公开(公告)号：US08133376B2

公开(公告)日：2012-03-13

申请号：US12871083

申请日：2010-08-30

申请人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

发明人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

IPC分类号： C25D7/12

CPC分类号： H01L21/67126 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/68785

摘要： A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.

摘要翻译： 一种电镀方法和电镀装置，其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽，与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽，用于将衬底保持在垂直取向的衬底保持器，垂直位移机构 用于将衬底保持器和由此保持在电镀液中的电镀溶液中的衬底垂直浸入电镀槽中，以及横向移位机构或前后移位机构，用于使衬底保持器移动，同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站，以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。

公开(公告)号：US20100320090A1

公开(公告)日：2010-12-23

申请号：US12871083

申请日：2010-08-30

申请人： Junichiro YOSHIOKA ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

发明人： Junichiro YOSHIOKA ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

IPC分类号： C25D7/12

CPC分类号： H01L21/67126 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/68785

摘要： A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.

摘要翻译： 一种电镀方法和电镀装置，其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽，与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽，用于将衬底保持在垂直取向的衬底保持器，垂直位移机构 用于将衬底保持器和由此保持在电镀液中的电镀溶液中的衬底垂直浸入电镀槽中，以及横向移位机构或前后移位机构，用于使衬底保持器移动，同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站，以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。

公开(公告)号：US07807027B2

公开(公告)日：2010-10-05

申请号：US11002060

申请日：2004-12-03

申请人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

发明人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

IPC分类号： C25D17/00

CPC分类号： H01L21/67126 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/68785

摘要： A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.

摘要翻译： 一种电镀方法和电镀装置，其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽，与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽，用于将衬底保持在垂直取向的衬底保持器，垂直位移机构 用于将衬底保持器和由此保持在镀液中的衬底垂直浸入电镀槽中，以及横向移位机构或前后移位机构，用于使衬底保持器移动，同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站，以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。

公开(公告)号：US06844274B2

公开(公告)日：2005-01-18

申请号：US10638523

申请日：2003-08-12

申请人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

发明人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

IPC分类号： C25D7/12 ,  C25D17/06 ,  C25D19/00 ,  H01L21/00 ,  H01L21/60 ,  H01L21/683 ,  H01L21/687 ,  B25B11/00 ,  C25B9/00

CPC分类号： H01L21/67126 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/68785

摘要： A substrate holder holds a substrate while hermetically sealing an outer circumferential edge and a reverse side of the substrate and exposing a surface of the substrate. The substrate holder has a base and a cover having an opening defined therein and positioned to place the substrate between the base and the cover. An attracting mechanism couples the base and the cover to each other to hold the substrate between the base and the cover, with the surface of the substrate being exposed through the opening.

公开(公告)号：US20050092600A1

公开(公告)日：2005-05-05

申请号：US11002060

申请日：2004-12-03

申请人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

发明人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

IPC分类号： C25D7/12 ,  C25D17/06 ,  C25D19/00 ,  H01L21/00 ,  H01L21/60 ,  H01L21/683 ,  H01L21/687 ,  C25D17/00

CPC分类号： H01L21/67126 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/68785

摘要： A substrate holder holds a substrate while hermetically sealing an outer circumferential edge and a reverse side of the substrate and exposing a surface of the substrate. The substrate holder has a base and a cover having an opening defined therein and positioned to place the substrate between the base and the cover. An attracting mechanism couples the base and the cover to each other to hold the substrate between the base and the cover, with the surface of the substrate being exposed through the opening.

摘要翻译： 衬底保持器保持衬底，同时气密地密封衬底的外周边缘和反面，并暴露衬底的表面。 衬底保持器具有基部和盖，其具有限定在其中的开口并且定位成将基板放置在基部和盖之间。 吸引机构将基部和盖彼此连接以将基板保持在基部和盖之间，其中基板的表面通过开口露出。

公开(公告)号：US07976362B2

公开(公告)日：2011-07-12

申请号：US12534465

申请日：2009-08-03

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

IPC分类号： B24B29/00

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

公开(公告)号：US07585205B2

公开(公告)日：2009-09-08

申请号：US11905687

申请日：2007-10-03

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

IPC分类号： B24B49/00

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

公开(公告)号：US20080178800A1

公开(公告)日：2008-07-31

申请号：US12076834

申请日：2008-03-24

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

IPC分类号： B05C3/02

CPC分类号： H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

摘要： A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

公开(公告)号：US20070070575A1

公开(公告)日：2007-03-29

申请号：US10578100

申请日：2004-12-22

申请人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

发明人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

IPC分类号： H01T23/00

CPC分类号： H01L21/67086 ,  H01L21/67051 ,  H01L21/687

摘要： A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder (84) for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member (92); and a substrate pressing section (85) for lowering relative to the substrate holder (84) so as to press the substrate (W) held by the substrate holder (84) downward, thereby bringing the first sealing member (92) into pressure contact with the substrate (W); wherein the substrate pressing section (85) is provided with a second ring-shaped sealing member (170) which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder (84), thereby sealing the peripheral region of the substrate pressing section (85).

摘要翻译： 基板保持装置可以满足对较小尺寸的小型装置的要求，同时确保基板在处理液体中的足够的浸入深度。 基板保持装置包括：通过使基板（W）的表面的周边部分与第一密封构件（92）接触来支撑基板（W）的基板保持件（84）; 以及用于相对于基板保持件（84）下降以便将由基板保持件（84）保持的基板（W）向下压的基板按压部（85），从而使第一密封部件（92）与 基板（W）; 其中，所述基板按压部（85）设置有与所述基板保持件（84）的环状保持部的上表面压力接触的第二环状密封部件（170），从而密封所述基板保持部 基板按压部（85）。

公开(公告)号：US20060236929A1

公开(公告)日：2006-10-26

申请号：US11455736

申请日：2006-06-20

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： B05C3/02

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.