-
1.发明授权公开(公告)号：US08102640B2
公开(公告)日：2012-01-24
申请号：US12405405
申请日：2009-03-17
CPC分类号： H01G4/005 , H01G4/12 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A monolithic ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes extending between the ceramic layers and also includes external electrodes disposed on the laminate. The internal electrodes are partly exposed at surfaces of the laminate and are electrically connected to each other with the external electrodes. The external electrodes include first plating layers and second plating layers. The first plating layers are in direct contact with the internal electrodes. The second plating layers are located outside the first plating layers and contain glass particles dispersed therein.
摘要翻译： 单片陶瓷电子部件包括层压体，其包括多个层叠的陶瓷层和在陶瓷层之间延伸的多个内部电极，并且还包括设置在层叠体上的外部电极。 内部电极部分地暴露在层压体的表面处并且与外部电极彼此电连接。 外部电极包括第一镀层和第二镀层。 第一镀层与内部电极直接接触。 第二镀层位于第一镀层的外侧，并含有分散在其中的玻璃粒子。
-
公开(公告)号：US07589952B2
公开(公告)日：2009-09-15
申请号：US12109371
申请日：2008-04-25
IPC分类号： H01G4/228
CPC分类号： H01G4/2325 , H01G4/30 , Y10T29/435
摘要： A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.
摘要翻译： 例如，多层电子器件包括层压体和形成在层叠体的端面上的外部电极，该多个电子器件在层叠体的端面附着有多个粒径为1μm以上的导电粒子之后， 通过喷砂法或刷子抛光法。 外部电极由通过电镀或无电镀形成的电镀膜限定。
-
公开(公告)号：US09704649B2
公开(公告)日：2017-07-11
申请号：US13105926
申请日：2011-05-12
申请人： Junichi Saito , Toshihiko Kobayashi , Makoto Ogawa , Akihiro Motoki , Kenichi Kawasaki , Tatsuo Kunishi
发明人： Junichi Saito , Toshihiko Kobayashi , Makoto Ogawa , Akihiro Motoki , Kenichi Kawasaki , Tatsuo Kunishi
摘要： In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.
-
公开(公告)号：US08730646B2
公开(公告)日：2014-05-20
申请号：US12466435
申请日：2009-05-15
摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
摘要翻译： 层叠电子部件包括外部端子电极，其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜，下部电镀膜通过直接电镀电子部件主体的外表面而形成，使得下部电镀膜为电气 连接到内部导体的暴露部分。 外部端子电极还可以包括形成在下部镀膜上的上部镀膜，上部镀膜由一层或多层限定。 限定上镀膜的金属粒子的平均粒径可以为0.5μm以下。 限定下镀层的金属颗粒可以是Cu颗粒。
-
5.发明授权公开(公告)号：US08154848B2
公开(公告)日：2012-04-10
申请号：US12354026
申请日：2009-01-15
摘要： A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connecting the internal electrodes exposed at surfaces of the laminate. Each external electrode includes a plating layer at least at the portion directly connected to the internal electrodes. The plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less.
摘要翻译： 多层陶瓷电子部件包括层叠体，其包括多个陶瓷层的叠层和沿着陶瓷层之间的界面延伸的多个内部电极，以及电连接在层叠体的表面露出的内部电极的多个外部电极。 每个外部电极至少包括直接连接到内部电极的部分的镀层。 镀层的压缩应力为约100MPa以下或拉伸膜应力为约100MPa以下。
-
公开(公告)号：US07764484B2
公开(公告)日：2010-07-27
申请号：US12142924
申请日：2008-06-20
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325 , H05K1/0306 , H05K1/092 , H05K3/102 , H05K3/246 , H05K3/403 , H05K2201/0347 , H05K2203/025 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T428/25
摘要： A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 μm or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.
