘要： A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 μm or less when measured along the thickness direction of an insulator layer, and a withdrawn-depth of the internal electrodes is about 1 μm or less when measured from the end surface. In a step of electroless plating, plating deposits formed at the end portions of the plurality of internal electrodes are increased in size so as to be connected to each other.
摘要翻译： 制备层叠体，其中在内部电极暴露的端面处，相邻设置的内部电极彼此电隔离，并且沿着沿着所述内部电极的测量沿相邻设置的内部电极之间的距离为约20mum以下 绝缘体层的厚度方向，从端面测定时，内部电极的取出深度为1μm以下。 在化学镀的步骤中，形成在多个内部电极的端部的电镀沉积物的尺寸增加以彼此连接。
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公开(公告)号：US07765661B2
公开(公告)日：2010-08-03
申请号：US11909736
申请日：2006-02-01
CPC分类号： C25D5/54 , C25D3/30 , C25D11/34 , H01G4/005 , H01G4/1227 , H01G13/00 , Y10T29/42 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/4902
摘要： A method for manufacturing a ceramic electronic component having excellent solderability is provided. In this method, the elution of barium from the ceramic electronic component and the adhesion of ceramic electronic components in tin plating are reduced. The method for manufacturing a ceramic electronic component includes the steps of providing an electronic component of barium-containing ceramic and forming an electrode on the outer surface of the electronic component, the electrode being electroplated with tin. In this method, a plating bath used in the tin plating has a tin ion concentration A in the range of 0.03 to 0.51 mol/L, a sulfate ion concentration B in the range of 0.005 to 0.31 mol/L, a molar ratio B/A of less than one, and a pH in the range of 6.1 to 10.5.
摘要翻译： 提供了具有优异的可焊性的陶瓷电子部件的制造方法。 在该方法中，钡从陶瓷电子部件的洗脱以及陶瓷电子部件在镀锡中的粘附性降低。 制造陶瓷电子部件的方法包括以下步骤：提供含钡陶瓷的电子部件，并在电子部件的外表面上形成电极，电极用锡电镀。 在该方法中，镀锡中使用的镀浴的锡离子浓度A为0.03〜0.51mol / L，硫酸根离子浓度B为0.005〜0.31mol / L，摩尔比B / A小于1，pH范围为6.1至10.5。
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公开(公告)号：US07719819B2
公开(公告)日：2010-05-18
申请号：US12043225
申请日：2008-03-06
申请人： Akihiro Motoki , Makoto Ogawa , Tatsuo Kunishi , Jun Nishikawa , Yoshihiko Takano , Shigeyuki Kuroda
发明人： Akihiro Motoki , Makoto Ogawa , Tatsuo Kunishi , Jun Nishikawa , Yoshihiko Takano , Shigeyuki Kuroda
CPC分类号： H01G4/30 , H01G4/0085 , H01G4/012 , H01G4/232 , Y10T29/435
摘要： A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.
摘要翻译： 进行层叠电子部件的制造方法，使得将防水剂施加到内部电极的端部露出的端面，以在绝缘层和内部电极之间的界面填充空间。 接着，进行研磨工序，使内部电极在端面充分露出，从其中除去多余的防水剂，使得能够在端面上直接形成镀膜。
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公开(公告)号：US07589951B2
公开(公告)日：2009-09-15
申请号：US12030360
申请日：2008-02-13
申请人： Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
发明人： Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/2325 , Y10T29/435
摘要： A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 μm or less when measured along the thickness direction of an insulator layer, and a withdrawn-depth of the internal electrodes is about 1 μm or less when measured from the end surface. In a step of electroless plating, plating deposits formed at the end portions of the plurality of internal electrodes are increased in size so as to be connected to each other.
摘要翻译： 制备层叠体，其中在内部电极暴露的端面处，相邻设置的内部电极彼此电隔离，并且沿着沿着所述内部电极的测量沿相邻设置的内部电极之间的距离为约20mum以下 绝缘体层的厚度方向，从端面测定时，内部电极的取出深度为1μm以下。 在化学镀的步骤中，形成在多个内部电极的端部的电镀沉积物的尺寸增加以彼此连接。
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