ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME 有权
    电子元件模块及其制造方法

    公开(公告)号:US20100038122A1

    公开(公告)日:2010-02-18

    申请号:US12540721

    申请日:2009-08-13

    IPC分类号: H05K1/18 B23K37/00

    摘要: An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.

    摘要翻译: 电子部件模块包括:绝缘基板; 以倒装芯片安装在所述绝缘基板的第一表面上安装的器件芯片; 连接到所述绝缘基板的芯片部件; 设置在所述绝缘基板和所述器件芯片上方的盖; 第一金属图案,设置在绝缘基板的第一表面上的边缘部分中,以围绕绝缘基板的第一表面; 第二金属图案,设置在与第一表面相对的第二表面上的边缘部分中,以围绕第二表面; 以及密封焊料,其接合第一和第二金属图案,以便限定形成在位于绝缘基板和盖之间的区域中并且没有设置第一和第二金属图案并且进一步形成在绝缘体之间的空腔 基板和器件芯片。