公开(公告)号：US20060078248A1

公开(公告)日：2006-04-13

申请号：US11245334

申请日：2005-10-07

申请人： Junichi Sasaki ,  Ichiro Hatakeyama ,  Kazunori Miyoshi ,  Hikaru Kouta ,  Kaichiro Nakano ,  Mikio Oda ,  Hisaya Takahashi ,  Mitsuru Kurihara

发明人： Junichi Sasaki ,  Ichiro Hatakeyama ,  Kazunori Miyoshi ,  Hikaru Kouta ,  Kaichiro Nakano ,  Mikio Oda ,  Hisaya Takahashi ,  Mitsuru Kurihara

IPC分类号： G02B6/12

CPC分类号： H01L23/48 ,  G02B6/4214 ,  G02B6/4292 ,  G02B6/43 ,  H01L24/81 ,  H01L27/1443 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/16 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12043 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02292 ,  H05K1/0274 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.

摘要翻译： 具有光学接口的LSI封装安装在光电布线板的表面上。 光电布线板和光接口以足够的精度光学连接。 包括插座销和引导销的布线板侧引导构件焊接并固定在包括光传输线，引导销和反射镜的光电布线板上。 具有嵌合孔的光学接口侧引导构件粘合到光学接口。 光学接口安装在LSI封装的插入器上。 光电布线板的引导销装配到通过插入件形成的嵌合孔中。 引导构件的引导销装配到引导构件的装配孔中。 结果，高精度地进行光接口和光电布线板之间的位置对准。

公开(公告)号：US07333683B2

公开(公告)日：2008-02-19

申请号：US11245334

申请日：2005-10-07

申请人： Junichi Sasaki ,  Ichiro Hatakeyama ,  Kazunori Miyoshi ,  Hikaru Kouta ,  Kaichiro Nakano ,  Mikio Oda ,  Hisaya Takahashi ,  Mitsuru Kurihara

发明人： Junichi Sasaki ,  Ichiro Hatakeyama ,  Kazunori Miyoshi ,  Hikaru Kouta ,  Kaichiro Nakano ,  Mikio Oda ,  Hisaya Takahashi ,  Mitsuru Kurihara

IPC分类号： G02B6/00

CPC分类号： H01L23/48 ,  G02B6/4214 ,  G02B6/4292 ,  G02B6/43 ,  H01L24/81 ,  H01L27/1443 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/16 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12043 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02292 ,  H05K1/0274 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.

摘要翻译： 具有光学接口的LSI封装安装在光电布线板的表面上。 光电布线板和光接口以足够的精度光学连接。 包括插座销和引导销的布线板侧引导构件焊接并固定在包括光传输线，引导销和反射镜的光电布线板上。 具有嵌合孔的光学接口侧引导构件粘合到光学接口。 光学接口安装在LSI封装的插入器上。 光电布线板的引导销装配到通过插入件形成的嵌合孔中。 引导构件的引导销装配到引导构件的装配孔中。 结果，高精度地进行光接口和光电布线板之间的位置对准。

公开(公告)号：US20070164297A1

公开(公告)日：2007-07-19

申请号：US10584735

申请日：2004-10-14

申请人： Mikio Oda ,  Hisaya Takahashi ,  Kaichiro Nakano ,  Hikaru Kouta ,  Kohroh Kobayashi

发明人： Mikio Oda ,  Hisaya Takahashi ,  Kaichiro Nakano ,  Hikaru Kouta ,  Kohroh Kobayashi

IPC分类号： H01L33/00 ,  H01L31/12 ,  H01L29/207 ,  H01L27/15 ,  H01L29/26

CPC分类号： H01L31/12 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

摘要： Light-emitting device array 2 is mounted on LSI 1, following which necessary light-emitting devices 2a among two or more light-emitting devices 2 that make up mounted light-emitting device array 2 are allowed to remain and unnecessary light-emitting devices 2a are removed in order to mount light-emitting devices on a plurality of output ports that are randomly arranged on LSI 1.