摘要翻译： 一种制造多层电子部件的方法包括制备层压体的步骤，该层压体包括多个堆叠的绝缘体层和沿着绝缘体层之间的界面延伸的多个内部电极，并且其中多个内部 电极在对应于第一和第二端面之一的预定表面处露出; 在所述预定表面上形成外部电极的步骤; 以及在边缘部分形成厚膜边缘电极的步骤。 形成外部电极的步骤包括将多个具有约1μm以上的粒径的导电粒子附着在层叠体的规定表面上的步骤，以及在导电粒子的规定表面上直接进行电镀的工序 附上。
-
公开(公告)号：US08724291B2
公开(公告)日：2014-05-13
申请号：US13365280
申请日：2012-02-03
IPC分类号： H01G4/00
摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
-
8.发明授权公开(公告)号：US08587923B2
公开(公告)日：2013-11-19
申请号：US12788340
申请日：2010-05-27
申请人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
CPC分类号： H01G4/30 , H01G4/2325
摘要： A method for manufacturing a laminated electronic component includes the steps of preparing a laminated component main body, the component main body including internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a metal layer on exposed surfaces of the internal electrodes, applying a water repellant on a surface of the metal layer and a section of the external surface of the component main body at which an end edge of the metal layer is located, and then forming a conductive resin layer on the metal layer having the water repellant applied thereon.
摘要翻译： 层叠电子部件的制造方法包括以下步骤：制备层压部件主体，所述部件主体包括形成在其中的内部电极，并且每个内部电极部分地暴露在所述部件主体的外表面上，并且形成 外部端子电极，在外部端子电极与内部电极电连接。 形成外部端子电极的步骤包括以下步骤：在内部电极的暴露的表面上形成金属层，在金属层的表面上施加防水剂，以及在组件主体的外表面的一部分上， 定位金属层的端边缘，然后在其上施加斥水剂的金属层上形成导电树脂层。
-
9.发明授权Laminated ceramic electronic component with directly plated external terminal electrodes and manufacturing method therefor 有权具有直接电镀外部端子电极的层压陶瓷电子部件及其制造方法公开(公告)号：US08547683B2
公开(公告)日：2013-10-01
申请号：US12821305
申请日：2010-06-23
申请人： Masahito Saruban , Makoto Ogawa , Toshiyuki Iwanaga , Seiichi Matsumoto , Akihiro Motoki , Shunsuke Takeuchi , Seiichi Nishihara , Kenichi Kawasaki
发明人： Masahito Saruban , Makoto Ogawa , Toshiyuki Iwanaga , Seiichi Matsumoto , Akihiro Motoki , Shunsuke Takeuchi , Seiichi Nishihara , Kenichi Kawasaki
CPC分类号： H01G4/2325 , H01G4/30 , H01L41/083 , H01L41/293
摘要： In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature.
摘要翻译： 在层叠陶瓷电子部件的制造方法中，在将外部端子电极的镀覆层通过在主体的主体的多个内部电极的各端露出的部件主体的端面上进行镀铜而形成后， 为了提高外部端子电极的附着强度和耐潮湿性而在800℃以上的温度下进行热处理时，可能会在镀层中产生空隙。 在其上形成有镀层的组件主体上，在约800℃以上的温度下进行热处理的步骤不仅包括保持顶部温度为约1000℃以上的步骤，还包括步骤 在保持顶部温度的步骤之前至少保持约600℃至900℃的温度。
-
公开(公告)号：US08484815B2
公开(公告)日：2013-07-16
申请号：US13295151
申请日：2011-11-14
IPC分类号： H01G7/00
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A method for manufacturing a laminated electronic component including an electronic component main body including laminated functional layers, internal conductors which are disposed inside the electronic component main body and a portion of which are exposed portions exposed at outer surfaces of the electronic component main body, and external terminal electrodes disposed on the outer surfaces of the electronic component main body so as to connect to the internal conductors and cover the exposed portions of the internal conductors includes the step of forming a substrate plating film having an average particle diameter of metal particles of at least about 1.0 μm on the outer surface of the electronic component main body through direct plating so as to cover the exposed portions of the internal conductors in the formation of the external terminal electrodes on the electronic component main body.
摘要翻译： 一种层叠电子部件的制造方法，其包括具有层叠功能层的电子部件主体，配置在所述电子部件主体内部的一部分的内部导体，其一部分露出在所述电子部件主体的外表面的露出部，以及 设置在电子部件主体的外表面上以连接到内部导体并覆盖内部导体的暴露部分的外部端子电极包括以下步骤：形成具有金属颗粒的平均粒径的基板镀膜 通过直接电镀在电子部件主体的外表面上至少约1.0μm，以便在电子部件主体上形成外部端子电极时覆盖内部导体的露出部分。
-
-
-
-
-
-
-
-
-
搜索结果
127 条记录 (耗时 0.025 秒)
