公开(公告)号：US11787966B2

公开(公告)日：2023-10-17

申请号：US17567991

申请日：2022-01-04

Applicant: Korea Institute of Science and Technology

Inventor： Seungjun Chung ,  Byeongmoon Lee ,  Hyunjoo Cho ,  Heesuk Kim ,  Phillip Lee ,  JeongGon Son ,  JaiKyeong Kim ,  Youngpyo Ko

IPC: C09D11/52 ,  C01B32/174 ,  C09D11/033 ,  C09D11/037 ,  C09D11/102 ,  H01B1/22 ,  H01B1/24 ,  H10K71/00 ,  H10K85/20 ,  H10K71/60

CPC classification number: C09D11/52 ,  C01B32/174 ,  C09D11/033 ,  C09D11/037 ,  C09D11/102 ,  H01B1/22 ,  H01B1/24 ,  H10K71/00 ,  H10K85/221 ,  C01B2202/06 ,  C01B2202/22 ,  H10K71/611 ,  Y02P70/50

Abstract: A method of manufacturing a paste according to various embodiments of the present disclosure for resolving the above-described problems is disclosed. The method of manufacturing a paste may include an operation of adding a metal conductor and a multi-walled carbon nanotube (MWCNT) to chloroform (CHCl3) to produce a first mixture, an operation of adding polydimethylsiloxane (PDMS) to the first mixture to produce a second mixture, an operation of evaporating the chloroform in the second mixture to acquire a third mixture, and an operation of adding an additional additive to the third mixture to produce a paste.

公开(公告)号：US20200181463A1

公开(公告)日：2020-06-11

申请号：US16460237

申请日：2019-07-02

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Heesuk KIM ,  Youngpyo Ko ,  Min Park ,  Sang-Soo Lee ,  Jeong Gon Son ,  Jong Hyuk Park ,  Seungjun Chung ,  Tae Ann Kim

IPC: C09J9/02 ,  C09J183/04 ,  C08K3/04

Abstract: A conductive polymer composite for adhesion to a flexible substrate contains a polymer adhesive containing a curable polymer and a curing agent; and a conductive filler containing a metal and a carbonaceous material dispersed in the polymer adhesive. The conductive polymer composite is suitable for application to not only the human body but also other objects having irregular surface. In addition, due to enhanced adhesive strength of the conductive polymer composite to the flexible substrate, the reduction in conductivity or conductivity breakdown caused by external stress can be prevented and flexibility and stretchability can be improved.

公开(公告)号：US11866623B2

公开(公告)日：2024-01-09

申请号：US16460237

申请日：2019-07-02

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Heesuk Kim ,  Youngpyo Ko ,  Min Park ,  Sang-Soo Lee ,  Jeong Gon Son ,  Jong Hyuk Park ,  Seungjun Chung ,  Tae Ann Kim

IPC: C09J9/02 ,  C08K3/04 ,  C09J183/04 ,  C08K3/08

CPC classification number: C09J9/02 ,  C08K3/041 ,  C08K3/042 ,  C08K3/045 ,  C09J183/04 ,  C08K2003/085 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/0843 ,  C08K2003/0856 ,  C08K2003/0862 ,  C08K2003/0881 ,  C08K2003/0887 ,  C08K2201/001 ,  C09J2467/006 ,  C09J2475/006 ,  C09J2479/086 ,  C09J2483/006

Abstract: A conductive polymer composite for adhesion to a flexible substrate contains a polymer adhesive containing a curable polymer and a curing agent; and a conductive filler containing a metal and a carbonaceous material dispersed in the polymer adhesive. The conductive polymer composite is suitable for application to not only the human body but also other objects having irregular surface. In addition, due to enhanced adhesive strength of the conductive polymer composite to the flexible substrate, the reduction in conductivity or conductivity breakdown caused by external stress can be prevented and flexibility and stretchability can be improved.

公开(公告)号：US11299655B2

公开(公告)日：2022-04-12

申请号：US16460195

申请日：2019-07-02

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Heesuk Kim ,  Youngpyo Ko ,  Min Park ,  Sang-Soo Lee ,  Jeong Gon Son ,  Jong Hyuk Park ,  Seungjun Chung ,  Tae Ann Kim

IPC: C09J9/02 ,  C09J7/25 ,  C09J7/38 ,  C09J11/04 ,  G01D5/24 ,  C09J7/30 ,  H01B5/16 ,  G06F3/041 ,  C08K3/22

Abstract: A highly-dielectric, elastic structure includes an elastic body that is highly-dielectric and includes a polymer matrix that including 1000 pbw of a polydimethylsiloxane (PDMS) base and 100 pbw of a PDMS curing agent, and has a tensile strength of 0.1 to 10 MPa; and 22.4 pbw of carbon black that is surface-treated with octadecyltrimethoxysilane (ODTMS) in an amount of at least 0.707 mmol per 22.4 pbw of the carbon black, and that is dispersed in the polymer matrix and cured; and an adhesive electrode that is stretchable, that is disposed on the elastic body, and that includes a polymer adhesive including a 500 pbw of a thermosetting silicone-based polymer adhesive including a curable polymer and a curing agent; and a conductive filler comprising 500 pbw of silver particles and 4000 pbw of a carbonaceous material that is a multi-walled carbon nanotube that are dispersed in the polymer adhesive and cured.