摘要翻译： 发光器件阵列2安装在LSI1上，随后允许保留组成安装的发光器件阵列2的两个或更多个发光器件2中必需的发光器件2a和不必要的发光器件 为了将发光装置安装在随机地布置在LSI 1上的多个输出端口上，移除了图2a。

公开(公告)号：US20070165979A1

公开(公告)日：2007-07-19

申请号：US10584736

申请日：2004-10-14

申请人： Mikio Oda ,  Hisaya Takahashi ,  Kaichiro Nakano ,  Hikaru Kouta ,  Kohroh Kobayashi

发明人： Mikio Oda ,  Hisaya Takahashi ,  Kaichiro Nakano ,  Hikaru Kouta ,  Kohroh Kobayashi

IPC分类号： G02B6/12

CPC分类号： H01L31/12 ,  H01L25/167 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2924/0002 ,  H01L2924/00

摘要： Photodetectors 2a capable of converting optical signals that are received as input from the outside to electrical signals and supplying these electrical signals as output to output ports are mounted on two or more input ports of substrate 1 on which a semiconductor integrated circuit can be mounted; and moreover, the heights of these two or more photodetectors 2a are uniformly aligned, and the electrical signal input ports of the semiconductor integrated circuit that is mounted can be connected to the output ports of the above-described substrate 1.

摘要翻译： 将从外部输入的光信号转换为电信号并将这些电信号作为输出输出到输出端口的光检测器2a安装在可安装半导体集成电路的基板1的两个或多个输入端口上; 此外，这两个或更多个光电检测器2a的高度均匀地排列，并且安装的半导体集成电路的电信号输入端口可以连接到上述基板1的输出端口。

公开(公告)号：US20100054673A1

公开(公告)日：2010-03-04

申请号：US12449175

申请日：2008-01-25

申请人： Yuichi Koreeda ,  Hikaru Kouta ,  Kaichiro Nakano ,  Hisaya Takahashi ,  Takashi Ohtsuka ,  Hideyuki Ono

发明人： Yuichi Koreeda ,  Hikaru Kouta ,  Kaichiro Nakano ,  Hisaya Takahashi ,  Takashi Ohtsuka ,  Hideyuki Ono

IPC分类号： G02B6/36

CPC分类号： G02B6/4292

摘要： An optical connector 1 is for connecting a connection object 10 to an optical module 21. A slider 3 is slidably held by a housing 2 adapted for positioning the connection object and the optical module. The housing has a first positioning portion for receiving the connection object. The slider has a first pressing portion 3a for elastically pressing the connection object in a first direction toward the first positioning portion and a second pressing portion 3e that elastically acts in a second direction perpendicular to the first direction.

摘要翻译： 光连接器1用于将连接对象10连接到光学模块21.滑块3由适于定位连接对象和光学模块的壳体2可滑动地保持。 壳体具有用于接收连接物体的第一定位部分。 滑块具有用于沿第一方向朝向第一定位部弹性地按压连接物体的第一按压部分3a和在垂直于第一方向的第二方向上弹性地作用的第二按压部分3e。

公开(公告)号：US08297855B2

公开(公告)日：2012-10-30

申请号：US12449175

申请日：2008-01-25

申请人： Yuichi Koreeda ,  Hikaru Kouta ,  Kaichiro Nakano ,  Hisaya Takahashi ,  Takashi Ohtsuka ,  Hideyuki Ono

发明人： Yuichi Koreeda ,  Hikaru Kouta ,  Kaichiro Nakano ,  Hisaya Takahashi ,  Takashi Ohtsuka ,  Hideyuki Ono

IPC分类号： G02B6/36

CPC分类号： G02B6/4292

摘要： An optical connector 1 is for connecting a connection object 10 to an optical module 21. A slider 3 is slidably held by a housing 2 adapted for positioning the connection object and the optical module. The housing has a first positioning portion for receiving the connection object. The slider has a first pressing portion 3a for elastically pressing the connection object in a first direction toward the first positioning portion and a second pressing portion 3e that elastically acts in a second direction perpendicular to the first direction.

