公开(公告)号：US10159113B2

公开(公告)日：2018-12-18

申请号：US15111023

申请日：2015-01-09

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Holger Möench ,  Guenther Hans Derra ,  Stephan Gronenborn ,  Pavel Pekarski ,  Johanna Sophie Kolb ,  Ralf Gordon Conrads

IPC: H05B3/00 ,  H01L21/67 ,  C23C16/46 ,  C23C16/48 ,  C30B23/06 ,  C30B25/10 ,  H01L51/56 ,  H05B1/02

Abstract: The invention describes a heating system (100) and a corresponding method of heating a heating surface (180) of an object (150, 950) to a processing temperature of at least 100° C., wherein the heating system (100) comprises semiconductor light sources (115), and wherein the heating system (100) is adapted to heat an area element of the heating surface (180) with at least 50 semiconductor light sources (115) at the same time. The heating system (100) may be part of a reactor for processing semiconductor structures. The light emitted by means of the semiconductor light sources (115) overlaps at the heating surface (180). Differences of the characteristic of one single semiconductor light source (115) may be blurred at the heating surface (180) such that a homogeneous temperature distribution across a processing surface of a, for example, wafer may be enabled.

公开(公告)号：US10129986B2

公开(公告)日：2018-11-13

申请号：US15506035

申请日：2015-09-24

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Ralf Gordon Conrads ,  Hendrik Huisman ,  Carsten Deppe ,  Xi Gu ,  Gero Heusler

IPC: H05K1/14 ,  H05K1/11 ,  H05K3/36 ,  H05K3/34

Abstract: The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) for transmitting electrical current and at least one electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) comprising electrically insulating material, wherein the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) and the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) are arranged in an alternating assembly such that the two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) are electrically insulated with respect to each other by means of the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j), wherein each of the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) is adapted to be coupled to a bond wire (460a, 460b) independently from the other electrically conductive layer (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) at a side surface of the printed circuit board being inclined to the top side and the bottom side of the printed circuit board. The invention further describes a corresponding method of fabricating the printed circuit board. The invention further describes a printed circuit board arrangement comprising the printed circuit board and a corresponding method of fabricating the printed circuit board arrangement.

公开(公告)号：US09882346B2

公开(公告)日：2018-01-30

申请号：US15104599

申请日：2014-12-10

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Stephan Gronenborn ,  Gero Heusler ,  Ralf Gordon Conrads ,  Holger Moench

IPC: H01S5/024 ,  H01S5/022 ,  H01S5/02 ,  H01S5/42 ,  H01L23/50 ,  H01L23/544

CPC classification number: H01S5/02476 ,  H01L23/50 ,  H01L23/544 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01S5/0202 ,  H01S5/02268 ,  H01S5/02288 ,  H01S5/02469 ,  H01S5/423 ,  H01L2924/00

Abstract: The invention describes carrier structure (100, 200) for assembling a semiconductor lighting module, comprising at least two sub carriers (110, 210) and an alignment structure (120, 130, 230, 232) mechanically coupling the sub carriers (110, 210). The alignment structure (120, 130, 230, 232) is adapted such that the mechanical coupling to at least a part of the sub carriers (110, 210) disappears during thermal mating the carrier structure (100, 200) on a carrier (110, 250). The alignment structure (120, 130, 230, 232) is further adapted to compensate a coefficient of thermal expansion of a material of the carrier (110, 250) being higher than a coefficient of thermal expansion of a material of the carrier structure (100, 200). The invention further describes a semiconductor chip comprising such a carrier structure (100, 200) and a semiconductor lighting module comprising the carrier structure (100, 200) or the semiconductor chip. The invention finally describes a corresponding method of manufacturing a semiconductor lighting module. The invention enables assembling of semiconductor lighting modules by thermal mating with reduced alignment effort.