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公开(公告)号：US5516432A
公开(公告)日：1996-05-14
申请号：US342951
申请日：1994-11-21
IPC分类号： C02F5/10 , C02F5/12 , C23F11/173
摘要： A process for stabilizing aqueous systems containing scale-forming salts by adding to such systems an effective amount of selected low molecular weight water-soluble polymers containing from 30 to 60 weight percent unsaturated sulfonic acid units, from 35 to 65 weight percent carboxylic acid units and optionally up to 10 weight percent of one or more units selected from non-ionizable monomers, is provided. The polymers used in the process provide improved phosphate and iron stabilization at high temperature conditions. A polymer composition based on 50/50 weight/weight 2-acrylamido-2-methyl-1-propanesulfonic acid/acrylic acid is particularly preferred for use at high temperatures, for example, from 80.degree. to 100.degree. C.
摘要翻译： 通过向这种体系中加入有效量的选自30至60重量％的不饱和磺酸单元，35至65重量％的羧酸单元的选定的低分子量水溶性聚合物和用于稳定含有成垢盐的含水体系的方法，以及 可选地，至多10重量％的选自非离子化单体的一个或多个单元。 该方法中使用的聚合物在高温条件下提供改善的磷酸盐和铁稳定性。 基于50/50重量/重量的2-丙烯酰氨基-2-甲基-1-丙磺酸/丙烯酸的聚合物组合物特别优选用于高温下，例如80-100℃。
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公开(公告)号：US06646082B2
公开(公告)日：2003-11-11
申请号：US10234917
申请日：2002-09-04
IPC分类号： C08F12240
CPC分类号： C23F11/173 , C08F22/40
摘要： A new class of polymeric corrosion inhibiting compositions incorporating pendant heterocyclic groups which are surprisingly effective copper corrosion inhibitors are disclosed. The polymers form a protective barrier on metallic components to aqueous systems and remain substantive on metallic surfaces over a wide pH range. Moreover, the polymers are resistant to oxidizing biocides, and are substantially impervious to repeated or prolonged exposure to corrosive agents.
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3.发明授权公开(公告)号：US08747953B2
公开(公告)日：2014-06-10
申请号：US13305776
申请日：2011-11-29
申请人： William Christopher Finch , Charles James Rand , C. Damien Rodowski , Barry Weinstein , Drew Elliot Williams
发明人： William Christopher Finch , Charles James Rand , C. Damien Rodowski , Barry Weinstein , Drew Elliot Williams
IPC分类号： B05D3/10 , C09J179/02
CPC分类号： C08L79/02 , C08J5/24 , C08J2379/02
摘要： The present invention provides stable aqueous thermosetting binder compositions having a total solids content of 15 wt. % or higher, preferably, 20 wt. % or higher, and having extended shelf life comprising one or more reducing sugar, one or more primary amine compound, and one or more stabilizer acid or salt having a pKa of 8.5 or less. The total amount of stabilizer used may range from 5 to 200 mole %, based on the total moles of primary amine present in the binder. The stabilizer may be an organic stabilizer chosen from a monocarboxylic acid, a dicarboxylic acid, a fatty acid, an acid functional fatty acid ester, an acid functional fatty acid ether, or an inorganic stabilizer chosen from a mineral acid, a mineral acid amine or ammonia salt, and a Lewis acid, and mixtures thereof. The compositions can be used to provide binders for substrate materials including, for example, glass fiber.
