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    Electronic component module and method for manufacturing the same
    1.
    发明授权
    Electronic component module and method for manufacturing the same 有权
    电子元件模块及其制造方法

    公开(公告)号：US08363422B2

    公开(公告)日：2013-01-29

    申请号：US12540721

    申请日：2009-08-13

    申请人： Kaoru Sakinada ,  Yasuyuki Oda

    发明人： Kaoru Sakinada ,  Yasuyuki Oda

    IPC分类号： H05K7/14 ,  H05K7/18

    CPC分类号： H05K1/144 ,  H01L23/10 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/19105 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/1071 ,  H05K2201/042 ,  H05K2201/09354 ,  H05K2201/10083 ,  H05K2201/10674 ,  H05K2201/10969 ,  H05K2203/1147 ,  H01L2224/0401

    摘要： An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.

    摘要翻译： 电子部件模块包括：绝缘基板; 以倒装芯片安装在所述绝缘基板的第一表面上安装的器件芯片; 连接到所述绝缘基板的芯片部件; 设置在所述绝缘基板和所述器件芯片上方的盖; 第一金属图案，设置在绝缘基板的第一表面上的边缘部分中，以围绕绝缘基板的第一表面; 第二金属图案，设置在与第一表面相对的第二表面上的边缘部分中，以围绕第二表面; 以及密封焊料，其接合第一和第二金属图案，以便限定形成在位于绝缘基板和盖之间的区域中并且没有设置第一和第二金属图案并且进一步形成在绝缘体之间的空腔 基板和器件芯片。

    ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME 有权
    电子元件模块及其制造方法

    公开(公告)号：US20100038122A1

    公开(公告)日：2010-02-18

    申请号：US12540721

    申请日：2009-08-13

    申请人： Kaoru SAKINADA ,  Yasuyuki ODA

    发明人： Kaoru SAKINADA ,  Yasuyuki ODA

    IPC分类号： H05K1/18 ,  B23K37/00

    CPC分类号： H05K1/144 ,  H01L23/10 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/19105 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/1071 ,  H05K2201/042 ,  H05K2201/09354 ,  H05K2201/10083 ,  H05K2201/10674 ,  H05K2201/10969 ,  H05K2203/1147 ,  H01L2224/0401

    摘要： An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.

    摘要翻译： 电子部件模块包括：绝缘基板; 以倒装芯片安装在所述绝缘基板的第一表面上安装的器件芯片; 连接到所述绝缘基板的芯片部件; 设置在所述绝缘基板和所述器件芯片上方的盖; 第一金属图案，设置在绝缘基板的第一表面上的边缘部分中，以围绕绝缘基板的第一表面; 第二金属图案，设置在与第一表面相对的第二表面上的边缘部分中，以围绕第二表面; 以及密封焊料，其接合第一和第二金属图案，以便限定形成在位于绝缘基板和盖之间的区域中并且没有设置第一和第二金属图案并且进一步形成在绝缘体之间的空腔 基板和器件芯片。

    Data exchange circuit for a magnetic memory apparatus
    5.
    发明授权
    Data exchange circuit for a magnetic memory apparatus 失效
    磁存储装置的数据交换电路

    公开(公告)号：US4424536A

    公开(公告)日：1984-01-03

    申请号：US334362

    申请日：1981-12-24

    申请人： Yasuich Hashimoto ,  Yasuyuki Oda

    发明人： Yasuich Hashimoto ,  Yasuyuki Oda

    IPC分类号： H03M5/04 ,  G11B20/14 ,  H03M5/12 ,  H03M5/14 ,  H04L7/00 ,  H04L25/49 ,  G11B5/09

    CPC分类号： G11B20/1423

    摘要： A data exchange circuit to change modified frequency modulation (MFM) signals read from a magnetic memory media and converted into data pulse signals to non-return-to-zero signals. The circuit comprises an input flip-flop which receives MFM data pulse signals from a pulse forming circuit. Pre outputs of the input flip-flop is received by a phase locked loop and the other output of the input flip-flop is received by a delay circuit to vary the pulse width of the MFM pulse signal. Instruction signals are provided to the delay circuit to define data reading margins, and to accommodate variations in data widths or data shifts when no particular margin is determined. The phase locked loop synchronizes it's output when the output of the MFM data pulse signal in order to provide clock signals for non-return-to-zero data. The outputs of the phase locked loop and the delay circuit are converted to respective flip-flops in order to generate the non-return-to-zero signals.

    摘要翻译： 一种数据交换电路，用于改变从磁存储介质读取的修改的频率调制（MFM）信号并将其转换为数据脉冲信号至非归零信号。 该电路包括从脉冲形成电路接收MFM数据脉冲信号的输入触发器。 输入触发器的预输出由锁相环接收，输入触发器的另一输出由延迟电路接收，以改变MFM脉冲信号的脉冲宽度。 指令信号被提供给延迟电路以定义数据读取余量，并且当没有确定特定余量时，适应数据宽度或数据移位的变化。 当MFM数据脉冲信号输出时，锁相环使其输出同步，以提供不归零数据的时钟信号。 锁相环和延迟电路的输出被转换成相应的触发器，以产生不归零信号。

    Magnetic head driving unit
    6.
    发明授权
    Magnetic head driving unit 失效
    磁头驱动单元

    公开(公告)号：US4564872A

    公开(公告)日：1986-01-14

    申请号：US523775

    申请日：1983-08-16

    申请人： Yasuyuki Oda ,  Kazuhiko Iwase

    发明人： Yasuyuki Oda ,  Kazuhiko Iwase

    IPC分类号： G11B21/08 ,  G11B5/54 ,  G11B5/55

    CPC分类号： G11B5/5547 ,  G11B5/54

    摘要： A magnetic head driving unit according to the present invention includes a microprocessor. The microprocessor determines whether a first seek operation for positioning the head on an initial position of a cylinder is completed. If the first seek is not completed, analog switch is triggered ON by a control signal from the microprocessor. Upon the ON operation of the analog switch, the limiter restrains a driving current for a motor in a predetermined value, thereby preventing overrun of the motor.

    摘要翻译： 根据本发明的磁头驱动单元包括微处理器。 微处理器确定用于将磁头定位在气缸的初始位置上的第一寻道操作是否完成。 如果第一次搜索未完成，则通过微处理器的控制信号触发模拟开关ON。 在模拟开关的接通操作时，限制器将电动机的驱动电流限制在预定值，从而防止电动机超速。