Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication
    3.
    发明授权
    Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication 失效
    用于半导体制造的摩天轮式剥离或清洁机构

    公开(公告)号:US06797075B2

    公开(公告)日:2004-09-28

    申请号:US10143053

    申请日:2002-05-09

    IPC分类号: B08B104

    摘要: A Ferris wheel-like stripping or cleaning mechanism that can be used in semiconductor fabrication, such as in photoresist or other stripping, or wafer or other cleaning, is disclosed. A stripping mechanism can include a container to hold a chemical, such as a photoresist stripping chemical, a wafer cleaning chemical, or another type of chemical. The mechanism can also include a component to move semiconductor wafers through the chemical in the container in a Ferris wheel-like motion. The component may include wafer holders for the wafers that are swivably mounted about an axis of rotation. As the one or more wafer holders rotate about the axis of rotation through the chemical in the container, the wafer holders remain in a substantially constant vertical and horizontal orientation.

    摘要翻译: 公开了可用于半导体制造中的摩擦轮式剥离或清洁机构,例如在光致抗蚀剂或其它剥离,或晶片或其它清洁中。 剥离机构可以包括容纳化学物质的容器,例如光刻胶剥离化学品,晶片清洁化学品或其它类型的化学品。 该机构还可以包括以摩天轮状运动将半导体晶片移动通过容器中的化学物质的部件。 组件可以包括围绕旋转轴线可旋转地安装的用于晶片的晶片保持器。 当一个或多个晶片保持器围绕容器中的化学物质的旋转轴旋转时,晶片保持器保持基本恒定的垂直和水平取向。

    Flush system for dry film photoresist remover
    5.
    发明授权
    Flush system for dry film photoresist remover 失效
    用于干膜光刻胶去除剂的冲洗系统

    公开(公告)号:US06918397B2

    公开(公告)日:2005-07-19

    申请号:US10127086

    申请日:2002-04-22

    CPC分类号: B01D36/02 B01D37/00

    摘要: A flush system comprising a network of conduits, valves and screens that can be interposed between the process container and solvent re-claim tank components of a dry film photoresist (DFR) remover system, for example, that is used in the processing and packaging of integrated circuit chips. By operation of the valves in the flush system, DFR particles can be removed from the DFR remover system in order to prevent or minimize particle clogging of a particle filter in the DFR remover system. The screens in the flush system can be periodically cleaned by reverse flow of solvent or by operation of a nitrogen and DI (deionized) water purge system.

    摘要翻译: 一种冲洗系统,其包括可以介于干膜光致抗蚀剂(DFR)去除剂系统的处理容器和溶剂重新溶液罐组分之间的管道网络,阀门和筛网,例如用于加工和包装 集成电路芯片。 通过操作冲洗系统中的阀,可以从DFR去除器系统中去除DFR颗粒,以防止或最小化DFR去除器系统中的颗粒过滤器的颗粒堵塞。 冲洗系统中的筛网可以通过溶剂的反向流动或通过操作氮气和DI(去离子水)清洗系统来定期清洁。

    Filler for airtight container
    6.
    发明授权
    Filler for airtight container 失效
    填料用于密封容器

    公开(公告)号:US06691738B2

    公开(公告)日:2004-02-17

    申请号:US09996335

    申请日:2001-11-21

    IPC分类号: G05D700

    摘要: The present invention is directed to a filler assembly for dispensing liquid to and from a container capable of storing an indicated liquid. The filler assembly has a portable part and a stationary part cooperating to provide a sealed dispensing means for communicating an indicated liquid from an indicated liquid source to a container and for safely communicating the indicated liquid from the container to another location. The portable part and the stationary part are adapted to sealably mate together and further provide means for preventing misassembly of the two parts. The portable part provides dispensing means capable of communicating the liquid from the stationary part to a remote location. The stationary part is adapted to further sealably mate and communicate with a container capable of storing an indicated liquid.

    摘要翻译: 本发明涉及一种用于将液体分配到能够存储指定液体的容器中的填充器组件。 填充器组件具有便携式部件和固定部件,其配合以提供密封的分配装置,用于将指示的液体从指示的液体源传送到容器并且用于将指示的液体从容器安全地传递到另一位置。 便携式部件和固定部件适于密封地配合在一起,并且还提供用于防止两个部件的错误组装的装置。 便携式部件提供能够将液体从静止部分传送到远程位置的分配装置。 固定部分适于进一步密封地配合并与能够储存指定液体的容器连通。

    METHOD OF FINE PITCH BUMP STRIPPING
    7.
    发明申请
    METHOD OF FINE PITCH BUMP STRIPPING 有权
    精细抛光袋剥离方法

    公开(公告)号:US20080044756A1

    公开(公告)日:2008-02-21

    申请号:US11465375

    申请日:2006-08-17

    IPC分类号: G03C11/12

    CPC分类号: G03F7/422

    摘要: A method for removing dry film resist (DFR) from a fine pitch solder bump array on a semiconductor wafer provides for pre-soaking the wafer in a chemical bath then turbulently exposing the wafer to a chemical solution, both steps taking place in batch processing with the wafers processed in a vertical position. The wafers are then individually processed through a chemical spinning operation in which a chemical solution is dispensed from a spray nozzle while motion such as spinning is imparted the horizontally disposed wafer. The spin speed of the chemical spraying process may then be increased to accelerate physical removal of residue. Deionized water rinsing and spin-drying provide a solder bump array void of any DFR or other residuals.