摘要翻译： 光连接器1用于将连接对象10连接到光学模块21.滑块3由适于定位连接对象和光学模块的壳体2可滑动地保持。 壳体具有用于接收连接物体的第一定位部分。 滑块具有用于沿第一方向朝向第一定位部弹性地按压连接物体的第一按压部分3a和在垂直于第一方向的第二方向上弹性地作用的第二按压部分3e。

公开(公告)号：US08345424B2

公开(公告)日：2013-01-01

申请号：US12865780

申请日：2009-02-16

申请人： Mikio Oda ,  Tomotaka Ishida ,  Hisaya Takahashi ,  Hideyuki Ono ,  Jun Sakai ,  Takashi Ohtsuka ,  Arihide Noda ,  Hikaru Kouta

发明人： Mikio Oda ,  Tomotaka Ishida ,  Hisaya Takahashi ,  Hideyuki Ono ,  Jun Sakai ,  Takashi Ohtsuka ,  Arihide Noda ,  Hikaru Kouta

IPC分类号： H05K7/20

CPC分类号： H01L25/167 ,  G02B6/4201 ,  G02B6/4257 ,  G02B6/4266 ,  G02B6/4274 ,  H01L2924/0002 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/00

摘要： Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules (12) are arranged on a periphery of an LSI (11) electrically connected to an electric wiring board (10), and liquid cooling mechanisms (13, 14) are respectively placed on the LSI (11) and the optical modules (12). The plurality of optical modules (12) may be arranged only on a surface of the electric wiring board (10) where the LSI (11) is mounted, only on a surface opposite to the surface where the LSI (11) is mounted, or on both the same surface as and the opposite surface to the surface where the LSI (11) is mounted.

摘要翻译： 提供一种其中冷却所需的体积减小的光学互连装置。 在光互连装置中，在与电气布线板（10）电连接的LSI（11）的周围配置有多个光模块（12），液体冷却机构（13,14）分别置于 LSI（11）和光模块（12）。 多个光学模块（12）可以仅布置在安装有LSI（11）的电气布线板（10）的仅在与LSI（11）的表面相反的表面上的表面上，或者 在与安装LSI（11）的表面相同的表面上和相对的表面上。

公开(公告)号：US20090026565A1

公开(公告)日：2009-01-29

申请号：US12223541

申请日：2007-02-02

申请人： Arihide Noda ,  Mikio Oda ,  Takashi Ohtsuka ,  Hisaya Takahashi ,  Hikaru Kouta ,  Jun Sakai

发明人： Arihide Noda ,  Mikio Oda ,  Takashi Ohtsuka ,  Hisaya Takahashi ,  Hikaru Kouta ,  Jun Sakai

IPC分类号： H01L31/0232 ,  C12Q1/68 ,  G01J1/00

CPC分类号： G02B6/4214 ,  G02B6/4232 ,  G02B6/4292 ,  H01L25/167 ,  H01L31/02002 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/184 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/10121 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention includes: photoelectric conversion element 103 that converts electrical signals into optical signals and optical signals into electrical signals; and optical communication LSI 102 electrically connected to photoelectric conversion element 103. Also, the present invention includes electrical wiring substrate 101 including a plurality of electrodes 201 and 202 on which photoelectric conversion element 103 and optical communication LSI 102 are mounted by flip-chip attachment and a plurality of wiring layers 101a, 101b and 101c electrically connecting respective electrodes 201 and 202, wiring layers 101a, 101b and 101c being provided at an upper surface, a lower surface and an inner portion of electrical wiring substrate 101, respectively. Also, electrodes 201 and 202 to which photoelectric conversion element 103 is bonded are provided at a side surface of electrical wiring substrate 101.

