Abstract:
A showerhead for chemical vapor deposition includes: a plurality of reactive gas showerhead modules separated each other and having the same number as the number of kinds of reactive gases injected from the showerhead, each having a mixing zone in the reactive gas showerhead module to induce a mixing of a reactive gas and an injection support gas used to regulate the injection velocity of the reactive gas and a plurality of reactive gas injection tubes connected to the bottom surface of the reactive gas showerhead module for injecting the reactive gas mixed with the injection support gas over the substrate; and a purge gas showerhead module mounted under the reactive gas showerhead modules, with a purge gas supply port for supplying a purge gas to the purge gas showerhead module.
Abstract:
A showerhead is provided. The showerhead includes a body and a plurality of first dispersion pins. The body has one side having a plurality of injection holes penetrated therethrough and the other side facing the one side. The plurality of first dispersion pins protruding from the plurality of spray holes of the one side to the other side such that end portions thereof support the other side. The first dispersion holes have first gas inlet holes on one side and first passages connected to the first gas inlet holes therein. Gas introduced between the one side and the other side is immediately discharged to the outside of the body through the plurality of spray holes by passing the first gas inlet holes and the first passages.
Abstract:
A showerhead is provided. The showerhead includes a body and a plurality of first dispersion pins. The body has one side having a plurality of injection holes penetrated therethrough and the other side facing the one side. The plurality of first dispersion pins protruding from the plurality of spray holes of the one side to the other side such that end portions thereof support the other side. The first dispersion holes have first gas inlet holes on one side and first passages connected to the first gas inlet holes therein. Gas introduced between the one side and the other side is immediately discharged to the outside of the body through the plurality of spray holes by passing the first gas inlet holes and the first passages.
Abstract:
A reaction chamber for a chemical vapor apparatus is disclosed. The reaction chamber for the chemical vapor apparatus comprises a housing including an internal space and a susceptor disposed in the internal space so that a substrate is loaded on an upper surface of the susceptor. A shower head is disposed above the susceptor in the internal space of the housing to spray process gas towards the substrate side. An inner barrel with open top and bottom is placed inside the internal space of the reaction chamber so that an upper edge of the barrel is positioned near the showerhead to enclose the substrate and the susceptor. A driving part is connected to the inner barrel. When it is needed to replace the susceptor and the substrate, the inner barrel is changed into an open state in which the substrate and the susceptor disposed in the inner barrel are exposed to the outside of the inner barrel by an operation of the driving part. The inside of the reaction chamber for the chemical vapor apparatus is always closed and thus the reaction chamber is capable of easily replacing a substrate or a susceptor while the vacuum in the reaction chamber is still maintained.
Abstract:
A showerhead for chemical vapor deposition includes: a plurality of reactive gas showerhead modules separated each other and having the same number as the number of kinds of reactive gases injected from the showerhead, each having a mixing zone in the reactive gas showerhead module to induce a mixing of a reactive gas and an injection support gas used to regulate the injection velocity of the reactive gas and a plurality of reactive gas injection tubes connected to the bottom surface of the reactive gas showerhead module for injecting the reactive gas mixed with the injection support gas over the substrate; and a purge gas showerhead module mounted under the reactive gas showerhead modules, with a purge gas supply port for supplying a purge gas to the purge gas showerhead module.
Abstract:
A method for chemical vapor deposition using a showerhead through which at least one reactive gas and a purge gas are injected over a substrate, wherein the method includes: disposing the showerhead such that the bottom surface of the showerhead is spaced apart from the substrate by a predetermined distance; supplying a reactive gas and an injection support gas into the showerhead, wherein reactive gases of different kinds are respectively delivered into compartments formed at inside of the showerhead; mixing each reactive gas with its corresponding injection support gas in each mixing zone at inside of the showerhead; supplying a purge gas into a separated compartment at inside of the showerhead; and injecting the reactive gas mixed with the injection support gas and the purge gas through a plurality of reactive gas exits and a plurality of purge gas exits formed at the bottom surface of the showerhead, respectively.
Abstract:
A method for chemical vapor deposition using a showerhead through which at least one reactive gas and a purge gas are injected over a substrate, wherein the method includes: disposing the showerhead such that the bottom surface of the showerhead is spaced apart from the substrate by a predetermined distance; supplying a reactive gas and an injection support gas into the showerhead, wherein reactive gases of different kinds are respectively delivered into compartments formed at inside of the showerhead; mixing each reactive gas with its corresponding injection support gas in each mixing zone at inside of the showerhead; supplying a purge gas into a separated compartment at inside of the showerhead; and injecting the reactive gas mixed with the injection support gas and the purge gas through a plurality of reactive gas exits and a plurality of purge gas exits formed at the bottom surface of the showerhead, respectively.