公开(公告)号：US08699234B2

公开(公告)日：2014-04-15

申请号：US12984935

申请日：2011-01-05

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K1/18

CPC分类号： H05K1/0236 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3025 ,  H05K3/4694

摘要： An EMI noise shield board, in which an EBG structure is inserted, includes a first board portion and a second board portion. The first board portion has an upper surface, on which an electronic part is disposed, and a circuit for transferring a signal and power to the electronic part. The second board portion is located on a lower surface of the first board portion. The electromagnetic bandgap structure is inserted into the second board portion, and has a band stop frequency property such that an EMI noise transferred from the first board portion is shielded from being radiated to the outside of the EMI noise shield board.

摘要翻译： 其中插入有EBG结构的EMI噪声屏蔽板包括第一板部分和第二板部分。 第一板部分具有设置有电子部件的上表面和用于将信号和电力传送到电子部件的电路。 第二板部分位于第一板部分的下表面上。 电磁带隙结构被插入到第二板部分中，并且具有阻挡频率特性，使得从第一板部分传送的EMI噪声被屏蔽而不被辐射到EMI噪声屏蔽板的外部。

公开(公告)号：US20110067914A1

公开(公告)日：2011-03-24

申请号：US12654361

申请日：2009-12-17

申请人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

发明人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

IPC分类号： H05K9/00 ,  H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.

摘要翻译： 公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。 电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元， 通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。 第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板 布置第二板。

公开(公告)号：US20110067917A1

公开(公告)日：2011-03-24

申请号：US12654526

申请日：2009-12-22

申请人： Dae-Hyun Park ,  Han Kim ,  Kang-Wook Bong

发明人： Dae-Hyun Park ,  Han Kim ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0231 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/09627 ,  H05K2201/09881 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure, which includes a first dielectric material for interlayer insulation and is for blocking a noise, is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a same planar surface as the first conductive plate, and a stitching via unit configured to connect the first conductive plate and the third conductive plate through the planar surface on which the second conductive plate is arranged. A second dielectric material having a permittivity that is different from that of the first dielectric material is interposed between any two of the first conductive plate, the second conductive plate, and the third conductive plate.

摘要翻译： 公开了一种包括电磁带隙结构的印刷电路板。 包括用于层间绝缘并用于阻挡噪声的第一介电材料的电磁带隙结构被插入到印刷电路板中。 电磁带隙结构可以包括第一导电板，布置在与第一导电板不同的平面上的第二导电板，布置在与第一导电板相同的平坦表面上的第三导电板，以及缝合 通孔单元被配置为通过其上布置有第二导电板的平面连接第一导电板和第三导电板。 具有不同于第一介电材料的介电常数的第二介电材料插入在第一导电板，第二导电板和第三导电板中的任何两个之间。

公开(公告)号：US08212150B2

公开(公告)日：2012-07-03

申请号：US12654368

申请日：2009-12-17

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate.

摘要翻译： 公开了一种EMI降噪板。 具有用于屏蔽噪声的电磁带隙结构的电磁干扰（EMI）降噪板包括：具有接地层和功率层的第一区域; 放置在其中具有电磁带隙结构的第一区域的侧部的第二区域。 电磁带隙结构包括：多个第一导电板和沿着第一区域的侧面部分放置在同一平面上的多个第二导电板; 以及缝合通孔，其被构造成通过不同于所述第一导电板和所述第二导电板的平坦表面将所述第一导电板电连接到所述第二导电板。

公开(公告)号：US20100132996A1

公开(公告)日：2010-06-03

申请号：US12466677

申请日：2009-05-15

申请人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Kang-Wook Bong

发明人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Kang-Wook Bong

IPC分类号： H05K1/11

CPC分类号： H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

摘要： In accordance with an embodiment of the present invention, an electromagnetic bandgap structure includes a plurality of conductive plates, and a multi-via connection part, which electrically connects any two of the plurality of conductive plates with each other. Here, the multi-via connection part includes: a first multi-via, including a first via, having one end part connected to one of the two conductive plates, and at least one other via connected in serial to the first via through a conductive trace; a second multi-via, including a second via, having one end part connected to the other of the two conductive plates, and at least one other via connected in serial to the second via through a conductive trace; and a conductive connection pattern, connecting any one of the vias included in the first multi-via and any one of the vias included in the second multi-via with each other.

摘要翻译： 根据本发明的实施例，电磁带隙结构包括多个导电板，以及多通孔连接部，其将多个导电板中的任何两个彼此电连接。 这里，多通孔连接部件包括：包括第一通孔的第一多通孔，其具有连接到两个导电板中的一个的一个端部，以及至少一个其它通孔，其连接到第一通孔，通过导电 跟踪; 包括连接到所述两个导电板中的另一个的一个端部的第二多通孔，以及至少一个通过导电迹线串联连接到所述第二通孔的另一通孔; 以及导电连接图案，其将包括在第一多通孔中的任何一个通孔和包括在第二多通孔中的任何一个通孔彼此连接。

公开(公告)号：US08258408B2

公开(公告)日：2012-09-04

申请号：US12654545

申请日：2009-12-22

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： As a multi-layered board, an EMI noise reduction board, having an electromagnetic bandgap structure with band stop frequency properties inserted into an inner portion of the board, includes a first area, in which a ground layer and a power layer are formed, and a second area, placed on a side surface of the first area, in which it has the electromagnetic bandgap structure formed therein so as to shield an EMI noise radiated to the outside through the side surface of the first area. The electromagnetic bandgap structure includes a plurality of first conductive plates, placed along the edge of the board, a plurality of second conductive plates, disposed on a planar surface that is different from the first conductive plates such that the second conductive plates are alternately disposed with the first conductive plates, and a via, which connects the first conductive plates to the second conductive plates.

