公开(公告)号：US20100038122A1

公开(公告)日：2010-02-18

申请号：US12540721

申请日：2009-08-13

申请人： Kaoru SAKINADA ,  Yasuyuki ODA

发明人： Kaoru SAKINADA ,  Yasuyuki ODA

IPC分类号： H05K1/18 ,  B23K37/00

CPC分类号： H05K1/144 ,  H01L23/10 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/19105 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/1071 ,  H05K2201/042 ,  H05K2201/09354 ,  H05K2201/10083 ,  H05K2201/10674 ,  H05K2201/10969 ,  H05K2203/1147 ,  H01L2224/0401

摘要： An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.

摘要翻译： 电子部件模块包括：绝缘基板; 以倒装芯片安装在所述绝缘基板的第一表面上安装的器件芯片; 连接到所述绝缘基板的芯片部件; 设置在所述绝缘基板和所述器件芯片上方的盖; 第一金属图案，设置在绝缘基板的第一表面上的边缘部分中，以围绕绝缘基板的第一表面; 第二金属图案，设置在与第一表面相对的第二表面上的边缘部分中，以围绕第二表面; 以及密封焊料，其接合第一和第二金属图案，以便限定形成在位于绝缘基板和盖之间的区域中并且没有设置第一和第二金属图案并且进一步形成在绝缘体之间的空腔 基板和器件芯片。

公开(公告)号：US20100066209A1

公开(公告)日：2010-03-18

申请号：US12560059

申请日：2009-09-15

申请人： Yasuyuki SAITOU ,  Osamu KAWACHI ,  Kaoru SAKINADA ,  Yasuyuki ODA

发明人： Yasuyuki SAITOU ,  Osamu KAWACHI ,  Kaoru SAKINADA ,  Yasuyuki ODA

IPC分类号： H01L41/053 ,  H01L41/22 ,  H01L41/08

CPC分类号： H03H3/08 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2924/00014 ,  H03H9/059 ,  H03H9/1064 ,  H03H9/1078 ,  Y10T29/42 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An acoustic wave device includes a substrate, a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate, a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate, and a metal seal part that seals the device chip.

摘要翻译： 声波装置包括基板，具有压电基板并且被倒装安装在基板的表面上的器件芯片，具有比压电基板的介电常数低的介电常数的第一绝缘层， 器件芯片的与面向衬底的另一表面相对的表面以及密封器件芯片的金属密封部分。