公开(公告)号：US20060287754A1

公开(公告)日：2006-12-21

申请号：US11471675

申请日：2006-06-21

申请人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

发明人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

IPC分类号： G06F19/00

CPC分类号： G05B19/41875 ,  G05B2219/31477 ,  G05B2219/32057 ,  G05B2219/32097 ,  G05B2219/45031 ,  Y02P90/12 ,  Y02P90/20 ,  Y02P90/22

摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

公开(公告)号：US07831330B2

公开(公告)日：2010-11-09

申请号：US12458421

申请日：2009-07-10

申请人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

发明人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

IPC分类号： G06F19/00

CPC分类号： G05B19/41875 ,  G05B2219/31477 ,  G05B2219/32057 ,  G05B2219/32097 ,  G05B2219/45031 ,  Y02P90/12 ,  Y02P90/20 ,  Y02P90/22

摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

摘要翻译： 过程控制系统包括：准备设备信息的参考监视值和特征量之间的相关性的客户端计算机;准备描述作为实际制造过程中的第一设定值的处理配方的制造执行系统， 所述控制参数，设备信息收集部分，其在具有所述第一设定值的实际制造过程的操作中收集所述设备信息的客观监视值;特征量计算部，其计算与所监视的目标对应的特征量的值 基于相关性的值，参数计算部，其基于特征量的值计算实际制造过程中的第二设定值;以及装置控制单元，其将处理配方改变为第二设定值为 设定第二步的值。

公开(公告)号：US20090276078A1

公开(公告)日：2009-11-05

申请号：US12458421

申请日：2009-07-10

申请人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

发明人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

IPC分类号： G06F19/00

CPC分类号： G05B19/41875 ,  G05B2219/31477 ,  G05B2219/32057 ,  G05B2219/32097 ,  G05B2219/45031 ,  Y02P90/12 ,  Y02P90/20 ,  Y02P90/22

摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

公开(公告)号：US07596421B2

公开(公告)日：2009-09-29

申请号：US11471675

申请日：2006-06-21

申请人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

发明人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

IPC分类号： G06F19/00

CPC分类号： G05B19/41875 ,  G05B2219/31477 ,  G05B2219/32057 ,  G05B2219/32097 ,  G05B2219/45031 ,  Y02P90/12 ,  Y02P90/20 ,  Y02P90/22

摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

摘要翻译： 过程控制系统包括：准备设备信息的参考监视值和特征量之间的相关性的客户端计算机;准备描述作为实际制造过程中的第一设定值的处理配方的制造执行系统， 所述控制参数，设备信息收集部分，其在具有所述第一设定值的实际制造过程的操作中收集所述设备信息的客观监视值;特征量计算部，其计算与所监视的目标对应的特征量的值 基于相关性的值，参数计算部，其基于特征量的值计算实际制造过程中的第二设定值;以及装置控制单元，其将处理配方改变为第二设定值为 设定第二步的值。

公开(公告)号：US20070233302A1

公开(公告)日：2007-10-04

申请号：US11600791

申请日：2006-11-17

申请人： Kunihiro Miyazaki ,  Yoshihiro Ogawa ,  Shoichi Harakawa

发明人： Kunihiro Miyazaki ,  Yoshihiro Ogawa ,  Shoichi Harakawa

IPC分类号： G06F19/00

CPC分类号： G05B19/41865 ,  G05B2219/32097 ,  G05B2219/32275 ,  G05B2219/45031 ,  Y02P90/20 ,  Y02P90/265

摘要： A system for controlling production of electronic devices includes a recipe creation unit creating a processing recipe describing processing conditions for first and second processes so as to satisfy a production specification of a characteristic and a yield rate of the electronic devices, and an additional recipe describing additional processing conditions determined based on a relation of the characteristic and the yield rate to a latency time between a completion time of the first process and a start time of the second process so as to satisfy the production specification; and a recipe designation module designating the additional recipe for processing of intermediate products of the electronic devices, produced by the first process, when the latency time exceeds a reference.

