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170 条记录 (耗时 0.026 秒)

    Balance filter packaging chip having balun mounted therein and manufacturing method thereof
    3.
    发明授权
    Balance filter packaging chip having balun mounted therein and manufacturing method thereof 有权
    具有平衡 - 不平衡转换器的平衡过滤器包装芯片及其制造方法

    公开(公告)号：US08624369B2

    公开(公告)日：2014-01-07

    申请号：US11844084

    申请日：2007-08-23

    申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    IPC分类号： H01L23/02

    CPC分类号： H03H9/0547

    摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

    摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

    MEMS switch
    4.
    发明授权
    MEMS switch 有权
    MEMS开关

    公开(公告)号：US08198785B2

    公开(公告)日：2012-06-12

    申请号：US13007017

    申请日：2011-01-14

    申请人： Young-tack Hong ,  Dong-kyun Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Jong-seok Kim ,  Che-heung Kim

    发明人： Young-tack Hong ,  Dong-kyun Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Jong-seok Kim ,  Che-heung Kim

    IPC分类号： H01L41/00

    CPC分类号： B41J2/04581 ,  B41J2/04541

    摘要： A Micro Electro Mechanical System (MEMS) switch includes a substrate, a fixed signal line formed on the substrate, a movable signal line spaced apart from one of an upper surface and a lower surface of the fixed signal line, and at least one piezoelectric actuator connected to a first end of the movable signal line so as to bring or separate the movable signal line in contact with or from the fixed signal line. The piezoelectric actuator includes a first electrode, a piezoelectric layer formed on the first electrode, a second electrode formed on the piezoelectric layer, and a connecting layer formed on the second electrode and connected with the movable signal line.

    摘要翻译： 微机电系统（MEMS）开关包括基板，形成在基板上的固定信号线，与固定信号线的上表面和下表面之一间隔开的可移动信号线，以及至少一个压电致动器 连接到可移动信号线的第一端，以使可移动信号线与固定信号线接触或分离。 压电致动器包括第一电极，形成在第一电极上的压电层，形成在压电层上的第二电极，以及形成在第二电极上并与可移动信号线连接的连接层。

    Micro antenna and method of manufacturing the same
    5.
    发明授权
    Micro antenna and method of manufacturing the same 失效
    微天线及其制造方法

    公开(公告)号：US07926165B2

    公开(公告)日：2011-04-19

    申请号：US11712526

    申请日：2007-03-01

    申请人： Young-tack Hong ,  Moon-chul Lee ,  In-sang Song ,  Sang-wook Kwon ,  Chang-won Jung ,  Eun-seok Park

    发明人： Young-tack Hong ,  Moon-chul Lee ,  In-sang Song ,  Sang-wook Kwon ,  Chang-won Jung ,  Eun-seok Park

    IPC分类号： H01P11/00 ,  H01Q13/00 ,  H01Q17/00 ,  H01Q1/36 ,  H05K3/36 ,  H01K3/10

    CPC分类号： H01Q1/2283 ,  H01F17/0033 ,  H01F41/041 ,  H01Q1/362 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49126 ,  Y10T29/49165

    摘要： A method of manufacturing a micro antenna is provided. The method includes forming a plurality of holes penetrating a first substrate, filling each of the plurality of holes with a conductive material to form a plurality of vertical conducting parts, forming a plurality of horizontal conducting parts on each of two different surfaces of the first substrate, wherein the each of the horizontal conducting parts is electrically connected to the corresponding vertical conducting parts, bonding the first substrate, on which the vertical conducting parts and the horizontal conducting parts have been formed, to a second substrate, and removing the first substrate to expose a whole structure of a 3D micro antenna which is formed on the second substrate and includes the vertical conducting parts and the horizontal conducting parts connected to each other.

    摘要翻译： 提供一种制造微型天线的方法。 该方法包括：形成穿过第一基板的多个孔，用导电材料填充多个孔中的每个孔，以形成多个垂直导电部分，在第一基板的两个不同表面的每一个上形成多个水平导电部件 其中，每个水平导电部分电连接到相应的垂直导电部分，将其上形成有垂直导电部分和水平导电部分的第一基板接合到第二基板，并且将第一基板去除 露出形成在第二基板上的3D微型天线的整体结构，并且包括彼此连接的垂直导电部分和水平导电部件。

    RF module with multi-stack structure
    6.
    发明授权
    RF module with multi-stack structure 有权
    RF模块具有多堆叠结构

    公开(公告)号：US07675154B2

    公开(公告)日：2010-03-09

    申请号：US11634247

    申请日：2006-12-06

    申请人： Seog-woo Hong ,  In-sang Song ,  Byeong-ju Ha ,  Hae-seok Park ,  Jun-sik Hwang ,  Joo-ho Lee

