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公开(公告)号：US06844274B2
公开(公告)日：2005-01-18
申请号：US10638523
申请日：2003-08-12
IPC分类号： C25D7/12 , C25D17/06 , C25D19/00 , H01L21/00 , H01L21/60 , H01L21/683 , H01L21/687 , B25B11/00 , C25B9/00
CPC分类号： H01L21/67126 , C25D7/123 , C25D17/001 , C25D17/06 , H01L21/68721 , H01L21/68764 , H01L21/68785
摘要： A substrate holder holds a substrate while hermetically sealing an outer circumferential edge and a reverse side of the substrate and exposing a surface of the substrate. The substrate holder has a base and a cover having an opening defined therein and positioned to place the substrate between the base and the cover. An attracting mechanism couples the base and the cover to each other to hold the substrate between the base and the cover, with the surface of the substrate being exposed through the opening.
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公开(公告)号：US08133376B2
公开(公告)日：2012-03-13
申请号：US12871083
申请日：2010-08-30
IPC分类号： C25D7/12
CPC分类号： H01L21/67126 , C25D7/123 , C25D17/001 , C25D17/06 , H01L21/68721 , H01L21/68764 , H01L21/68785
摘要： A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.
摘要翻译： 一种电镀方法和电镀装置，其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽，与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽，用于将衬底保持在垂直取向的衬底保持器，垂直位移机构 用于将衬底保持器和由此保持在电镀液中的电镀溶液中的衬底垂直浸入电镀槽中，以及横向移位机构或前后移位机构，用于使衬底保持器移动，同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站，以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。
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公开(公告)号：US20100320090A1
公开(公告)日：2010-12-23
申请号：US12871083
申请日：2010-08-30
IPC分类号： C25D7/12
CPC分类号： H01L21/67126 , C25D7/123 , C25D17/001 , C25D17/06 , H01L21/68721 , H01L21/68764 , H01L21/68785
摘要： A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.
摘要翻译： 一种电镀方法和电镀装置，其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽，与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽，用于将衬底保持在垂直取向的衬底保持器，垂直位移机构 用于将衬底保持器和由此保持在电镀液中的电镀溶液中的衬底垂直浸入电镀槽中，以及横向移位机构或前后移位机构，用于使衬底保持器移动，同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站，以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。
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公开(公告)号：US07807027B2
公开(公告)日：2010-10-05
申请号：US11002060
申请日：2004-12-03
IPC分类号： C25D17/00
CPC分类号： H01L21/67126 , C25D7/123 , C25D17/001 , C25D17/06 , H01L21/68721 , H01L21/68764 , H01L21/68785
摘要： A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.
摘要翻译： 一种电镀方法和电镀装置，其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽，与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽，用于将衬底保持在垂直取向的衬底保持器，垂直位移机构 用于将衬底保持器和由此保持在镀液中的衬底垂直浸入电镀槽中，以及横向移位机构或前后移位机构，用于使衬底保持器移动，同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站，以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。
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公开(公告)号：US20050092600A1
公开(公告)日：2005-05-05
申请号：US11002060
申请日：2004-12-03
IPC分类号： C25D7/12 , C25D17/06 , C25D19/00 , H01L21/00 , H01L21/60 , H01L21/683 , H01L21/687 , C25D17/00
CPC分类号： H01L21/67126 , C25D7/123 , C25D17/001 , C25D17/06 , H01L21/68721 , H01L21/68764 , H01L21/68785
摘要： A substrate holder holds a substrate while hermetically sealing an outer circumferential edge and a reverse side of the substrate and exposing a surface of the substrate. The substrate holder has a base and a cover having an opening defined therein and positioned to place the substrate between the base and the cover. An attracting mechanism couples the base and the cover to each other to hold the substrate between the base and the cover, with the surface of the substrate being exposed through the opening.