摘要翻译： 一种用于控制电子设备生产的系统包括：配方创建单元，其创建描述第一和第二处理的处理条件的处理配方，以满足电子设备的特性和成品率的生产规格，以及描述附加的附加配方 基于特性和产率的关系确定的处理条件与第一处理的完成时间和第二处理的开始时间之间的等待时间以满足生产规范; 以及当延迟时间超过参考时，指定由第一处理产生的电子设备的中间产品的处理的附加配方的配方指定模块。

公开(公告)号：US06745094B1

公开(公告)日：2004-06-01

申请号：US09606173

申请日：2000-06-29

申请人： Shoichi Harakawa ,  Makoto Ikeda ,  Etsuo Fukuda

发明人： Shoichi Harakawa ,  Makoto Ikeda ,  Etsuo Fukuda

IPC分类号： G06F1900

CPC分类号： G05B19/41865 ,  G05B2219/32074 ,  G05B2219/32196 ,  G05B2219/32297 ,  G05B2219/45031 ,  Y02P90/20 ,  Y02P90/22

摘要： A semiconductor processing process control system includes a process controller main body (100) for controlling processes for semiconductor processing independently from semiconductor processing devices and contents of intended processing, and a control variable computation programs (210) for obtaining control conditions for semiconductor processing adaptive to semiconductor processing devices and contents of intended processing. The control variable computation programs (210) are used by plugging necessary one of them into the process controller main body (100). When there is any change in semiconductor processing device and content of processing, the system can cope with such changes by merely modifying the control variable computation programs (210). Therefore, the system flexibly, quickly copes with changes in process for processing, computing method of control variables and processing device.

公开(公告)号：US07556899B2

公开(公告)日：2009-07-07

申请号：US11389114

申请日：2006-03-27

申请人： Makoto Ikeda ,  Shoichi Harakawa ,  Takuya Kono

发明人： Makoto Ikeda ,  Shoichi Harakawa ,  Takuya Kono

IPC分类号： G03F9/00 ,  G06F19/00

CPC分类号： G03F7/70633 ,  G03F7/70525

摘要： A system for controlling an overlay includes a processing data receiving module receiving a processing data string describing a name of an exposure process for a target layer and an original control set value of overlays between the target layer and underlying layers below the target layer; an inspection data receiving module receiving inspection data strings describing names of inspection processes and inspection values determined by the inspection processes inspecting respective overlays between the target layer and the underlying layers; a data combining module combining the processing data string and each of the inspection data strings using a combining condition table so as to create a correction data table; and a control set value calculation module calculating a corrected control set value based on the inspection values of the correction data table.

摘要翻译： 用于控制覆盖的系统包括处理数据接收模块，其接收描述目标层的曝光处理的名称的处理数据串和目标层之下的目标层和下层之间的覆盖层的原始控制集值; 检查数据接收模块，接收描述由检查过程确定的检查过程名称和检查值的检查数据串，检查目标层和下层之间的各个覆盖层; 数据组合模块，其使用组合条件表来组合处理数据串和每个检查数据串，以便创建校正数据表; 以及控制设定值计算模块，基于校正数据表的检查值来计算校正后的控制设定值。

公开(公告)号：US20050170262A1

公开(公告)日：2005-08-04

申请号：US11024322

申请日：2004-12-29

申请人： Takuya Kono ,  Nobuhiro Komine ,  Tatsuhiko Higashiki ,  Shoichi Harakawa ,  Makoto Ikeda

发明人： Takuya Kono ,  Nobuhiro Komine ,  Tatsuhiko Higashiki ,  Shoichi Harakawa ,  Makoto Ikeda

IPC分类号： G03F7/30 ,  G03C1/492 ,  G03C1/494 ,  G03C1/76 ,  G03C5/00 ,  G03F7/20 ,  G03F9/00 ,  G03G15/08 ,  G21K5/00 ,  H01L21/00 ,  H01L21/027

CPC分类号： H01L21/67253

摘要： An exposure processing system comprises an exposure apparatus to expose a resist on a wafer, a heating apparatus comprising heating apparatus units, the heating apparatus heating the exposed resist by a heating apparatus unit in the heating apparatus units, a developing apparatus comprising developing apparatus units, the developing apparatus developing the exposed and heated resist by a developing apparatus unit in the developing apparatus units, and a control apparatus to control the exposure apparatus by using correction data so that a wafer on process object being exposed, the correction data being data for correcting a dimensional dispersion of a resist pattern caused by a pair of heating apparatus unit and developing apparatus unit used for the wafer on the process object, the pair of heating and developing apparatus unit comprising a heating and developing apparatus unit in the heating and developing apparatus used for the wafer on the process object.

