利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

75 条记录 (耗时 0.029 秒)

    Producing SiC Packs on a Wafer Plane
    4.
    发明申请
    Producing SiC Packs on a Wafer Plane 有权
    在晶圆平面上生产SiC包装

    公开(公告)号：US20080128710A1

    公开(公告)日：2008-06-05

    申请号：US11816186

    申请日：2005-12-21

    申请人： Karl Weidner ,  Robert Weinke

    发明人： Karl Weidner ,  Robert Weinke

    IPC分类号： H01L29/24 ,  H01L21/66 ,  H01L21/768

    CPC分类号： H01L21/4853 ,  H01L21/0445 ,  H01L21/4846 ,  H01L22/00 ,  H01L22/20 ,  H01L2924/014

    摘要： A method for producing at least one semiconductor component group, in particular a SiC semiconductor component group, includes the step of producing a number of semiconductor components on a substrate, particularly on a wafer. The individual semiconductor components are tested for detecting operative semiconductor components. At least one semiconductor component group is assembled, which is formed of a number of operative semiconductor components and which forms a coherent flat structure. The operative semiconductor components of the semiconductor component group are electrically connecting in parallel.

    摘要翻译： 用于制造至少一个半导体组件组，特别是SiC半导体组件组的方法包括在衬底上，特别是在晶片上产生多个半导体组件的步骤。 测试各个半导体部件以检测有效的半导体部件。 组装至少一个半导体组件组，其由许多有效的半导体组件形成，并形成一致的平坦结构。 半导体部件组的工作半导体部件并联电连接。

    Strip Conductor Structure for Minimizing Thermomechanical Loads
    5.
    发明申请
    Strip Conductor Structure for Minimizing Thermomechanical Loads 审中-公开
    用于最小化热机械负载的带导体结构

    公开(公告)号：US20080164616A1

    公开(公告)日：2008-07-10

    申请号：US11795757

    申请日：2005-12-02

    申请人： Michael Kaspar ,  Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

    发明人： Michael Kaspar ,  Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

    IPC分类号： H01L23/48 ,  H01L21/60

    CPC分类号： H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.

    摘要翻译： 一种半导体芯片器件，包括其上设置有至少一个电接触表面的表面。 将来自电绝缘材料的箔特别是通过真空施加到表面并靠近表面并粘附到表面。 箔片在接触表面的区域中设置有窗口，在该窗口中接触表面没有箔，并且在大面积上与导电材料接触至少一层。 在至少一个实施例中，来自导电材料的层是用于将接触表面电连接到至少一个外部连接导体的柔性接触件的一部分。

    Producing SiC packs on a wafer plane
    6.
    发明授权
    Producing SiC packs on a wafer plane 有权
    在晶圆平面上生产SiC封装

    公开(公告)号：US08809180B2

    公开(公告)日：2014-08-19

    申请号：US11816186

    申请日：2005-12-21

    申请人： Karl Weidner ,  Robert Weinke

    发明人： Karl Weidner ,  Robert Weinke

    IPC分类号： H01L21/44 ,  H01L21/66 ,  H01L21/00 ,  H01L21/48 ,  H01L21/04

    CPC分类号： H01L21/4853 ,  H01L21/0445 ,  H01L21/4846 ,  H01L22/00 ,  H01L22/20 ,  H01L2924/014

    摘要： A method for producing at least one semiconductor component group, in particular a SiC semiconductor component group, includes the step of producing a number of semiconductor components on a substrate, particularly on a wafer. The individual semiconductor components are tested for detecting operative semiconductor components. At least one semiconductor component group is assembled, which is formed of a number of operative semiconductor components and which forms a coherent flat structure. The operative semiconductor components of the semiconductor component group are electrically connecting in parallel.

    摘要翻译： 用于制造至少一个半导体组件组，特别是SiC半导体组件组的方法包括在衬底上，特别是在晶片上产生多个半导体组件的步骤。 测试各个半导体部件以检测有效的半导体部件。 组装至少一个半导体组件组，其由许多有效的半导体组件形成，并形成一致的平坦结构。 半导体部件组的工作半导体部件并联电连接。

    Strip conductor structure for minimizing thermomechanical loads
    7.
    发明授权
    Strip conductor structure for minimizing thermomechanical loads 失效
    带状导体结构，用于最小化热机械载荷

    公开(公告)号：US08415802B2

    公开(公告)日：2013-04-09

    申请号：US12805361

    申请日：2010-07-27

    申请人： Michael Kaspar ,  Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

    发明人： Michael Kaspar ,  Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

    IPC分类号： H01L29/41

    CPC分类号： H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.

    摘要翻译： 一种半导体芯片器件，包括其上设置有至少一个电接触表面的表面。 将来自电绝缘材料的箔特别是通过真空施加到表面并靠近表面并粘附到表面。 箔片在接触表面的区域中设置有窗口，在该窗口中接触表面没有箔，并且在大面积上与导电材料接触至少一层。 在至少一个实施例中，来自导电材料的层是用于将接触表面电连接到至少一个外部连接导体的柔性接触件的一部分。

    Strip conductor structure for minimizing thermomechanocal loads
    9.
    发明申请
    Strip conductor structure for minimizing thermomechanocal loads 失效
    用于最小化热机械负载的带状导体结构

    公开(公告)号：US20100289152A1

    公开(公告)日：2010-11-18

    申请号：US12805361

    申请日：2010-07-27

    申请人： Michael Kaspar ,  Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

    发明人： Michael Kaspar ,  Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

    IPC分类号： H01L23/498

    CPC分类号： H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.

    摘要翻译： 一种半导体芯片器件，包括其上设置有至少一个电接触表面的表面。 将来自电绝缘材料的箔特别是通过真空施加到表面并靠近表面并粘附到表面。 箔片在接触表面的区域中设置有窗口，在该窗口中接触表面没有箔，并且在大面积上与导电材料接触至少一层。 在至少一个实施例中，来自导电材料的层是用于将接触表面电连接到至少一个外部连接导体的柔性接触件的一部分。

    Adhesive Strip Conductor on an Insulating Layer
    10.
    发明申请
    Adhesive Strip Conductor on an Insulating Layer 审中-公开
    绝缘层上的胶带导体

    公开(公告)号：US20080191360A1

    公开(公告)日：2008-08-14

    申请号：US11884231

    申请日：2005-12-22

    申请人： Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

    发明人： Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

    IPC分类号： H01L23/48 ,  H01L21/44

    CPC分类号： H05K3/38 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K2201/2072 ,  H01L2924/00

    摘要： A device is disclosed with at least one electrically insulating layer on which at least one conductor structure made of electrically conductive material is placed. In at least one embodiment, the conductor structure on the side facing the insulating layer has at least one elevation that is accommodated in at least one recess in the insulating layer.

    摘要翻译： 公开了具有至少一个电绝缘层的器件，在绝缘层上放置由导电材料制成的至少一个导体结构。 在至少一个实施例中，面向绝缘层的一侧上的导体结构具有至少一个放置在绝缘层中的至少一个凹部中的高度。