    发明人： Seog-woo Hong ,  In-sang Song ,  Byeong-ju Ha ,  Hae-seok Park ,  Jun-sik Hwang ,  Joo-ho Lee

    IPC分类号： H01L23/02 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H03H9/0547 ,  H01L2924/0002 ,  H03H9/587 ,  H01L2924/00

    摘要： A radio frequency (RF) module and a multi RF module including the same include a base substrate, a first element capable of processing RF signals formed on the base substrate, a second element capable of processing RF signals separated from and disposed over the first element, a cap substrate coupled with the base substrate to encapsulate the first and second elements including a plurality of through electrodes that electrically connect the first and second elements to the outside, and a bonding pad that encapsulates and joins the base substrate and the cap substrate and electrically connects the first and second elements to the through electrodes.

    摘要翻译： 射频（RF）模块和包括其的多RF模块包括基底基板，能够处理形成在基底基板上的RF信号的第一元件，能够处理从第一元件分离并布置在第一元件上的RF信号的第二元件 ，与所述基底衬底耦合以封装所述第一和第二元件的帽衬底，所述第一和第二元件包括将所述第一和第二元件电连接到外部的多个通孔，以及封装并连接所述基底衬底和所述帽衬底的焊盘，以及 将第一和第二元件电连接到贯通电极。

    Film bulk acoustic resonator and a method for manufacturing the same
    7.
    发明授权
    Film bulk acoustic resonator and a method for manufacturing the same 有权
    薄膜体声波谐振器及其制造方法

    公开(公告)号：US07619492B2

    公开(公告)日：2009-11-17

    申请号：US11324303

    申请日：2006-01-04

    申请人： Byeoung-ju Ha ,  Seog-woo Hong ,  In-sang Song ,  Hyung Choi

    发明人： Byeoung-ju Ha ,  Seog-woo Hong ,  In-sang Song ,  Hyung Choi

    IPC分类号： H03H9/54 ,  H01L41/22

    CPC分类号： H03H3/02 ,  H03H9/174 ,  Y10T29/42

    摘要： A film bulk acoustic resonator (FBAR) including a substrate having an etched air gap therethrough; a resonance part having a first electrode, a piezoelectric film and a second electrode which are laminated in turn above the air gap; and an etching resistance layer disposed between the air gap and the resonance part to limit an etching depth in forming the air gap, thereby preventing damage to the resonance part.

    摘要翻译： 一种薄膜体声波谐振器（FBAR），包括具有穿过其中的蚀刻气隙的基板; 具有第一电极，压电膜和第二电极的共振部分，其依次层叠在气隙上方; 以及设置在气隙和谐振部件之间的耐蚀刻层，以限制形成气隙的蚀刻深度，从而防止对共振部件的损坏。

    Inductor fabricated with dry film resist and cavity and method of fabricating the inductor
    8.
    发明授权
    Inductor fabricated with dry film resist and cavity and method of fabricating the inductor 有权
    用干膜抗蚀剂和腔体制造的电感器和制造电感器的方法

    公开(公告)号：US07612428B2

    公开(公告)日：2009-11-03

    申请号：US11291894

    申请日：2005-12-02

    申请人： Hae-seok Park ,  In-sang Song ,  Hyung Choi

    发明人： Hae-seok Park ,  In-sang Song ,  Hyung Choi

    IPC分类号： H01L29/00

    CPC分类号： H01L23/5227 ,  H01F17/0006 ,  H01F41/041 ,  H01F2017/0046 ,  H01L21/764 ,  H01L27/08 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An inductor fabricated with a dry film resist and a cavity and a method of fabricating the inductor. The cavity can be formed in a substrate to minimize a parasitic capacitance generated by structures of upper electrodes, an insulating layer, and a lower electrode and minimize energy loss caused by an eddy current generated through the substrate. Also, a process of forming and planarizing the cavity can be simplified so as to form the cavity to a sufficient depth. As a result, an inductor having a high quality factor and a high self resonant frequency can be fabricated. Also, a scheme for simply forming and planarizing a cavity is contemplated.

    摘要翻译： 用干膜抗蚀剂和空腔制造的电感器和制造电感器的方法。 空腔可以形成在衬底中以最小化由上电极，绝缘层和下电极的结构产生的寄生电容，并且使由通过衬底产生的涡流引起的能量损失最小化。 此外，可以简化形成和平坦化空腔的过程，以便将空腔形成为足够的深度。 结果，可以制造具有高品质因数和高自谐振频率的电感器。 此外，可以想到简单地形成和平坦化空腔的方案。