公开(公告)号：US10975307B2

公开(公告)日：2021-04-13

申请号：US15865259

申请日：2018-01-09

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Munju Goh ,  Hyeonuk Yeo ,  Nam Ho You ,  Se Gyu Jang ,  Seokhoon Ahn ,  Young Soo Kim

IPC: G02F1/1333 ,  C09K19/38 ,  C09K19/12 ,  C09K19/30 ,  C09K19/32 ,  C09K19/22 ,  C09K19/16 ,  C09K19/24 ,  C09K19/34 ,  C09K19/20 ,  C09K19/04

Abstract: Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.

公开(公告)号：US10059593B2

公开(公告)日：2018-08-28

申请号：US15380460

申请日：2016-12-15

Applicant: Korea Institute of Science and Technology

Inventor： Munju Goh ,  Nam Ho You ,  Hyeonuk Yeo ,  Bon-Cheol Ku ,  Sang Jun Youn ,  Jin Won Yu ,  Jin Jung

IPC: C07C29/10 ,  B01J23/34 ,  B01J23/26 ,  B01J23/36 ,  B01J23/46 ,  B01J27/13 ,  B01J23/22 ,  C01B31/04 ,  C01F7/02 ,  C08J11/16 ,  C01B32/17 ,  C01B32/23 ,  C01B32/196 ,  C01B32/956

Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.

公开(公告)号：US09950340B2

公开(公告)日：2018-04-24

申请号：US14519325

申请日：2014-10-21

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Munju Goh ,  Nam Ho You ,  Hyeonuk Yeo ,  Young Bum Hong

IPC: C08L83/00 ,  B05D1/40 ,  C08J5/18 ,  C08J7/04 ,  C03C17/00 ,  B32B17/06 ,  E04B1/74

CPC classification number: B05D1/40 ,  B32B17/066 ,  B32B2307/304 ,  B32B2307/412 ,  C03C17/007 ,  C03C2217/445 ,  C03C2217/47 ,  C08J5/18 ,  C08J7/047 ,  C08J2367/02 ,  C08J2433/00 ,  C08J2433/12 ,  E04B2001/742

Abstract: Provided are a transparent heat-insulating material including a transparent heat-insulating resin layer including polymer capsules and an optical resin, and a method for preparing the same. The transparent heat-insulating material may reduce the transmission of radiative heat of solar radiation energy entering from the exterior, and prevent discharge or loss of heat when indoor heating, while showing high transparency as well. In addition, the transparent heat-insulating material may allow easy control of the size of capsules contained in a transparent heat-insulating film, and may be obtained through a simple and easy process. Further, it is possible to control the light transmittability and heat-insulating property of the transparent heat-insulating material with ease.

公开(公告)号：US10280534B2

公开(公告)日：2019-05-07

申请号：US16126580

申请日：2018-09-10

Applicant: Korea Institute of Science and Technology

Inventor： Munju Goh ,  Bon-Cheol Ku ,  Nam Ho You ,  Sang Jun Youn ,  Hyeonuk Yeo

IPC: C01F7/02 ,  C03C13/00 ,  D01F9/24 ,  C01B32/16 ,  C01B32/956 ,  C01B32/184 ,  C01B32/23 ,  C08J11/16

Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1≤m≤8 and n is a number satisfying 1≤n≤6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.

公开(公告)号：US10106421B2

公开(公告)日：2018-10-23

申请号：US15380460

申请日：2016-12-15

Applicant: Korea Institute of Science and Technology

Inventor： Munju Goh ,  Nam Ho You ,  Hyeonuk Yeo ,  Bon-Cheol Ku ,  Sang Jun Youn ,  Jin Won Yu ,  Jin Jung

IPC: C07C29/10 ,  B01J23/34 ,  B01J23/26 ,  B01J23/36 ,  B01J23/46 ,  B01J27/13 ,  B01J23/22 ,  C01B31/04 ,  C01F7/02 ,  C08J11/16 ,  C01B32/17 ,  C01B32/23 ,  C01B32/196 ,  C01B32/956

Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.