公开(公告)号：US20060287754A1

公开(公告)日：2006-12-21

申请号：US11471675

申请日：2006-06-21

申请人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

发明人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

IPC分类号： G06F19/00

CPC分类号： G05B19/41875 ,  G05B2219/31477 ,  G05B2219/32057 ,  G05B2219/32097 ,  G05B2219/45031 ,  Y02P90/12 ,  Y02P90/20 ,  Y02P90/22

摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

公开(公告)号：US20090276078A1

公开(公告)日：2009-11-05

申请号：US12458421

申请日：2009-07-10

申请人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

发明人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

IPC分类号： G06F19/00

CPC分类号： G05B19/41875 ,  G05B2219/31477 ,  G05B2219/32057 ,  G05B2219/32097 ,  G05B2219/45031 ,  Y02P90/12 ,  Y02P90/20 ,  Y02P90/22

摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

公开(公告)号：US07596421B2

公开(公告)日：2009-09-29

申请号：US11471675

申请日：2006-06-21

申请人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

发明人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

IPC分类号： G06F19/00

CPC分类号： G05B19/41875 ,  G05B2219/31477 ,  G05B2219/32057 ,  G05B2219/32097 ,  G05B2219/45031 ,  Y02P90/12 ,  Y02P90/20 ,  Y02P90/22

摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

摘要翻译： 过程控制系统包括：准备设备信息的参考监视值和特征量之间的相关性的客户端计算机;准备描述作为实际制造过程中的第一设定值的处理配方的制造执行系统， 所述控制参数，设备信息收集部分，其在具有所述第一设定值的实际制造过程的操作中收集所述设备信息的客观监视值;特征量计算部，其计算与所监视的目标对应的特征量的值 基于相关性的值，参数计算部，其基于特征量的值计算实际制造过程中的第二设定值;以及装置控制单元，其将处理配方改变为第二设定值为 设定第二步的值。

公开(公告)号：US07831330B2

公开(公告)日：2010-11-09

申请号：US12458421

申请日：2009-07-10

申请人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

发明人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

IPC分类号： G06F19/00

CPC分类号： G05B19/41875 ,  G05B2219/31477 ,  G05B2219/32057 ,  G05B2219/32097 ,  G05B2219/45031 ,  Y02P90/12 ,  Y02P90/20 ,  Y02P90/22

摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

摘要翻译： 过程控制系统包括：准备设备信息的参考监视值和特征量之间的相关性的客户端计算机;准备描述作为实际制造过程中的第一设定值的处理配方的制造执行系统， 所述控制参数，设备信息收集部分，其在具有所述第一设定值的实际制造过程的操作中收集所述设备信息的客观监视值;特征量计算部，其计算与所监视的目标对应的特征量的值 基于相关性的值，参数计算部，其基于特征量的值计算实际制造过程中的第二设定值;以及装置控制单元，其将处理配方改变为第二设定值为 设定第二步的值。

公开(公告)号：US07324855B2

公开(公告)日：2008-01-29

申请号：US11217592

申请日：2005-09-02

申请人： Yukihiro Ushiku ,  Hidenori Kakinuma ,  Tsutomu Miki ,  Junji Sugamoto ,  Akira Ogawa ,  Yoshinori Ookawauchi ,  Giichi Inoue ,  Tomomi Ino

发明人： Yukihiro Ushiku ,  Hidenori Kakinuma ,  Tsutomu Miki ,  Junji Sugamoto ,  Akira Ogawa ,  Yoshinori Ookawauchi ,  Giichi Inoue ,  Tomomi Ino

IPC分类号： G06F19/00

CPC分类号： G05B19/41865 ,  G05B2219/31372 ,  G05B2219/31395 ,  G05B2219/31455 ,  G06Q30/0283 ,  Y02P90/12 ,  Y02P90/18 ,  Y02P90/20

摘要： A process-state management system encompasses: a plurality of production machines; a control server configured to collectively control at least part of the production machines; a management server including a data-linking module configured to link operation-management data of the production machines with corresponding management information transmitted from the control server, respectively, the management server analyze the operation-management data linked with the management information with a common analysis application; and a management database configured to store the operation-management data linked with the management information.

