公开(公告)号：US20060078248A1

公开(公告)日：2006-04-13

申请号：US11245334

申请日：2005-10-07

申请人： Junichi Sasaki ,  Ichiro Hatakeyama ,  Kazunori Miyoshi ,  Hikaru Kouta ,  Kaichiro Nakano ,  Mikio Oda ,  Hisaya Takahashi ,  Mitsuru Kurihara

发明人： Junichi Sasaki ,  Ichiro Hatakeyama ,  Kazunori Miyoshi ,  Hikaru Kouta ,  Kaichiro Nakano ,  Mikio Oda ,  Hisaya Takahashi ,  Mitsuru Kurihara

IPC分类号： G02B6/12

CPC分类号： H01L23/48 ,  G02B6/4214 ,  G02B6/4292 ,  G02B6/43 ,  H01L24/81 ,  H01L27/1443 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/16 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12043 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02292 ,  H05K1/0274 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.

摘要翻译： 具有光学接口的LSI封装安装在光电布线板的表面上。 光电布线板和光接口以足够的精度光学连接。 包括插座销和引导销的布线板侧引导构件焊接并固定在包括光传输线，引导销和反射镜的光电布线板上。 具有嵌合孔的光学接口侧引导构件粘合到光学接口。 光学接口安装在LSI封装的插入器上。 光电布线板的引导销装配到通过插入件形成的嵌合孔中。 引导构件的引导销装配到引导构件的装配孔中。 结果，高精度地进行光接口和光电布线板之间的位置对准。

公开(公告)号：US07333683B2

公开(公告)日：2008-02-19

申请号：US11245334

申请日：2005-10-07

申请人： Junichi Sasaki ,  Ichiro Hatakeyama ,  Kazunori Miyoshi ,  Hikaru Kouta ,  Kaichiro Nakano ,  Mikio Oda ,  Hisaya Takahashi ,  Mitsuru Kurihara

发明人： Junichi Sasaki ,  Ichiro Hatakeyama ,  Kazunori Miyoshi ,  Hikaru Kouta ,  Kaichiro Nakano ,  Mikio Oda ,  Hisaya Takahashi ,  Mitsuru Kurihara

IPC分类号： G02B6/00

CPC分类号： H01L23/48 ,  G02B6/4214 ,  G02B6/4292 ,  G02B6/43 ,  H01L24/81 ,  H01L27/1443 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/16 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12043 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02292 ,  H05K1/0274 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.

摘要翻译： 具有光学接口的LSI封装安装在光电布线板的表面上。 光电布线板和光接口以足够的精度光学连接。 包括插座销和引导销的布线板侧引导构件焊接并固定在包括光传输线，引导销和反射镜的光电布线板上。 具有嵌合孔的光学接口侧引导构件粘合到光学接口。 光学接口安装在LSI封装的插入器上。 光电布线板的引导销装配到通过插入件形成的嵌合孔中。 引导构件的引导销装配到引导构件的装配孔中。 结果，高精度地进行光接口和光电布线板之间的位置对准。

公开(公告)号：US20070164297A1

公开(公告)日：2007-07-19

申请号：US10584735

申请日：2004-10-14

申请人： Mikio Oda ,  Hisaya Takahashi ,  Kaichiro Nakano ,  Hikaru Kouta ,  Kohroh Kobayashi

发明人： Mikio Oda ,  Hisaya Takahashi ,  Kaichiro Nakano ,  Hikaru Kouta ,  Kohroh Kobayashi

IPC分类号： H01L33/00 ,  H01L31/12 ,  H01L29/207 ,  H01L27/15 ,  H01L29/26

CPC分类号： H01L31/12 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

摘要： Light-emitting device array 2 is mounted on LSI 1, following which necessary light-emitting devices 2a among two or more light-emitting devices 2 that make up mounted light-emitting device array 2 are allowed to remain and unnecessary light-emitting devices 2a are removed in order to mount light-emitting devices on a plurality of output ports that are randomly arranged on LSI 1.

摘要翻译： 发光器件阵列2安装在LSI1上，随后允许保留组成安装的发光器件阵列2的两个或更多个发光器件2中必需的发光器件2a和不必要的发光器件 为了将发光装置安装在随机地布置在LSI 1上的多个输出端口上，移除了图2a。

公开(公告)号：US20070165979A1

公开(公告)日：2007-07-19

申请号：US10584736

申请日：2004-10-14

申请人： Mikio Oda ,  Hisaya Takahashi ,  Kaichiro Nakano ,  Hikaru Kouta ,  Kohroh Kobayashi

发明人： Mikio Oda ,  Hisaya Takahashi ,  Kaichiro Nakano ,  Hikaru Kouta ,  Kohroh Kobayashi

IPC分类号： G02B6/12

CPC分类号： H01L31/12 ,  H01L25/167 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2924/0002 ,  H01L2924/00

摘要： Photodetectors 2a capable of converting optical signals that are received as input from the outside to electrical signals and supplying these electrical signals as output to output ports are mounted on two or more input ports of substrate 1 on which a semiconductor integrated circuit can be mounted; and moreover, the heights of these two or more photodetectors 2a are uniformly aligned, and the electrical signal input ports of the semiconductor integrated circuit that is mounted can be connected to the output ports of the above-described substrate 1.