摘要翻译： 本发明包括：将电信号转换为光信号和光信号的电信号的光电转换元件103; 以及与光电转换元件103电连接的光通信LSI 102.另外，本发明包括电子布线基板101，其包括多个电极201和202，其上通过倒装芯片附接安装光电转换元件103和光通信LSI102， 电连接各个电极201和202的多个布线层101a，101b和101c，布线层101a，101b和101c分别设置在电布线基板101的上表面，下表面和内部。 而且，在电配线基板101的侧面设置与光电转换元件103接合的电极201和202。

公开(公告)号：US08047725B2

公开(公告)日：2011-11-01

申请号：US12459647

申请日：2009-07-06

申请人： Naoki Katagiyama ,  Yuichi Koreeda ,  Hikaru Kouta ,  Hisaya Takahashi ,  Mikio Oda ,  Hideyuki Ono

发明人： Naoki Katagiyama ,  Yuichi Koreeda ,  Hikaru Kouta ,  Hisaya Takahashi ,  Mikio Oda ,  Hideyuki Ono

IPC分类号： G02B6/38

CPC分类号： G02B6/3825 ,  G02B6/3893

摘要： In an optical connector adapter for use in connecting a first and a second optical connector plug to each other, a second adapter half is butted against a first adapter half in a predetermined direction. The first and second adapter halves have engaging means for maintaining the first and second adapter halves in a butted state in the predetermined direction. The engaging means is configured to be disposed inside the optical connector adapter and to be prevented from releasing engagement thereof by at least one of the first and second optical connector plugs.

摘要翻译： 在用于将第一和第二光学连接器插头彼此连接的光学连接器适配器中，第二适配器半部在预定方向上与第一适配器半部对接。 第一和第二适配器半部具有接合装置，用于将第一和第二适配器半部在预定方向上保持对接状态。 接合装置被配置为设置在光学连接器适配器内部，并且防止其被第一和第二光学连接器插头中的至少一个释放其接合。

公开(公告)号：US08358892B2

公开(公告)日：2013-01-22

申请号：US11817297

申请日：2006-02-28

申请人： Mikio Oda ,  Hikaru Kouta ,  Kaichirou Nakano ,  Hisaya Takahashi ,  Kohroh Kobayashi

发明人： Mikio Oda ,  Hikaru Kouta ,  Kaichirou Nakano ,  Hisaya Takahashi ,  Kohroh Kobayashi

IPC分类号： G02B6/26 ,  G02B6/42 ,  G02B6/12

CPC分类号： G02B6/4214 ,  G02B6/3676 ,  G02B6/4249 ,  G02B6/43

摘要： Optical elements (light sources 16 or photodetectors 18) are arranged in a two-dimensional array, and the relative positional relationship between the optical elements and optical waveguides 12 is defined such that optical waveguides 12 extend between the optical elements in the two-dimensional array substantially parallel to substrate 19 for increased parallelism. Micromirrors 15 are disposed in respective optical waveguides 12 to bend light beams through 90 degrees to realize a highly efficient optical coupling between the optical elements and optical waveguides 12. The optical waveguides are stacked in multiple stages, and light beams are lead to the optical waveguides in the multiple stacks through micromirrors 15 across the stacked plane of the optical waveguides, thereby realizing parallel connection between the two-dimensional array of optical elements and a two-dimensional array of optical waveguides. There is thus provided a connection structure between the optical elements and optical waveguides 12, which is small in size and high in efficiency, and is of high parallelism.

摘要翻译： 光学元件（光源16或光电检测器18）被布置成二维阵列，并且光学元件和光波导12之间的相对位置关系被限定为使得光波导12在二维阵列中的光学元件之间延伸 基本上平行于基板19以增加平行度。 微镜15设置在相应的光波导12中以将光束弯曲90度，以实现光学元件和光波导12之间的高效光耦合。光波导以多级堆叠，光束通向光波导 在穿过光波导的堆叠平面的微镜15的多个堆叠中，从而实现光学元件的二维阵列与光波导的二维阵列之间的并联连接。 因此，在光学元件和尺寸小且效率高的光波导12之间提供了一种连接结构，并且具有高平行度。