公开(公告)号：US11770903B2

公开(公告)日：2023-09-26

申请号：US17511572

申请日：2021-10-27

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young Byun ,  Kwang-Deok Choi ,  Honguk Cheon

IPC: H05K3/38 ,  C23C18/18 ,  C23C18/31 ,  C23C28/02 ,  C23F1/02 ,  C23F17/00 ,  C25D5/34 ,  C25D5/48 ,  H05K3/06 ,  H05K3/10 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/388 ,  C23C18/1817 ,  C23C18/31 ,  C23C28/023 ,  C23F1/02 ,  C23F17/00 ,  C25D5/34 ,  C25D5/48 ,  H05K3/06 ,  H05K3/108 ,  H05K3/382 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/083 ,  H05K2203/072 ,  H05K2203/0723

Abstract: Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

公开(公告)号：US11520091B2

公开(公告)日：2022-12-06

申请号：US16684016

申请日：2019-11-14

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young Byun ,  So Hye Cho ,  Seung Yong Lee ,  Kwang-Deok Choi ,  In Uk Baek ,  Yun Hee Kim

IPC: C23C14/00 ,  G02B5/28 ,  C23C14/08 ,  C23C14/06 ,  B32B15/00 ,  B32B3/10 ,  B32B3/12

Abstract: Provided is a coloring pattern structure. The coloring pattern structure includes: a substrate; a light-transmitting dielectric layer formed on at least one surface of the substrate; and a composite material layer disposed on an upper surface of the light-transmitting dielectric layer and formed of a metal and a first material not having a thermodynamic solid solubility in the metal, wherein the metal included in the composite material layer has a pattern coated only on portions of the upper surface of the light-transmitting dielectric layer, and the first material is coated on the remaining area where the metal is not coated.

公开(公告)号：US20240127999A1

公开(公告)日：2024-04-18

申请号：US18195343

申请日：2023-05-09

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young Byun ,  Kwang-Deok Choi ,  Soyeon Lee

IPC: H01F1/24 ,  H01F3/08

CPC classification number: H01F1/24 ,  H01F3/08

Abstract: The present exemplary embodiments may provide soft magnetic powder including metal powder and an oxide insulation film coating a surface of metal powder particles, in which the metal powder particles may include one or more selected from pure iron or an iron-based alloy and the oxide insulation film may include an oxide of a component constituting the metal powder particles.