公开(公告)号：US08261439B2

公开(公告)日：2012-09-11

申请号：US12733507

申请日：2008-08-04

申请人： Axel Kaltenbacher ,  Michael Kaspar ,  Gernot Schimetta ,  Karl Weidner ,  Robert Weinke ,  Jörg Zapf

发明人： Axel Kaltenbacher ,  Michael Kaspar ,  Gernot Schimetta ,  Karl Weidner ,  Robert Weinke ,  Jörg Zapf

IPC分类号： H01R43/00

CPC分类号： H01L24/33 ,  H01L23/3735 ,  H01L23/49562 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/36 ,  H01L24/40 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/18 ,  H01L2224/82039 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/30107 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2924/00014

摘要： One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

摘要翻译： 一个未安置的电子部件，例如半导体功率部件，具有设置在顶侧和/或底侧上的用于紧固和/或电接触的至少一个连接表面。 部件的一侧在连接表面的区域中的相对的连接表面处附接到和/或电接触直接铜结合陶瓷基板。 在基板上在连接表面的区域外侧面向组件的一侧上形成电绝缘载体膜，并延伸超过底侧。 导电导体部分附接到和/或电接触顶侧上的连接表面。 形成延伸超过顶侧区域的预先形成的三维结构，从而在载体膜和导体部分的三维结构之间形成电绝缘物质。

公开(公告)号：US20100208438A1

公开(公告)日：2010-08-19

申请号：US12733507

申请日：2008-08-04

申请人： Axel Kaltenbacher ,  Michael Kaspar ,  Gernot Schimetta ,  Karl Weidner ,  Robert Weinke ,  Jörg Zapf

发明人： Axel Kaltenbacher ,  Michael Kaspar ,  Gernot Schimetta ,  Karl Weidner ,  Robert Weinke ,  Jörg Zapf

IPC分类号： H05K7/02 ,  H05K13/00

CPC分类号： H01L24/33 ,  H01L23/3735 ,  H01L23/49562 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/36 ,  H01L24/40 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/18 ,  H01L2224/82039 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/30107 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2924/00014

摘要： One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

摘要翻译： 一个未安置的电子部件，例如半导体功率部件，具有设置在顶侧和/或底侧上的用于紧固和/或电接触的至少一个连接表面。 部件的一侧在连接表面的区域中的相对的连接表面处附接到和/或电接触直接铜结合陶瓷基板。 在基板上在连接表面的区域外侧面向组件的一侧上形成电绝缘载体膜，并延伸超过底侧。 导电导体部分附接到和/或电接触顶侧上的连接表面。 形成延伸超过顶侧区域的预先形成的三维结构，从而在载体膜和导体部分的三维结构之间形成电绝缘物质。

公开(公告)号：US09419193B2

公开(公告)日：2016-08-16

申请号：US13505283

申请日：2010-10-05

申请人： Bernd Barchmann ,  Axel Kaltenbacher ,  Norbert Stath ,  Walter Wegleiter ,  Karl Weidner ,  Ralph Wirth

发明人： Bernd Barchmann ,  Axel Kaltenbacher ,  Norbert Stath ,  Walter Wegleiter ,  Karl Weidner ,  Ralph Wirth

IPC分类号： H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L25/075

CPC分类号： H01L33/62 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L2224/24998 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/00

摘要： An opto-electronic component has a carrier element (3) with a connection region (5). Arranged on the carrier element (3) is a semiconductor chip (7). A contact region (10) is mounted on the surface (8) of the semiconductor chip (7) remote from the carrier element (3). The connection region (5) is electrically conductively connected to the contact region (10) by way of an unsupported conductive structure (13). A method for manufacturing an opto-electronic component is described.

摘要翻译： 光电子部件具有带有连接区域（5）的载体元件（3）。 在载体元件（3）上排列的是半导体芯片（7）。 接触区域（10）安装在远离载体元件（3）的半导体芯片（7）的表面（8）上。 连接区域（5）通过未支撑的导电结构（13）导电地连接到接触区域（10）。 描述了一种用于制造光电子部件的方法。

公开(公告)号：US09159889B2

公开(公告)日：2015-10-13

申请号：US13811846

申请日：2011-07-15

申请人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Stefan Gruber ,  Georg Bogner

发明人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Stefan Gruber ,  Georg Bogner

IPC分类号： H01L33/60 ,  H01L33/20 ,  H01L33/38 ,  H01L33/58 ,  G02F1/1335 ,  H01L25/075 ,  H01L33/40 ,  H01L33/46

CPC分类号： H01L33/60 ,  G02F1/133603 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/20 ,  H01L33/38 ,  H01L33/405 ,  H01L33/46 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.

