公开(公告)号：US20150076359A1

公开(公告)日：2015-03-19

申请号：US14335442

申请日：2014-07-18

Applicant: KLA-Tencor Corporation

Inventor： Alexander Bykanov ,  Oleg Khodykin ,  Daniel C. Wack ,  Konstantin Tsigutkin ,  Layton Hale ,  Joseph Walsh ,  Frank Chilese

IPC: H05G2/00 ,  G01N21/956 ,  G03F7/20 ,  G01J1/16

CPC classification number: H05G2/008 ,  G01J1/16 ,  G01N21/956 ,  G01N2021/95676 ,  G01N2201/061 ,  G03F1/84 ,  G03F7/70033 ,  G03F7/70891 ,  H05H2240/00

Abstract: An EUV light source includes a rotatable, cylindrically-symmetric element having a surface coated with a plasma-forming target material, a drive laser source configured to generate one or more laser pulses sufficient to generate EUV light via formation of a plasma by excitation of the plasma-forming target material, a set of focusing optics configured to focus the one or more laser pulses onto the surface of the rotatable, cylindrically-symmetric element, a set of collection optics configured to receive EUV light emanated from the generated plasma and further configured to direct the illumination to an intermediate focal point, and a gas management system including a gas supply subsystem configured to supply plasma-forming target material to the surface of the rotatable, cylindrically-symmetric element.

Abstract translation: EUV光源包括可旋转的圆柱对称元件，其具有涂覆有等离子体形成目标材料的表面;驱动激光源，被配置为产生足以通过激发等离子体产生EUV光的一个或多个激光脉冲 等离子体形成目标材料，一组聚焦光学元件，其被配置为将一个或多个激光脉冲聚焦到可旋转的圆柱形对称元件的表面上;一组收集光学器件，被配置为接收从所产生的等离子体发出的EUV光，并进一步配置 将照明引导到中间焦点，以及气体管理系统，其包括被配置为将等离子体形成目标材料供应到可旋转的圆柱对称元件的表面的气体供应子系统。

公开(公告)号：US09544984B2

公开(公告)日：2017-01-10

申请号：US14335442

申请日：2014-07-18

Applicant: KLA-Tencor Corporation

Inventor： Alexander Bykanov ,  Oleg Khodykin ,  Daniel C. Wack ,  Konstantin Tsigutkin ,  Layton Hale ,  Joseph Walsh ,  Frank Chilese ,  Rudy F. Garcia ,  Brian Ahr

IPC: G01J1/42 ,  H05G2/00 ,  G01J1/16 ,  G01N21/956 ,  G03F7/20

CPC classification number: H05G2/008 ,  G01J1/16 ,  G01N21/956 ,  G01N2021/95676 ,  G01N2201/061 ,  G03F1/84 ,  G03F7/70033 ,  G03F7/70891 ,  H05H2240/00

Abstract: An EUV light source includes a rotatable, cylindrically-symmetric element having a surface coated with a plasma-forming target material, a drive laser source configured to generate one or more laser pulses sufficient to generate EUV light via formation of a plasma by excitation of the plasma-forming target material, a set of focusing optics configured to focus the one or more laser pulses onto the surface of the rotatable, cylindrically-symmetric element, a set of collection optics configured to receive EUV light emanated from the generated plasma and further configured to direct the illumination to an intermediate focal point, and a gas management system including a gas supply subsystem configured to supply plasma-forming target material to the surface of the rotatable, cylindrically-symmetric element.

Abstract translation: EUV光源包括可旋转的圆柱对称元件，其具有涂覆有等离子体形成目标材料的表面;驱动激光源，被配置为产生足以通过激发等离子体产生EUV光的一个或多个激光脉冲 等离子体形成目标材料，一组聚焦光学元件，其被配置为将一个或多个激光脉冲聚焦到可旋转的圆柱形对称元件的表面上;一组收集光学器件，被配置为接收从所产生的等离子体发出的EUV光，并进一步配置 将照明引导到中间焦点，以及气体管理系统，其包括被配置为将等离子体形成目标材料供应到可旋转的圆柱对称元件的表面的气体供应子系统。

公开(公告)号：US09891356B1

公开(公告)日：2018-02-13

申请号：US14847875

申请日：2015-09-08

Applicant: KLA-Tencor Corporation

Inventor： Joseph Walsh ,  Frank Barkusky ,  Eduardo Soto ,  Sarbjit Singh Grewal ,  Orlando Threet ,  Gildardo Rios Delgado ,  Garry Allen Rose

IPC: G02B5/20 ,  G03F7/20 ,  G02B7/00

CPC classification number: G02B5/203 ,  G02B5/208 ,  G02B7/006 ,  G03F7/70191 ,  G03F7/708

Abstract: A device includes spectral purity filters (SPF) and structures for supporting SPF films. The device further includes a monolithic support having a mesh portion and a frame portion and a film overlaying at least a portion of the support. In some cases, the film can be affixed to the support without an adhesive. The monolithic support can be Silicon, stainless steel or some other suitable material and the film can be a single layer spectral purity filter film or a multilayer spectral purity filter film. The mesh portion of the support can include a plurality of through-holes that are formed by etching and/or eroding a thinned material such as silicon or stainless steel.