Abstract:
A package manufacturing method of the present invention is a method of manufacturing a package with a recessed cavity formed in at least one of first and second substrates formed of a glass material and includes a cavity forming step of forming the cavity by performing press molding on at least one molded substrate of the first and second substrates and a heat treatment step of heating the molded substrate formed with the cavity.
Abstract:
There are provided a piezoelectric vibrating reed capable of securing a stable bonding strength between a bump and the piezoelectric vibrating reed, a piezoelectric vibrator having the piezoelectric vibrating reed, a method for manufacturing the piezoelectric vibrator, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. A piezoelectric vibrating reed includes: a vibrating portion; a base portion adjacent to the vibrating portion; excitation electrodes formed in the vibrating portion; mount electrodes formed in the base portion; and extraction electrodes for electrically connecting the excitation electrodes and the mount electrodes to each other. A bonding film made of gold is formed on the surfaces of the mount electrodes, and the bonding film is formed to a thickness such that, when the bonding film is ultrasonically bonded to a bump made of gold, mutual diffusion occurs over approximately the entire area in the thickness direction of the bonding film.
Abstract:
Providing a piezoelectric vibrator which is capable of securing the degree of vacuum in a cavity and can be manufactured with high efficiency and to provide a manufacturing method thereof. A piezoelectric vibrator 1 including: a base board 2 and a lid board 3 which are superimposed onto each other so as to form a cavity C therebetween; a piezoelectric vibrating reed 4 which is accommodated in the cavity and bonded to the base board; a gettering material 34 which is formed in the base board to be accommodated in the cavity; a bonding film 35 which is formed on the entire surface of the lid board facing the base board so as to bond both boards to each other at a portion thereof being in contact with the base board, wherein the bonding film is formed of a material which is capable of absorbing surrounding gas by being activated with laser irradiation.
Abstract:
The piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed of a cylindrical body, which is formed of a glass material to have two flat ends and a thickness substantially equal to that of the base substrate, and is implanted in the through-hole running through the base substrate; and an electroconductive core member which is formed to have two flat ends and a thickness substantially equal to that of the base substrate and is inserted into the center hole of the cylindrical body; and the through-hole, the cylindrical body and the core member are integrally fixed to each other by firing.
Abstract:
A method of manufacturing packages having contents sealed therein, including: a step of forming cavities in a plurality of package forming areas on a first wafer; a step of bonding the first wafer and a second wafer while arranging the contents in the cavities; and a step of irradiating a bonded wafer member with a laser and separating the packages into pieces, characterized in that dummy cavities are formed on an outside of the package forming area in an outermost periphery of the first wafer in the cavity forming step.
Abstract:
Provide a highly efficient manufacturing method of a piezoelectric vibrator and to provide a piezoelectric vibrator manufactured by this manufacturing method. A method for manufacturing a piezoelectric vibrator 1 including: a base board 2 and a lid board 3 which are superimposed on each other so as to form a cavity therebetween; a piezoelectric vibrating reed 4 which is accommodated in the cavity and bonded to the base board; a bonding film 35 which is formed on the entire surface of the lid board on the opposite side to the base board so as to bond both boards to each other at a portion thereof being in contact with the base board, wherein the piezoelectric vibrating reed includes a pair of vibrating arms 10 and 11 and a weight metal film 21 formed on a tip end of each of the vibrating arms, wherein the bonding film is formed of a material which is capable of absorbing surrounding gas by being activated with laser irradiation, and wherein the method includes a laser irradiation step of simultaneously irradiating the weight metal film and the bonding film with a laser beam.
Abstract:
To provide a piezoelectric vibrator manufacturing method that curbs a dispersion of a bonding film at a time of a gettering step and with which good electrical characteristics can be obtained, and an oscillator, electronic device, and atomic timepiece, in which is mounted a piezoelectric vibrator with which good electrical characteristics can be obtained. A manufacturing method includes a gettering step whereby a getter material is irradiated with a first laser penetrating a base substrate from the outer side of the base substrate, activating the getter material so that it adsorbs gas existing inside a cavity, and a frequency adjustment step whereby a weight metal film formed at leading ends of vibrating arms of a piezoelectric vibrating piece is irradiated with a second laser penetrating the base substrate from the outer side of the base substrate, thus adjusting the frequency of the piezoelectric vibrating piece, wherein the intensity of the first laser in the gettering step is weaker than the intensity of the second laser in the frequency adjustment step.
Abstract:
A piezoelectric vibrator includes a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions; a package that accommodates the piezoelectric vibrating reed; and a getter material that is formed along the longitudinal direction of the vibration arm portion in an inner portion of the package, wherein a cross-sectional area of a middle portion of the getter material adjacent to a center portion of the longitudinal direction of the vibration arm portion is greater than that of an end portion of the getter material.
Abstract:
To provide a bonded glass cutting method whereby it is possible to suppress an occurrence of a crush or chipping when bonded glass is cut, and cut the bonded glass into pieces of a predetermined size, a package manufacturing method, a package, a piezoelectric vibrator, an oscillator, an electronic device, and an atomic timepiece. A bonded glass cutting method includes a scribing step, which irradiates a lid substrate wafer with a laser beam with a wavelength absorbed by a wafer bonded body along outlines, thus forming scribe lines on the lid substrate wafer, and a breaking step which, by cutting the wafer bonded body by applying a fracture stress to the scribe lines, dices the wafer bonded body into a plurality of piezoelectric vibrators, wherein a cutting step is carried out in a condition in which the wafer bonded body is placed on silicon rubber, and an outside end face of the lid substrate wafer is caused to face the silicon rubber.
Abstract:
Provided are: a piezoelectric oscillation piece which has a pair of oscillation arms disposed in parallel with each other with base ends of the oscillation arms fixed to a base of the piezoelectric oscillation piece and with weight metal films formed at the tips of the oscillation arms; a base substrate on the upper surface of which the piezoelectric oscillation piece is mounted; a lid substrate joined with the base substrate such that the mounted piezoelectric oscillation piece can be accommodated in a cavity; and a control film disposed in the vicinity of the pair of the oscillation arms as viewed in the plan view and formed at least on either of the substrates in such a manner as to extend from the base end side to the tip side in the longitudinal direction of the oscillation arms for increasing the degree of vacuum inside the cavity by heating. The control film is locally deposited on the side surfaces of the oscillation arms in the vicinity of the control film by heating.