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    IN-LINE WAFER EDGE INSPECTION, WAFER PRE-ALIGNMENT, AND WAFER CLEANING
    1.
    发明申请
    IN-LINE WAFER EDGE INSPECTION, WAFER PRE-ALIGNMENT, AND WAFER CLEANING 有权
    在线波形边缘检查，波形预排列和波形清洗

    公开(公告)号：US20150370175A1

    公开(公告)日：2015-12-24

    申请号：US14741866

    申请日：2015-06-17

    申请人： KLA-Tencor Corporation

    发明人： Lena Nicolaides ,  Ben-ming Benjamin Tsai ,  Prashant A. Aji ,  Michael Gasvoda ,  Stanley E. Stokowski ,  Guoheng Zhao ,  Youxian Wen ,  Mohan Mahadevan ,  Paul D. Horn ,  Wolfgang Vollrath ,  Isabella T. Lewis

    IPC分类号： G03F7/20 ,  G01N21/95

    CPC分类号： G01N21/9503 ,  G01N2201/06113 ,  G03F7/7085 ,  H01L22/12

    摘要： Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.

    摘要翻译： 公开了用于检查和处理半导体晶片的方法和装置。 该系统包括边缘检测系统，用于接收将进行光刻工艺的每个晶片。 边缘检测系统包括用于将一个或多个照明光束朝向位于晶片的边界区域内的侧面，顶部和底部边缘部分引导的照明通道。 边缘检测系统还包括用于收集和感测从晶片的边缘部分散射或反射的输出辐射的收集模块和用于定位边缘部分中的缺陷的分析器模块，并且基于所感测到的每个晶片是否在规格范围内 这种晶片的输出辐射。 光刻系统被配置为从边缘检测系统接收已发现在规格范围内的每个晶片。 边缘检测系统与光刻系统成对连接。