摘要翻译： 辐射发射部件包括半导体芯片，其具有第一主表面，与第一主表面相对的第二主表面和产生辐射的有源区域; 半导体芯片固定在第二主表面侧的载体; 输出层，布置在半导体芯片的第一主表面上，并在横向上形成与半导体芯片间隔开的横向输出表面，在输出层中形成在半导体芯片的方向上渐缩的凹部和偏转辐射 在运行过程中从第一主表面向侧向输出表面的方向出现。

公开(公告)号：US08901592B2

公开(公告)日：2014-12-02

申请号：US13822367

申请日：2011-08-22

申请人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

发明人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

IPC分类号： H01L33/62 ,  H01L33/60 ,  H01L23/00 ,  H01L23/055 ,  H01L33/50 ,  H01L33/54

CPC分类号： H01L33/60 ,  H01L23/055 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/24 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244

摘要： An optoelectronic component includes a carrier having a first connection region and a second connection region, a radiation-emitting semiconductor chip having a base surface and a radiation exit surface opposite the base surface, wherein the semiconductor chip is arranged by the base surface on the carrier, a housing having a lower housing part arranged on the carrier and adjoining side flanks of the semiconductor chip, and an upper housing part arranged on the lower housing part and shaped as a reflector for radiation emitted by the semiconductor chip, and an electrical connection layer which leads from the radiation exit surface of the semiconductor chip via a part of the interface between the lower and the upper housing part and through the lower housing part to the first connection region on the carrier.

摘要翻译： 光电子部件包括具有第一连接区域和第二连接区域的载体，具有基底表面和与基底表面相对的辐射出射表面的辐射发射半导体芯片，其中半导体芯片由载体上的基底表面布置 ，具有布置在所述载体上的下壳体部分和所述半导体芯片的相邻侧面的壳体，以及布置在所述下壳体部分上并形成为由所述半导体芯片发射的辐射的反射器的上壳体部分，以及电连接层 其从半导体芯片的辐射出射表面经由下壳体部分和上壳体部分之间的界面的一部分穿过下壳体部分到达载体上的第一连接区域。

公开(公告)号：US20120228663A1

公开(公告)日：2012-09-13

申请号：US13394058

申请日：2010-08-05

申请人： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter

发明人： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter

IPC分类号： H01L33/62

CPC分类号： H01L33/44 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/62 ,  H01L2224/24101 ,  H01L2224/24105 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

摘要： An optoelectronic component comprising at least one semiconductor body having a radiation exit side, said semiconductor body being arranged by a side lying opposite the radiation exit side on a substrate, wherein at least one electrical connection region, on which a metallization bump is arranged, is arranged on the radiation exit side, the semiconductor body is at least partly provided with an insulating layer, wherein the metallization bump projects beyond the insulating layer, and at least one planar conductor structure is arranged on the insulating layer for the purpose of making contact with the semiconductor body in planar fashion, said conductor structure being electrically conductively connected to the electrical connection region by the metallization bump.

摘要翻译： 一种光电子部件，包括至少一个具有辐射出射侧的半导体本体，所述半导体本体由与衬底上的辐射出口侧相对的一侧设置，其中至少一个电连接区域上布置有金属化凸块， 布置在辐射出口侧，半导体本体至少部分地设置有绝缘层，其中金属化凸块突出超过绝缘层，并且至少一个平面导体结构布置在绝缘层上，用于与 所述半导体本体为平面形式，所述导体结构通过所述金属化凸块与所述电连接区域导电连接。

公开(公告)号：US20120119233A1

公开(公告)日：2012-05-17

申请号：US13320304

申请日：2010-07-19

申请人： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

发明人： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

IPC分类号： H01L33/60 ,  H01L33/08 ,  H01L33/62

CPC分类号： H01L33/0079 ,  H01L23/3107 ,  H01L23/3185 ,  H01L25/042 ,  H01L25/0753 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02322 ,  H01L31/02327 ,  H01L31/1892 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

摘要： A method for producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier; shaping a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body covers all side areas of the at least one optoelectronic semiconductor chip, and wherein a surface facing away from the carrier at the top side and/or a surface facing the carrier at the underside of the at least one semiconductor chip remains substantially free of the shaped body or is exposed, and removing the carrier.

