公开(公告)号：US20230282536A1

公开(公告)日：2023-09-07

申请号：US17897077

申请日：2022-08-26

Applicant: KIOXIA CORPORATION

Inventor： Kazushige Kawasaki ,  Satoru Itakura

IPC: H01L23/31 ,  H01L25/065 ,  H01L21/56 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/552 ,  H01L24/48 ,  H01L25/0657 ,  H01L21/568 ,  H01L24/05 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562

Abstract: According to one embodiment, a semiconductor device includes a wiring substrate having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface. A first electrode is on the first surface. A semiconductor element is on the wiring substrate and electrically connected to the first electrode. A resin layer covers the semiconductor element and the first surface from a first direction orthogonal to the first surface. A portion of the resin layer contacts the side surface of the wiring substrate from a second direction parallel to the first surface. The resin layer has an outside side surface that is substantially parallel to the first direction.