    摘要翻译: 从半导体晶片上的细间距焊料凸点阵列去除干膜抗蚀剂(DFR)的方法提供将晶片预浸在化学浴中,然后将晶片湍流地暴露于化学溶液,这两个步骤在批处理中发生, 晶片在垂直位置处理。 然后通过化学纺丝操作单独处理晶片,其中从喷雾喷嘴分配化学溶液,同时使诸如旋转的运动赋予水平设置的晶片。 然后可以增加化学喷涂过程的旋转速度以加速残留物的物理去除。 去离子水冲洗和旋转干燥提供无任何DFR或其他残留物的焊料凸块阵列。

    Photoresist stripper using nitrogen bubbler
    8.
    发明授权
    Photoresist stripper using nitrogen bubbler 失效
    使用氮气鼓泡机的光刻胶剥离器

    公开(公告)号:US06911097B1

    公开(公告)日:2005-06-28

    申请号:US09629213

    申请日:2000-07-31

    IPC分类号: B08B3/10 B08B5/00 H01L21/00

    摘要: Provided is a process and apparatus characterized by a gas distribution plate in which a gas supply manifold directs gas bubbles from the bottom of a process tank upward and between wafers contained in a cassette and supported therewithin. This improved method and apparatus is used for effectively stripping photoresist from the larger semiconductor wafers having dense top conductive patterns with protuberant sidewalls. The method provides a scrubbing action that is parallel to the device array being formed on the wafer's surface. Broadly stated, the method of a chemical action on large substrates supported adjacent respective edge portions thereof in a carrier includes submerging the carrier and substrates supported thereby in a process tank containing a liquid chemical, and a gas distribution plate disposed on the bottom of the tank for directing gas bubbles upward and parallel to the surfaces of each substrate contained in the carrier to ensure that a uniform chemical action occurs.

    摘要翻译: 提供了一种工艺和装置,其特征在于气体分配板,其中气体供应歧管将处理罐底部的气泡向上引导到包含在盒中并在其中支撑的晶片之间。 这种改进的方法和装置用于从具有突出侧壁的致密顶部导电图案的较大半导体晶片有效地剥离光致抗蚀剂。 该方法提供了平行于在晶片表面上形成的器件阵列的擦洗动作。 广泛地说,在载体附近支撑在其各个边缘部分上的大的基板上的化学作用的方法包括将载体和由其支撑的基板浸没在包含液体化学品的处理槽中,以及设置在罐的底部上的气体分配板 用于将气泡向上引导并平行于包含在载体中的每个基底的表面,以确保发生均匀的化学作用。

    Method of fine pitch bump stripping
    9.
    发明授权
    Method of fine pitch bump stripping 有权
    细间距凸块剥离方法

    公开(公告)号:US07781140B2

    公开(公告)日:2010-08-24

    申请号:US11465375

    申请日:2006-08-17

    IPC分类号: G03F7/42 B08B3/08 B08B3/10

    CPC分类号: G03F7/422

    摘要: A method for removing dry film resist (DFR) from a fine pitch solder bump array on a semiconductor wafer provides for pre-soaking the wafer in a chemical bath then turbulently exposing the wafer to a chemical solution, both steps taking place in batch processing with the wafers processed in a vertical position. The wafers are then individually processed through a chemical spinning operation in which a chemical solution is dispensed from a spray nozzle while motion such as spinning is imparted the horizontally disposed wafer. The spin speed of the chemical spraying process may then be increased to accelerate physical removal of residue. Deionized water rinsing and spin-drying provide a solder bump array void of any DFR or other residuals.

    摘要翻译: 从半导体晶片上的细间距焊料凸点阵列去除干膜抗蚀剂(DFR)的方法提供将晶片预浸在化学浴中,然后将晶片湍流地暴露于化学溶液,这两个步骤在批处理中发生, 晶片在垂直位置处理。 然后通过化学纺丝操作单独处理晶片,其中从喷雾喷嘴分配化学溶液,同时使诸如旋转的运动赋予水平设置的晶片。 然后可以增加化学喷涂过程的旋转速度以加速残留物的物理去除。 去离子水冲洗和旋转干燥提供无任何DFR或其他残留物的焊料凸块阵列。

    METHOD OF DETERMINING DEMAND THRESHOLD, AND METHOD AND SYSTEM OF DEMAND CONTROL
    10.
    发明申请
    METHOD OF DETERMINING DEMAND THRESHOLD, AND METHOD AND SYSTEM OF DEMAND CONTROL 有权
    确定需求阈值的方法,以及需求控制的方法和系统

    公开(公告)号:US20100168929A1

    公开(公告)日:2010-07-01

    申请号:US12539761

    申请日:2009-08-12

    IPC分类号: G06F1/32 G06F1/28

    CPC分类号: G06Q10/06 G06Q50/06

    摘要: A method of setting a demand threshold is provided. The method comprises: (a) a control unit arranging a plurality of demand data in a descending or an ascending order as a curve; (b) the control unit connecting a maximum demand datum and a minimum demand datum with a line; and (c) the control unit setting a demand datum with a longest perpendicular distance to the line as a demand threshold.

    摘要翻译: 提供了一种设置需求阈值的方法。 该方法包括:(a)以降序或升序排列多个需求数据作为曲线的控制单元; (b)控制单元将最大需求基准和最小需求基准与一条线连接; 以及(c)所述控制单元将与所述线的最长垂直距离的需求基准设置为需求阈值。