摘要翻译： 衬底保持器保持衬底，同时气密地密封衬底的外周边缘和反面，并暴露衬底的表面。 衬底保持器具有基部和盖，其具有限定在其中的开口并且定位成将基板放置在基部和盖之间。 吸引机构将基部和盖彼此连接以将基板保持在基部和盖之间，其中基板的表面通过开口露出。
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公开(公告)号：US20090301395A1
公开(公告)日：2009-12-10
申请号：US12543832
申请日：2009-08-19
申请人： Masahiko SEKIMOTO , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami , Kenji Kamoda
发明人： Masahiko SEKIMOTO , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami , Kenji Kamoda
IPC分类号： B05C13/02
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
摘要翻译： 电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的籽晶层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理， 被配置为在灰化过程之后向基板的表面提供亲水性。 电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。 电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504） 种子层形成在基底上。
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公开(公告)号：US20130015075A1
公开(公告)日：2013-01-17
申请号：US13616050
申请日：2012-09-14
申请人： Masahiko SEKIMOTO , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami , Kenji Kamoda
发明人： Masahiko SEKIMOTO , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami , Kenji Kamoda
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
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公开(公告)号：US20060141157A1
公开(公告)日：2006-06-29
申请号：US10544623
申请日：2004-05-25
申请人： Masahiko Sekimoto , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami
发明人： Masahiko Sekimoto , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
摘要翻译： 电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的籽晶层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理， 被配置为在灰化过程之后向基板的表面提供亲水性。 电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。 电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504） 种子层形成在基底上。
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公开(公告)号：US20090045068A1
公开(公告)日：2009-02-19
申请号：US12071353
申请日：2008-02-20
CPC分类号： C25D5/08
摘要： A plating apparatus and method bubbles generated at the plating surfaces easily removed and the uniformity of the thickness of the plated film within the plated surface can be improved. The plating apparatus has a cassette table for loading a cassette in which a substrate having a plating surface is contained. An aligner for aligning the substrate, a rinser-dryer for rinsing and drying the substrate, and a plating unit for plating the substrate are also provided. The plating unit includes a plating vessel containing a plating solution, and a holder holds the substrate to immerse the substrate in the plating solution in the plating vessel. The plating surface is exposed to a nozzle which ejects the plating solution toward the plating surface.
摘要翻译： 可以容易地去除在电镀面上产生的电镀装置和方法，并且可以提高电镀表面内的镀膜厚度的均匀性。 电镀装置具有用于装载其中包含具有电镀表面的基板的盒的盒台。 还提供了用于对准衬底的校准器，用于冲洗和干燥衬底的洗衣机 - 干燥器，以及用于电镀衬底的电镀单元。 电镀单元包括含有电镀液的电镀槽，保持器保持基板将基板浸入电镀槽中的电镀液中。 电镀表面暴露于喷镀电镀溶液朝向电镀面的喷嘴。
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公开(公告)号：US08048282B2
公开(公告)日：2011-11-01
申请号：US12071353
申请日：2008-02-20
CPC分类号： C25D5/08
摘要： A plating apparatus and method bubbles generated at the plating surfaces easily removed and the uniformity of the thickness of the plated film within the plated surface can be improved. The plating apparatus has a cassette table for loading a cassette in which a substrate having a plating surface is contained. An aligner for aligning the substrate, a rinser-dryer for rinsing and drying the substrate, and a plating unit for plating the substrate are also provided. The plating unit includes a plating vessel containing a plating solution, and a holder holds the substrate to immerse the substrate in the plating solution in the plating vessel. The plating surface is exposed to a nozzle which ejects the plating solution toward the plating surface.
摘要翻译： 可以容易地去除在电镀面上产生的电镀装置和方法，并且可以提高电镀表面内的镀膜厚度的均匀性。 电镀装置具有用于装载其中包含具有电镀表面的基板的盒的盒台。 还提供了用于对准衬底的校准器，用于冲洗和干燥衬底的洗衣机 - 干燥器，以及用于电镀衬底的电镀单元。 电镀单元包括含有电镀液的电镀槽，保持器保持基板将基板浸入电镀槽中的电镀液中。 电镀表面暴露于喷镀电镀溶液朝向电镀面的喷嘴。
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