摘要翻译： 过程状态管理系统包括：多个生产机器; 控制服务器，其被配置为共同控制所述生产机器的至少一部分; 管理服务器，其包括分别将生产机的运行管理数据与从控制服务器发送的相应的管理信息相连接的数据链接模块，所述管理服务器分析与所述管理信息相关联的运行管理数据， 应用; 以及管理数据库，被配置为存储与管理信息相关联的操作管理数据。

公开(公告)号：US20060281281A1

公开(公告)日：2006-12-14

申请号：US11444301

申请日：2006-06-01

申请人： Katsujiro Tanzawa ,  Norihiko Tsuchiya ,  Junji Sugamoto ,  Yukihiro Ushiku

发明人： Katsujiro Tanzawa ,  Norihiko Tsuchiya ,  Junji Sugamoto ,  Yukihiro Ushiku

IPC分类号： H01L21/66 ,  H01L21/30

CPC分类号： H01L22/12 ,  G01N21/9501

摘要： A method of inspecting a semiconductor wafer, comprises removing a device structure film on the semiconductor wafer with a chemical solution to expose a crystal surface of the semiconductor wafer; coating a protected area, which is a part of the crystal surface of the semiconductor wafer, with a mask material for protecting the crystal surface of the semiconductor wafer; etching the semiconductor wafer selectively, thereby making a crystal defect in a non-protected area, which is a part of the crystal surface of the semiconductor wafer that is not coated with the mask material, appear after the crystal surface is coated with the mask material; removing the mask material after the selective etching; carrying out quantitative measurement of the protected area and the non-protected area using an optical defect inspection apparatus or a beam-type defect inspection apparatus; and calculating the number of crystal defects of the semiconductor wafer base on the result of the measurement.

公开(公告)号：US07531462B2

公开(公告)日：2009-05-12

申请号：US11444301

申请日：2006-06-01

申请人： Katsujiro Tanzawa ,  Norihiko Tsuchiya ,  Junji Sugamoto ,  Yukihiro Ushiku

发明人： Katsujiro Tanzawa ,  Norihiko Tsuchiya ,  Junji Sugamoto ,  Yukihiro Ushiku

IPC分类号： H01L21/302

CPC分类号： H01L22/12 ,  G01N21/9501

摘要： A method of inspecting a semiconductor wafer, comprises removing a device structure film on the semiconductor wafer with a chemical solution to expose a crystal surface of the semiconductor wafer; coating a protected area, which is a part of the crystal surface of the semiconductor wafer, with a mask material for protecting the crystal surface of the semiconductor wafer; etching the semiconductor wafer selectively, thereby making a crystal defect in a non-protected area, which is a part of the crystal surface of the semiconductor wafer that is not coated with the mask material, appear after the crystal surface is coated with the mask material; removing the mask material after the selective etching; carrying out quantitative measurement of the protected area and the non-protected area using an optical defect inspection apparatus or a beam-type defect inspection apparatus; and calculating the number of crystal defects of the semiconductor wafer base on the result of the measurement.

摘要翻译： 一种检查半导体晶片的方法，包括用化学溶液去除半导体晶片上的器件结构膜以暴露半导体晶片的晶体表面; 用保护半导体晶片的晶体表面的掩模材料涂覆作为半导体晶片的晶体表面的一部分的保护区域; 选择性地蚀刻半导体晶片，从而在未涂覆有掩模材料的半导体晶片的晶体表面的一部分的非保护区域中出现晶体缺陷，在晶体表面涂覆有掩模材料之后 ; 在选择性蚀刻之后去除掩模材料; 使用光学缺陷检查装置或光束型缺陷检查装置进行保护区域和非保护区域的定量测量; 并根据测量结果计算半导体晶片基底的晶体缺陷数。

公开(公告)号：US07700381B2

公开(公告)日：2010-04-20

申请号：US11350027

申请日：2006-02-09

申请人： Tsunetoshi Arikado ,  Masao Iwase ,  Soichi Nadahara ,  Yuso Udo ,  Yukihiro Ushiku ,  Shinichi Nitta ,  Moriya Miyashita ,  Junji Sugamoto ,  Hiroaki Yamada ,  Hajime Nagano ,  Katsujiro Tanzawa ,  Hiroshi Matsushita ,  Norihiko Tsuchiya ,  Katsuya Okumura