摘要翻译： 曝光处理系统包括：曝光装置，用于在晶片上曝光抗蚀剂，加热装置包括加热装置单元，加热装置通过加热装置单元中的加热装置加热曝光的抗蚀剂;显影装置，包括显影装置单元， 显影装置通过显影装置单元中的显影装置单元显影曝光和加热的抗蚀剂;以及控制装置，通过使用校正数据来控制曝光装置，使得处理对象被曝光的晶片，校正数据是用于校正的数据 由一对加热装置单元和用于处理对象上的晶片的显影装置单元引起的抗蚀剂图案的尺寸分散，所述一对加热显影装置单元包括使用的加热和显影装置中的加热和显影装置单元 用于处理对象上的晶圆。

公开(公告)号：US06505090B1

公开(公告)日：2003-01-07

申请号：US09460415

申请日：1999-12-14

申请人： Shoichi Harakawa

发明人： Shoichi Harakawa

IPC分类号： G06F1900

CPC分类号： H01L21/67276 ,  H01L21/67253 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： Semiconductor device manufacturing method for processing condition described as function of metrology process name, and performing semiconductor device measurement, generating new processing condition by linking the measurement result with the processing condition, and manufacturing the semiconductor device itself under the new processing condition is provided. Moreover, manufacturing support system for assisting this manufacturing method, a manufacturing system for execution, and further, a recording medium wherein a program and data for executing this manufacturing method are stored are provided.

摘要翻译： 提供了作为测量过程名称的功能的处理条件的半导体器件制造方法，并且执行半导体器件测量，通过将测量结果与处理条件相关联来生成新的处理条件，并且在新的处理条件下制造半导体器件本身。 此外，提供了用于辅助该制造方法的制造支持系统，用于执行的制造系统，以及其中存储用于执行该制造方法的程序和数据的记录介质。

公开(公告)号：US07630052B2

公开(公告)日：2009-12-08

申请号：US11024322

申请日：2004-12-29

申请人： Takuya Kono ,  Nobuhiro Komine ,  Tatsuhiko Higashiki ,  Shoichi Harakawa ,  Makato Ikeda

发明人： Takuya Kono ,  Nobuhiro Komine ,  Tatsuhiko Higashiki ,  Shoichi Harakawa ,  Makato Ikeda

IPC分类号： G03B27/32 ,  G03B27/54 ,  G03D5/00 ,  G03C5/00 ,  H01L21/00

CPC分类号： H01L21/67253

摘要： An exposure processing system comprises an exposure apparatus to expose a resist on a wafer, a heating apparatus comprising heating apparatus units, the heating apparatus heating the exposed resist by a heating apparatus unit in the heating apparatus units, a developing apparatus comprising developing apparatus units, the developing apparatus developing the exposed and heated resist by a developing apparatus unit in the developing apparatus units, and a control apparatus to control the exposure apparatus by using correction data so that a wafer on process object being exposed, the correction data being data for correcting a dimensional dispersion of a resist pattern caused by a pair of heating apparatus unit and developing apparatus unit used for the wafer on the process object, the pair of heating and developing apparatus unit comprising a heating and developing apparatus unit in the heating and developing apparatus used for the wafer on the process object.

摘要翻译： 曝光处理系统包括：曝光装置，用于在晶片上曝光抗蚀剂，加热装置包括加热装置单元，加热装置通过加热装置单元中的加热装置加热曝光的抗蚀剂;显影装置，包括显影装置单元， 显影装置通过显影装置单元中的显影装置单元显影曝光和加热的抗蚀剂;以及控制装置，通过使用校正数据来控制曝光装置，使得处理对象被曝光的晶片，校正数据是用于校正的数据 由一对加热装置单元和用于处理对象上的晶片的显影装置单元引起的抗蚀剂图案的尺寸分散，所述一对加热显影装置单元包括使用的加热和显影装置中的加热和显影装置单元 用于处理对象上的晶圆。