公开(公告)号：US11770903B2

公开(公告)日：2023-09-26

申请号：US17511572

申请日：2021-10-27

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young Byun ,  Kwang-Deok Choi ,  Honguk Cheon

IPC: H05K3/38 ,  C23C18/18 ,  C23C18/31 ,  C23C28/02 ,  C23F1/02 ,  C23F17/00 ,  C25D5/34 ,  C25D5/48 ,  H05K3/06 ,  H05K3/10 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/388 ,  C23C18/1817 ,  C23C18/31 ,  C23C28/023 ,  C23F1/02 ,  C23F17/00 ,  C25D5/34 ,  C25D5/48 ,  H05K3/06 ,  H05K3/108 ,  H05K3/382 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/083 ,  H05K2203/072 ,  H05K2203/0723

Abstract: Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).