摘要:
A resonation element includes a basal portion, resonating arms extending out in a Y-axis direction from the basal portion, and a vibration substrate, formed of single crystal silicon, in which a Z-axis direction is set to a thickness direction, and is configured such that the resonating arms are flexurally vibrated in an XY in-plane direction. In addition, when resonation frequencies of the resonating arms are set to F [kHz], widths of the resonating arms are set to W [μm], and lengths of the resonating arms are set to L [μm], at least one expression of the following Expression (1) and the following Expression (2) is satisfied. W
摘要:
Tuning fork and method in which a pair of elongated tines having front and rear surfaces are disposed symmetrically about an axis, and balancing masses on the front surface of one tine and on the rear surface of the other tine are trimmed to reduce quadrature error and also to maintain mass balance between the tines.
摘要:
A resonation element includes a basal portion, resonating arms extending out in a Y-axis direction from the basal portion, and a vibration substrate, formed of single crystal silicon, in which a Z-axis direction is set to a thickness direction, and is configured such that the resonating arms are flexurally vibrated in an XY in-plane direction. In addition, when resonation frequencies of the resonating arms are set to F [kHz], widths of the resonating arms are set to W [μm], and lengths of the resonating arms are set to L [μm], at least one expression of the following Expression (1) and the following Expression (2) is satisfied. W
摘要:
The object of the invention is to provide an improved structure for a microelectromechanical (MEMS) resonator. According to a first aspect of the invention, the resonator structure in accordance with the invention has a characteristic frequency of oscillation in combination with a given mechanical amplitude, whereby to set said mechanical amplitude, in the resonator structure, by way anchoring at an anchor point located at a given point of the resonator structure substrate, a first element is adapted oscillatory and a second element is adapted oscillatory in such a manner that at least one of said first element and of said second element are arranged to oscillate synchronously with regard to said anchor point, whereby the location of said anchor point is selected to be substantially within the joint projection defined by the dimensions of said first and said second element.
摘要:
A method of manufacturing packages having contents sealed therein, including: a step of forming cavities in a plurality of package forming areas on a first wafer; a step of bonding the first wafer and a second wafer while arranging the contents in the cavities; and a step of irradiating a bonded wafer member with a laser and separating the packages into pieces, characterized in that dummy cavities are formed on an outside of the package forming area in an outermost periphery of the first wafer in the cavity forming step.
摘要:
There is provided a resonant-oscillating-device fabrication method comprising a thickness measurement step of measuring a thickness of a substrate, a piezoelectric-layer formation condition determination step of determining conditions of forming a piezoelectric layer to bring frequency of resonant oscillation of an oscillating element to a desired resonant frequency in accordance with the thickness of the substrate measured in the thickness measurement step, and a piezoelectric-element formation step of forming the piezoelectric element in accordance with the piezoelectric-layer formation conditions determined in the piezoelectric-layer formation condition determination step.
摘要:
A method of manufacturing packages having contents sealed therein, including: a step of forming cavities in a plurality of package forming areas on a first wafer; a step of bonding the first wafer and a second wafer while arranging the contents in the cavities; and a step of irradiating a bonded wafer member with a laser and separating the packages into pieces, characterized in that dummy cavities are formed on an outside of the package forming area in an outermost periphery of the first wafer in the cavity forming step.
摘要:
Tuning fork and method in which a pair of elongated tines having front and rear surfaces are disposed symmetrically about an axis, and balancing masses on the front surface of one tine and on the rear surface of the other tine are trimmed to reduce quadrature error and also to maintain mass balance between the tines.
摘要:
Tuning fork and method in which a pair of elongated tines having front and rear surfaces are disposed symmetrically about an axis, and balancing masses on the front surface of one tine and on the rear surface of the other tine are trimmed to reduce quadrature error and also to maintain mass balance between the tines.
摘要:
The object of the invention is to provide an improved structure for a microelectromechanical (MEMS) resonator. According to a first aspect of the invention, the resonator structure in accordance with the invention has a characteristic frequency of oscillation in combination with a given mechanical amplitude, whereby to set said mechanical amplitude, in the resonator structure, by way anchoring at an anchor point located at a given point of the resonator structure substrate, a first element is adapted oscillatory and a second element is adapted oscillatory in such a manner that at least one of said first element and of said second element are arranged to oscillate synchronously with regard to said anchor point, whereby the location of said anchor point is selected to be substantially within the joint projection defined by the dimensions of said first and said second element.