摘要翻译： 作为多层板，具有插入板的内部的具有带阻频率特性的电磁带隙结构的EMI降噪板包括形成有接地层和功率层的第一区域，以及 第二区域，放置在第一区域的侧表面上，其中形成有电磁带隙结构，以便屏蔽通过第一区域的侧表面辐射到外部的EMI噪声。 电磁带隙结构包括沿着板的边缘放置的多个第一导电板，设置在不同于第一导电板的平面上的多个第二导电板，使得第二导电板交替地布置有 第一导电板和将第一导电板连接到第二导电板的通孔。

公开(公告)号：US08242377B2

公开(公告)日：2012-08-14

申请号：US12654361

申请日：2009-12-17

申请人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

发明人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

IPC分类号： H05K9/00 ,  H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.

摘要翻译： 公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。 电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元， 通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。 第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板 布置第二板。

公开(公告)号：US08227704B2

公开(公告)日：2012-07-24

申请号：US12654526

申请日：2009-12-22

申请人： Dae-Hyun Park ,  Han Kim ,  Kang-Wook Bong

发明人： Dae-Hyun Park ,  Han Kim ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0231 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/09627 ,  H05K2201/09881 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure, which includes a first dielectric material for interlayer insulation and is for blocking a noise, is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a same planar surface as the first conductive plate, and a stitching via unit configured to connect the first conductive plate and the third conductive plate through the planar surface on which the second conductive plate is arranged. A second dielectric material having a permittivity that is different from that of the first dielectric material is interposed between any two of the first conductive plate, the second conductive plate, and the third conductive plate.

摘要翻译： 公开了一种包括电磁带隙结构的印刷电路板。 包括用于层间绝缘并用于阻挡噪声的第一介电材料的电磁带隙结构被插入到印刷电路板中。 电磁带隙结构可以包括第一导电板，布置在与第一导电板不同的平面上的第二导电板，布置在与第一导电板相同的平坦表面上的第三导电板，以及缝合 通孔单元被配置为通过其上布置有第二导电板的平面连接第一导电板和第三导电板。 具有不同于第一介电材料的介电常数的第二介电材料插入在第一导电板，第二导电板和第三导电板中的任何两个之间。

公开(公告)号：US08076998B2

公开(公告)日：2011-12-13

申请号：US12466704

申请日：2009-05-15

申请人： Kang-Wook Bong ,  Han Kim ,  Dae-Hyun Park

发明人： Kang-Wook Bong ,  Han Kim ,  Dae-Hyun Park

IPC分类号： H03H7/00

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure that blocks a noise of a certain frequency band can include 4 or more conductive plates, a first stitching via, which electrically connects any two of the conductive plates with each other by having a part of the first stitching via pass through a planar surface that is different from a planar surface of the conductive plates, a second stitching via, which electrically connects another two of the conductive plates with each other by having a part of the second stitching via pass through a planar surface that is different from a planar surface of the conductive plates, and a stitching via chain, which electrically connects the first stitching via and the second stitching via with each other.

摘要翻译： 公开了电磁带隙结构。 根据本发明的实施例，阻挡一定频带噪声的电磁带隙结构可以包括4个或更多个导电板，第一缝合通孔，其通过以下方式将任何两个导电板彼此电连接： 第一缝合线的一部分穿过不同于导电板的平坦表面的平面表面;第二缝合通孔，其通过具有第二缝合通孔的一部分将另外两个导电板彼此电连接 穿过不同于导电板的平坦表面的平坦表面，以及缝合通孔链，其将第一缝合通孔和第二缝合通孔彼此电连接。

公开(公告)号：US20110299264A1

公开(公告)日：2011-12-08

申请号：US12984935

申请日：2011-01-05

申请人： Han KIM ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han KIM ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3025 ,  H05K3/4694

摘要： The present invention provides an EMI noise shield board in which an EBG structure is inserted. The EMI noise shield board in accordance with an embodiment of the present invention can include: a first board portion, an electronic part being mounted on an upper surface of the first board portion, a circuit for transferring a signal and power to the electronic part being in the first board portion; and a second board portion located on a lower surface of the first board portion, an electromagnetic bandgap structure being inserted into the second board portion, the electromagnetic bandgap structure having a band stop frequency property in such a way that an EMI noise transferred from the first board portion can be shielded from being radiated to the outside of a board.

摘要翻译： 本发明提供一种其中插入有EBG结构的EMI噪声屏蔽板。 根据本发明的实施例的EMI噪声屏蔽板可以包括：第一板部分，安装在第一板部分的上表面上的电子部件，用于将信号和电力传送到电子部件的电路， 在第一板部分; 以及第二板部分，位于第一板部分的下表面上，电磁带隙结构插入到第二板部分中，电磁带隙结构具有带阻频率特性，使得从第一板部分转移的EMI噪声 板部分可以被屏蔽以免被辐射到板的外部。