摘要翻译： 本发明提供了固体含量为15wt。％的稳定的水性热固性粘合剂组合物。 ％以上，优选20重量％ ％或更高，并且具有延长的保质期，其包含一种或多种还原糖，一种或多种伯胺化合物和一种或多种pKa为8.5或更低的稳定剂酸或盐。 基于存在于粘合剂中的伯胺的总摩尔数，所使用的稳定剂的总量可以为5-200摩尔％。 稳定剂可以是选自单羧酸，二羧酸，脂肪酸，酸官能脂肪酸酯，酸官能脂肪酸醚或选自无机酸，无机酸胺或无机酸的无机稳定剂的有机稳定剂， 氨盐和路易斯酸，以及它们的混合物。 组合物可用于提供用于基材的粘合剂，包括例如玻璃纤维。
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公开(公告)号：US08329949B2
公开(公告)日：2012-12-11
申请号：US12291744
申请日：2008-11-12
IPC分类号： C07C249/00 , C10L1/228 , C10L1/23
CPC分类号： C07C291/02 , C10L1/22 , C10L1/23 , C10L10/00 , C10M133/22 , C10M2215/14 , C10N2230/10
摘要： A method for producing a nitrone of formula (I) wherein R is a branched alkyl group having from four to thirty carbon atoms; R1, R2, R3 and R4 independently are hydrogen or alkyl groups having from one to six carbon atoms from an imine having formula (II)
摘要翻译： 一种制备式（I）的硝酮的方法，其中R是具有4-30个碳原子的支链烷基; R 1，R 2，R 3和R 4独立地是氢或具有1至6个碳原子的具有式（II）的亚胺的烷基，
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5.发明申请公开(公告)号：US20120135152A1
公开(公告)日：2012-05-31
申请号：US13305776
申请日：2011-11-29
申请人： William Christopher Finch , Charles James Rand , Charles Damien Rodowski , Barry Weinstein , Drew Elliot Williams
发明人： William Christopher Finch , Charles James Rand , Charles Damien Rodowski , Barry Weinstein , Drew Elliot Williams
IPC分类号： B05D3/10 , C09J179/02
CPC分类号： C08L79/02 , C08J5/24 , C08J2379/02
摘要： The present invention provides stable aqueous thermosetting binder compositions having a total solids content of 15 wt. % or higher, preferably, 20 wt. % or higher, and having extended shelf life comprising one or more reducing sugar, one or more primary amine compound, and one or more stabilizer acid or salt having a pKa of 8.5 or less. The total amount of stabilizer used may range from 5 to 200 mole %, based on the total moles of primary amine present in the binder. The stabilizer may be an organic stabilizer chosen from a monocarboxylic acid, a dicarboxylic acid, a fatty acid, an acid functional fatty acid ester, an acid functional fatty acid ether, or an inorganic stabilizer chosen from a mineral acid, a mineral acid amine or ammonia salt, and a Lewis acid, and mixtures thereof. The compositions can be used to provide binders for substrate materials including, for example, glass fiber.
摘要翻译： 本发明提供了固体含量为15wt。％的稳定的水性热固性粘合剂组合物。 ％以上，优选20重量％ ％或更高，并且具有延长的保质期，其包含一种或多种还原糖，一种或多种伯胺化合物和一种或多种pKa为8.5或更低的稳定剂酸或盐。 基于存在于粘合剂中的伯胺的总摩尔数，所使用的稳定剂的总量可以为5-200摩尔％。 稳定剂可以是选自单羧酸，二羧酸，脂肪酸，酸官能脂肪酸酯，酸官能脂肪酸醚或选自无机酸，无机酸胺或无机酸的无机稳定剂的有机稳定剂， 氨盐和路易斯酸，以及它们的混合物。 组合物可用于提供用于基材的粘合剂，包括例如玻璃纤维。
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公开(公告)号：US07300874B2
公开(公告)日：2007-11-27
申请号：US11077671
申请日：2005-03-10
申请人： Barry Weinstein , Tirthankar Ghosh
发明人： Barry Weinstein , Tirthankar Ghosh
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： C09G1/02 , H01L21/3212
摘要： A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.
摘要翻译： 包含需要去除的金属层的半导体基板的化学机械抛光方法和利用包含亲水官能团和相对较少亲水官能团的工程共聚物分子的组合物的金属互连的金属互连的方法; 该工程共聚物分子在CMP期间能够在抛光垫表面和衬底表面之间进行接触介导的反应，导致衬底中金属互连的最小凹陷。
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7.发明授权公开(公告)号：US07199179B2
公开(公告)日：2007-04-03
申请号：US10806580
申请日：2004-03-23
IPC分类号： C08F220/10
CPC分类号： D04H1/4218 , C08F8/14 , D04H1/4209 , D04H1/4234 , D04H1/4242 , D04H1/4258 , D04H1/4342 , D04H1/435 , D04H1/587 , D06M13/148 , D06M13/192 , D06M15/263 , D06M15/327 , C08F20/00
摘要： A curable aqueous composition including (a) a polyacid including at least two carboxylic acid groups, anhydride groups, or salts thereof; (b) a polyol including at least two hydroxyl groups; and (c) an emulsion polymer including, as copolymerized units, greater than 30% by weight, based on the weight of the emulsion polymer solids, ethylenically unsaturated acrylic monomer including a C5 or greater alkyl group; wherein the ratio of the number of equivalents of the carboxylic acid groups, anhydride groups, or salts thereof to the number of equivalents of the hydroxyl groups is from 1/0.01 to 1/3, and wherein the carboxylic acid groups, anhydride groups, or salts thereof are neutralized to an extent of less than 35% with a fixed base is provided. Also provided is a method for treating heat-resistant fibers or a heat-resistant nonwoven formed therefrom with the curable aqueous composition and the article prepared thereby.