摘要翻译： 一种光电子半导体部件的制造方法，包括提供载体; 在载体的顶侧布置至少一个光电子半导体芯片; 在所述至少一个光电半导体芯片周围成形成形体，其中所述成形体覆盖所述至少一个光电半导体芯片的所有侧面区域，并且其中，在顶侧处背离所述载体的表面和/或面向所述至少一个光电半导体芯片的表面 在至少一个半导体芯片的下侧的载体保持基本上没有成形体或暴露，并且移除载体。

公开(公告)号：US20130214323A1

公开(公告)日：2013-08-22

申请号：US13816839

申请日：2011-08-12

申请人： Karl Weidner ,  Hans Wulkesch ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Johann Ramchen

发明人： Karl Weidner ,  Hans Wulkesch ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Johann Ramchen

IPC分类号： H01L31/0232 ,  H01L33/48

CPC分类号： H01L31/0232 ,  H01L21/76804 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0095 ,  H01L33/48 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.

摘要翻译： 制造光电子半导体部件的方法包括提供具有顶侧，与顶侧相对设置的下侧以及沿横向彼此并排布置的多个连接区域的载体; 施加在顶侧沿横向彼此一定距离地布置的多个光电子部件，所述部件具有背离载体的接触区域; 将保护元件施加到触点和连接区域; 将电绝缘层施加到载体，接触区域和保护元件的暴露位置; 通过去除保护元件在绝缘层中产生开口; 以及在所述绝缘层和所述开口中布置导电材料，其中所述导电材料将接触区域连接到所分配的连接区域。

公开(公告)号：US09105771B2

公开(公告)日：2015-08-11

申请号：US13816839

申请日：2011-08-12

申请人： Karl Weidner ,  Hans Wulkesch ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Johann Ramchen

发明人： Karl Weidner ,  Hans Wulkesch ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Johann Ramchen

IPC分类号： H01L31/0232 ,  H01L33/00 ,  H01L33/62 ,  H01L23/00 ,  H01L21/768 ,  H01L33/48

CPC分类号： H01L31/0232 ,  H01L21/76804 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0095 ,  H01L33/48 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.

摘要翻译： 制造光电子半导体部件的方法包括提供具有顶侧，与顶侧相对设置的下侧以及沿横向彼此并排布置的多个连接区域的载体; 施加在顶侧沿横向彼此一定距离地布置的多个光电子部件，所述部件具有背离载体的接触区域; 将保护元件施加到触点和连接区域; 将电绝缘层施加到载体，接触区域和保护元件的暴露位置; 通过去除保护元件在绝缘层中产生开口; 以及在所述绝缘层和所述开口中布置导电材料，其中所述导电材料将接触区域连接到所分配的连接区域。

公开(公告)号：US20130307004A1

公开(公告)日：2013-11-21

申请号：US13822367

申请日：2011-08-22

申请人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

发明人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

IPC分类号： H01L33/60 ,  H01L33/62

CPC分类号： H01L33/60 ,  H01L23/055 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/24 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244

摘要： An optoelectronic component includes a carrier having a first connection region and a second connection region, a radiation-emitting semiconductor chip having a base surface and a radiation exit surface opposite the base surface, wherein the semiconductor chip is arranged by the base surface on the carrier, a housing having a lower housing part arranged on the carrier and adjoining side flanks of the semiconductor chip, and an upper housing part arranged on the lower housing part and shaped as a reflector for radiation emitted by the semiconductor chip, and an electrical connection layer which leads from the radiation exit surface of the semiconductor chip via a part of the interface between the lower and the upper housing part and through the lower housing part to the first connection region on the carrier.

摘要翻译： 光电子部件包括具有第一连接区域和第二连接区域的载体，具有基底表面和与基底表面相对的辐射出射表面的辐射发射半导体芯片，其中半导体芯片由载体上的基底表面布置 ，具有布置在所述载体上的下壳体部分和所述半导体芯片的相邻侧面的壳体，以及布置在所述下壳体部分上并形成为由所述半导体芯片发射的辐射的反射器的上壳体部分，以及电连接层 其从半导体芯片的辐射出射表面经由下壳体部分和上壳体部分之间的界面的一部分穿过下壳体部分到达载体上的第一连接区域。