公开(公告)号：US20150043228A1

公开(公告)日：2015-02-12

申请号：US14151192

申请日：2014-01-09

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hideyuki KOGURE ,  Yuuta YAMADA ,  Takeshi IKUTA ,  Toshiyuki HAYAKAWA ,  Junichi ASADA

IPC: F21K99/00 ,  H05K1/18 ,  H01L21/78

CPC classification number: F21K9/30 ,  F21K9/20 ,  F21Y2115/10 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/73 ,  H01L24/97 ,  H01L25/167 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15151 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/186 ,  H05K2201/10106 ,  H05K2201/10159 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85

Abstract: According to one embodiment, a semiconductor device includes a board, a controller chip, a semiconductor chip, a sealing portion, and a component. The board includes a first surface and a second surface opposite to the first surface, the first surface comprising a terminal. The controller chip is on the second surface of the board. The semiconductor chip is on the second surface of the board. The sealing portion integrally covers the controller chip and the semiconductor chip and does not cover a region of the second surface of the board. The component is on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.

Abstract translation: 根据一个实施例，半导体器件包括板，控制器芯片，半导体芯片，密封部分和部件。 板包括与第一表面相对的第一表面和第二表面，第一表面包括端子。 控制器芯片位于电路板的第二个表面上。 半导体芯片位于板的第二表面上。 密封部一体地覆盖控制器芯片和半导体芯片，并且不覆盖板的第二表面的区域。 该部件位于板的第二表面的区域上，以对半导体器件的外部进行操作。

公开(公告)号：US20170214169A1

公开(公告)日：2017-07-27

申请号：US15255695

申请日：2016-09-02

Applicant: Kabushiki Kaisha Toshiba

Inventor： Toshiyuki HAYAKAWA ,  Shiro HARASHIMA

IPC: H01R13/447 ,  H01R24/60 ,  G06F1/16

CPC classification number: H01R13/447 ,  G06F1/1656 ,  G06F1/181 ,  G06K19/07732 ,  H01R24/60 ,  H01R2107/00 ,  H05K5/0278

Abstract: According to an embodiment, an electronic device includes: a housing including a first face facing a first direction, a second face on an opposite side of the first face, and a third face adjacent to the first and second faces; a connector protruding from the third face; and a first cover connected to the housing, including a fourth face, and being pivotable between a first position where the fourth face faces the first direction and a second position where the fourth face faces the first face. The first cover includes a first stopper that, when the t cover pivots from the first position to the second position, contacts the connector and is elastically deformable in a direction that is a pivoting axial direction of the first cover and is a separating direction from the connector.

公开(公告)号：US20170071075A1

公开(公告)日：2017-03-09

申请号：US15062359

申请日：2016-03-07

Applicant: Kabushiki Kaisha Toshiba

Inventor： Toshiyuki HAYAKAWA ,  Shiro HARASHIMA

IPC: H05K7/20 ,  G06K19/077 ,  H05K5/02

CPC classification number: H05K7/2039 ,  G06K19/07732 ,  H05K5/0278 ,  H05K7/20445

Abstract: A semiconductor storage device includes a substrate having a wiring, a first semiconductor memory, a terminal portion, a holder surrounding the terminal portion, a case, and a first plate-shaped member. The first semiconductor memory is disposed on a first principal surface of the substrate and is connected to the wiring. The terminal portion is connected to the substrate at a first end portion of the substrate and has a terminal connected to the wiring. The case houses part of the holder, the substrate, and the first semiconductor memory. Between the first principal surface and a first wall portion of the case facing the first principal surface, the first plate-shaped member is disposed. The first plate-shaped member is connected to the holder and the first principal surface on a second end portion side of the substrate, and has thermal conductivity.

Abstract translation: 半导体存储装置包括具有布线的基板，第一半导体存储器，端子部分，围绕端子部分的保持器，壳体和第一板状构件。 第一半导体存储器设置在基板的第一主表面上并连接到布线。 端子部分在基板的第一端部处连接到基板，并且具有连接到布线的端子。 壳体容纳保持器，基板和第一半导体存储器的一部分。 在第一主表面和面向第一主表面的壳体的第一壁部之间设置第一板状构件。 第一板状构件连接到基板的支架和第二端部侧的第一主面，并具有导热性。

公开(公告)号：US20140168882A1

公开(公告)日：2014-06-19

申请号：US13775411

申请日：2013-02-25

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Toshiyuki HAYAKAWA

IPC: G06F1/16

CPC classification number: G06F1/16 ,  H05K5/0278

Abstract: According to one embodiment, a semiconductor device includes a housing including a first wall and a second wall opposite to the first wall, a board in the housing, a first supporter provided on the first wall and configured to support an end of the board in a direction substantially parallel to the first wall, a stopper in the housing, the stopper configured to support the board, and a second supporter provided on the second wall and configured to support the stopper.

Abstract translation: 根据一个实施例，半导体器件包括壳体，其包括第一壁和与第一壁相对的第二壁，壳体中的板，设置在第一壁上并被构造成将板的一端支撑在第一壁中的第一支撑件 方向基本上平行于第一壁，壳体中的止动件，构造成支撑板的止动件，以及设置在第二壁上并构造成支撑止动件的第二支撑件。