发明人： Tsunetoshi Arikado ,  Masao Iwase ,  Soichi Nadahara ,  Yuso Udo ,  Yukihiro Ushiku ,  Shinichi Nitta ,  Moriya Miyashita ,  Junji Sugamoto ,  Hiroaki Yamada ,  Hajime Nagano ,  Katsujiro Tanzawa ,  Hiroshi Matsushita ,  Norihiko Tsuchiya ,  Katsuya Okumura

IPC分类号： G01R31/26 ,  H01L21/66

CPC分类号： H01L23/544 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/54433 ,  H01L2223/54493 ,  H01L2924/0002 ,  Y10S438/974 ,  H01L2924/00

摘要： A semiconductor wafer has a bevel contour formed along the periphery thereof, products formed on the wafer, and an ID mark formed on the bevel contour. The ID mark shows at least the properties, manufacturing conditions, and test results of the products.

摘要翻译： 半导体晶片具有沿其周边形成的斜面轮廓，形成在晶片上的产品和形成在斜面轮廓上的ID标记。 ID标记至少显示产品的性能，制造条件和测试结果。

公开(公告)号：US07221991B2

公开(公告)日：2007-05-22

申请号：US11068778

申请日：2005-03-02

申请人： Hiroshi Matsushita ,  Tomonobu Noda ,  Kenichi Kadota ,  Junji Sugamoto ,  Yukihiro Ushiku

发明人： Hiroshi Matsushita ,  Tomonobu Noda ,  Kenichi Kadota ,  Junji Sugamoto ,  Yukihiro Ushiku

IPC分类号： G06F19/00

CPC分类号： H01L22/20 ,  G01R31/2894 ,  G05B23/0248 ,  G05B2219/31357 ,  Y02P90/14

摘要： A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.

摘要翻译： 一种制造装置的控制系统，包括制造信息输入单元，其获取控制制造装置的装置参数的时间序列数据; 故障模式分类模块将每个晶片的故障平面内分布分为故障模式; 索引计算单元，被配置为通过算法对所述时间序列数据进行统计处理，以计算与各个算法对应的索引; 索引分析单元，提供分类有和没有目标故障模式的索引的第一和第二频率分布，以实现第一和第二频率分布之间的显着性测试; 异常参数提取单元通过比较显着性检验值与检测参考值，提取失效原因指标的故障模式。

公开(公告)号：US20060064188A1

公开(公告)日：2006-03-23

申请号：US11217592

申请日：2005-09-02

申请人： Yukihiro Ushiku ,  Hidenori Kakinuma ,  Tsutomu Miki ,  Junji Sugamoto ,  Akira Ogawa ,  Yoshinori Ookawauchi ,  Giichi Inoue ,  Tomomi Ino

发明人： Yukihiro Ushiku ,  Hidenori Kakinuma ,  Tsutomu Miki ,  Junji Sugamoto ,  Akira Ogawa ,  Yoshinori Ookawauchi ,  Giichi Inoue ,  Tomomi Ino

IPC分类号： G06F19/00

CPC分类号： G05B19/41865 ,  G05B2219/31372 ,  G05B2219/31395 ,  G05B2219/31455 ,  G06Q30/0283 ,  Y02P90/12 ,  Y02P90/18 ,  Y02P90/20

摘要： A process-state management system encompasses: a plurality of production machines; a control server configured to collectively control at least part of the production machines; a management server including a data-linking module configured to link operation-management data of the production machines with corresponding management information transmitted from the control server, respectively, the management server analyze the operation-management data linked with the management information with a common analysis application; and a management database configured to store the operation-management data linked with the management information.

摘要翻译： 过程状态管理系统包括：多个生产机器; 控制服务器，其被配置为共同控制所述生产机器的至少一部分; 管理服务器，其包括分别将生产机的运行管理数据与从控制服务器发送的相应的管理信息相连接的数据链接模块，所述管理服务器分析与所述管理信息相关联的运行管理数据， 应用; 以及管理数据库，被配置为存储与管理信息相关联的操作管理数据。