摘要翻译： 将从外部输入的光信号转换为电信号并将这些电信号作为输出输出到输出端口的光检测器2a安装在可安装半导体集成电路的基板1的两个或多个输入端口上; 此外，这两个或更多个光电检测器2a的高度均匀地排列，并且安装的半导体集成电路的电信号输入端口可以连接到上述基板1的输出端口。

公开(公告)号：US20100054673A1

公开(公告)日：2010-03-04

申请号：US12449175

申请日：2008-01-25

申请人： Yuichi Koreeda ,  Hikaru Kouta ,  Kaichiro Nakano ,  Hisaya Takahashi ,  Takashi Ohtsuka ,  Hideyuki Ono

发明人： Yuichi Koreeda ,  Hikaru Kouta ,  Kaichiro Nakano ,  Hisaya Takahashi ,  Takashi Ohtsuka ,  Hideyuki Ono

IPC分类号： G02B6/36

CPC分类号： G02B6/4292

摘要： An optical connector 1 is for connecting a connection object 10 to an optical module 21. A slider 3 is slidably held by a housing 2 adapted for positioning the connection object and the optical module. The housing has a first positioning portion for receiving the connection object. The slider has a first pressing portion 3a for elastically pressing the connection object in a first direction toward the first positioning portion and a second pressing portion 3e that elastically acts in a second direction perpendicular to the first direction.

摘要翻译： 光连接器1用于将连接对象10连接到光学模块21.滑块3由适于定位连接对象和光学模块的壳体2可滑动地保持。 壳体具有用于接收连接物体的第一定位部分。 滑块具有用于沿第一方向朝向第一定位部弹性地按压连接物体的第一按压部分3a和在垂直于第一方向的第二方向上弹性地作用的第二按压部分3e。

公开(公告)号：US08297855B2

公开(公告)日：2012-10-30

申请号：US12449175

申请日：2008-01-25

申请人： Yuichi Koreeda ,  Hikaru Kouta ,  Kaichiro Nakano ,  Hisaya Takahashi ,  Takashi Ohtsuka ,  Hideyuki Ono

发明人： Yuichi Koreeda ,  Hikaru Kouta ,  Kaichiro Nakano ,  Hisaya Takahashi ,  Takashi Ohtsuka ,  Hideyuki Ono

IPC分类号： G02B6/36

CPC分类号： G02B6/4292

摘要： An optical connector 1 is for connecting a connection object 10 to an optical module 21. A slider 3 is slidably held by a housing 2 adapted for positioning the connection object and the optical module. The housing has a first positioning portion for receiving the connection object. The slider has a first pressing portion 3a for elastically pressing the connection object in a first direction toward the first positioning portion and a second pressing portion 3e that elastically acts in a second direction perpendicular to the first direction.

摘要翻译： 光连接器1用于将连接对象10连接到光学模块21.滑块3由适于定位连接对象和光学模块的壳体2可滑动地保持。 壳体具有用于接收连接物体的第一定位部分。 滑块具有用于沿第一方向朝向第一定位部弹性地按压连接物体的第一按压部分3a和在垂直于第一方向的第二方向上弹性地作用的第二按压部分3e。

公开(公告)号：US20100014815A1

公开(公告)日：2010-01-21

申请号：US12443339

申请日：2007-10-05

申请人： Masaki Ohmura ,  Mitsuaki Tamura ,  Hikaru Kouta ,  Kaichiro Nakano ,  Hideyuki Ono ,  Chiemi Tanaka

发明人： Masaki Ohmura ,  Mitsuaki Tamura ,  Hikaru Kouta ,  Kaichiro Nakano ,  Hideyuki Ono ,  Chiemi Tanaka

IPC分类号： G02B6/36 ,  B29D11/00

CPC分类号： G02B6/3855 ,  G02B6/3846

摘要： A method of producing an optical waveguide connector in which the productivity of a ferrule member can be improved, and the connection loss with a counter connector can be suppressed to a low level is obtained.An optical waveguide connector 11 is obtained by performing: an aligning step of restricting the position of the tip end of an optical waveguide 2 passed through an insertion hole 13b of a ferrule member 13, by a positioning portion of a positioning member 16 which is opposedly placed at the tip end of the ferrule member 13, thereby aligning the optical waveguide 2 to the ferrule member 13; and a bonding step of filing a gap between the optical waveguide 2 which is passed through the insertion hole 13b, and the insertion hole 13b, with an adhesive agent to fix the optical waveguide 2 to the ferrule member 13.

