公开(公告)号：US20100237485A1

公开(公告)日：2010-09-23

申请号：US12700884

申请日：2010-02-05

申请人： KYUNG-MAN KIM ,  In-sang Song

发明人： KYUNG-MAN KIM ,  In-sang Song

IPC分类号： H01L25/11 ,  H01L21/50

CPC分类号： H01L23/49575 ,  H01L23/49555 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/525 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a first semiconductor package having at least one first semiconductor chip and a first sealing member covering the at least one first semiconductor chip, a second semiconductor package stacked on the first semiconductor package, the second semiconductor package having at least one second semiconductor chip, leads electrically connected to the at least one second semiconductor chip, and a second sealing member covering the at least one second semiconductor chip, and at least one signal connection member disposed in the first sealing member of the first semiconductor package, the at least one signal connection member electrically connecting the at least one first semiconductor chip with the leads of the at least one second semiconductor chip.

摘要翻译： 半导体器件包括具有至少一个第一半导体芯片和覆盖该至少一个第一半导体芯片的第一密封元件的第一半导体封装，堆叠在第一半导体封装上的第二半导体封装，该第二半导体封装具有至少一个第二半导体 芯片，电连接到所述至少一个第二半导体芯片的引线，以及覆盖所述至少一个第二半导体芯片的第二密封构件以及设置在所述第一半导体封装的所述第一密封构件中的至少一个信号连接构件， 一个信号连接构件将所述至少一个第一半导体芯片与所述至少一个第二半导体芯片的引线电连接。