摘要翻译： 可以获得能够提高套圈构件的生产率的光波导连接器的制造方法，并且可以将与对位连接器的连接损耗抑制在低水平。 通过以下步骤获得光波导连接器11：通过定位部件16的相对定位部分限制通过套圈部件13的插入孔13b的光波导2的前端的位置的对准步骤 放置在套圈构件13的前端，从而将光波导2对准套圈构件13; 以及将通过插入孔13b的光波导2和插入孔13b之间的间隙填充到粘合剂以将光波导2固定到套圈构件13的接合步骤。

公开(公告)号：US08388238B2

公开(公告)日：2013-03-05

申请号：US12443339

申请日：2007-10-05

申请人： Masaki Ohmura ,  Mitsuaki Tamura ,  Hikaru Kouta ,  Kaichiro Nakano ,  Hideyuki Ono ,  Chiemi Tanaka

发明人： Masaki Ohmura ,  Mitsuaki Tamura ,  Hikaru Kouta ,  Kaichiro Nakano ,  Hideyuki Ono ,  Chiemi Tanaka

IPC分类号： G02B6/36

CPC分类号： G02B6/3855 ,  G02B6/3846

摘要： A method of producing an optical waveguide connector in which the productivity of a ferrule member can be improved, and the connection loss with a counter connector can be suppressed to a low level is obtained.An optical waveguide connector 11 is obtained by performing: an aligning step of restricting the position of the tip end of an optical waveguide 2 passed through an insertion hole 13b of a ferrule member 13, by a positioning portion of a positioning member 16 which is opposedly placed at the tip end of the ferrule member 13, thereby aligning the optical waveguide 2 to the ferrule member 13; and a bonding step of filing a gap between the optical waveguide 2 which is passed through the insertion hole 13b, and the insertion hole 13b, with an adhesive agent to fix the optical waveguide 2 to the ferrule member 13.

摘要翻译： 可以获得能够提高套圈构件的生产率的光波导连接器的制造方法，并且可以将与对位连接器的连接损耗抑制在低水平。 通过以下步骤获得光波导连接器11：通过定位部件16的相对定位部分限制通过套圈部件13的插入孔13b的光波导2的前端的位置的对准步骤 放置在套圈构件13的前端，从而将光波导2对准套圈构件13; 以及将通过插入孔13b的光波导2和插入孔13b之间的间隙填充到粘合剂以将光波导2固定到套圈构件13的接合步骤。

公开(公告)号：US06746722B2

公开(公告)日：2004-06-08

申请号：US10198958

申请日：2002-07-22

申请人： Katsumi Maeda ,  Kaichiro Nakano

发明人： Katsumi Maeda ,  Kaichiro Nakano

IPC分类号： C08J704

CPC分类号： C08F222/22 ,  C08F222/18 ,  Y10S522/914

摘要： A fluorine-containing phenylmaleimide derivative having a specific structure. A polymer obtained by polymerizing monomers containing the derivative. A polymer containing a specific structural unit and having a weight-average molecular weight of 2,000 to 200,000. A chemically amplified resist composition containing the polymer and a photo acid generator, wherein the proportion of the polymer relative to the total of the polymer and the photo acid generator is 70 to 99.8% by mass. A method for pattern formation, which comprises coating the above composition on a to-be-processed substrate, exposing with a light of 180 nm or less wavelength, and conducting baking and development.

摘要翻译： 具有特定结构的含氟苯基马来酰亚胺衍生物。 通过聚合含有该衍生物的单体获得的聚合物。 含有特定结构单元且重均分子量为2,000〜200,000的聚合物。 一种含有聚合物和光酸发生剂的化学放大抗蚀剂组合物，其中聚合物相对于聚合物和光酸产生剂的总量的比例为70〜99.8质量％。 一种图案形成方法，其包括将上述组合物涂布在待处理衬底上，用180nm或更小波长的光进行曝光，并进行烘烤和显影。

公开(公告)号：US06710188B2

公开(公告)日：2004-03-23

申请号：US10463571

申请日：2003-06-18

申请人： Katsumi Maeda ,  Kaichiro Nakano

发明人： Katsumi Maeda ,  Kaichiro Nakano

IPC分类号： C07D31304

CPC分类号： G03F7/0395 ,  C07D309/30 ,  C08F20/30 ,  C08F34/02 ,  G03F7/0397

摘要： Chemically amplified resist is produced on the basis of vinyl polymer having 3-oxo-4-oxabicyclo[3.2.1]octane-2-yl group expressed by general formula (1) where each of L1, L2, L3, L4, L5 and L6 is selected from the group consisting of hydrogen atom and alkyl groups having the carbon number from 1 to 8, and the hydrogen atom and/or the alkyl group at L5 and L6 are replaced with alkylene groups having the carbon number from 1 to 10 and bonded to each other for forming a ring so that the resist exhibits high transparency to light equal to or less than 220 nm wavelength, large resistance against dry etching and good adhesion to substrates.

摘要翻译： 基于由通式（1）表示的3-氧代-4-氧杂双环[3.2.1]辛烷-2-基的乙烯基聚合物制备化学扩增抗蚀剂，其中L 1，L 2， L 3，L 4，L 5和L 6选自氢原子和碳原子数1〜8的烷基，氢原子和/或烷基 在L 5和L 6被碳原子数为1〜10的亚烷基取代，并且彼此键合形成环，使得抗蚀剂对波长等于或小于220nm的光具有高透明度， 抗干蚀刻性能好，对基片粘合性好。