摘要翻译： 一种可固化水性组合物，其包含（a）包含至少两个羧酸基团的多酸，酸酐基团或其盐; （b）包含至少两个羟基的多元醇; 和（c）乳液聚合物，其包含基于乳液聚合物固体重量的大于30重量％的共聚单元，包含C 5或更高烷基的烯属不饱和丙烯酸单体; 其中羧酸基团，酸酐基团或其盐的当量数与羟基的当量数的比率为1 / 0.01至1/3，并且其中羧酸基团，酸酐基团或 其盐被中和至小于35％的程度，提供固定碱。 还提供了由可固化水性组合物和由其制备的制品来处理耐热纤维或由其形成的耐热非织造物的方法。
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公开(公告)号：US20070006390A1
公开(公告)日：2007-01-11
申请号：US11481144
申请日：2006-07-05
申请人： Guy Clamen , William Finch , Barry Weinstein
发明人： Guy Clamen , William Finch , Barry Weinstein
IPC分类号： C11D3/00
CPC分类号： D04H1/645 , C03C25/47 , C08F8/14 , D04H1/4209 , D04H1/4218 , D04H1/4234 , D04H1/4242 , D04H1/4258 , D04H1/4282 , D04H1/4334 , D04H1/435 , D04H1/587 , D04H1/64 , D21H13/40 , D21H17/38 , F16D69/02 , Y10T428/24994 , Y10T442/20 , C08F20/06
摘要： According to the present invention, water repellant curable compositions comprise: (i) one or more polyacid comprising at least two carboxylic acid groups, anhydride groups, or salts thereof; (ii) one or more polyol comprising at least two hydroxyl groups; (iii) one or more reactive waterproofing agent chosen from a C5 to C30 alk(en)yl 2-hydroxyethyl (alk(en))amide, C5 to C30 alk(en)yl bis(2-hydroxyethyl)amide, C1 to C30 alk(en)yl 2-hydroxyethyl (alk(en))amine, C11 to C30 alk(en)yl bis(2-hydroxy-ethyl) amine, C11 to C30 alk(en)yl tris(2-hydroxyethyl)amine, C5 to C30 alk(en)yl monoglyceride, C5 to C30 alk(en)yl monocarboxylate of a trihydric polyol, and mixtures thereof; and, (iv), optionally, one or more phosphorous-containing accelerator, wherein the ratio of the number of equivalents of said carboxylic acid groups, anhydride groups, or salts thereof to the total number of equivalents of said hydroxyl groups is from 1/0.01 to 1/3. The compositions provide concentrates dilutable with water to make thermosetting aqueous binder compositions. Further, the present invention provides methods of treating or contacting substrates chosen from a non-woven, woven and a composite, such as glass fiber substrates, with the thermosetting aqueous binder compositions, and drying and curing, as well as water resistant products produced thereby.
摘要翻译： 根据本发明，防水可固化组合物包含：（i）一种或多种包含至少两个羧酸基团，酸酐基团或其盐的多酸; （ii）一种或多种包含至少两个羟基的多元醇; （iii）一种或多种反应性防水剂，其选自C 5至C 30烷基（烯）基2-羟乙基（alk（en））酰胺，C
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公开(公告)号：US06632259B2
公开(公告)日：2003-10-14
申请号：US09860933
申请日：2001-05-18
申请人： Barry Weinstein , Tirthankar Ghosh
发明人： Barry Weinstein , Tirthankar Ghosh
IPC分类号： C09G102
CPC分类号： C09G1/02 , H01L21/3212
摘要： A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.
摘要翻译： 包含需要去除的金属层的半导体基板的化学机械抛光方法和利用包含亲水官能团和相对较少亲水官能团的工程共聚物分子的组合物的金属互连的金属互连的方法; 该工程共聚物分子在CMP期间能够在抛光垫表面和衬底表面之间进行接触介导的反应，导致衬底中金属互连的最小凹陷。
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公开(公告)号：US06013836A
公开(公告)日：2000-01-11
申请号：US443871
申请日：1995-05-22
申请人： Adam Chi-Tung Hsu , Harold Ernest Aller , Dat Phat Le , Donald Wesley Hamp , Barry Weinstein , Raymond August Murphy
发明人： Adam Chi-Tung Hsu , Harold Ernest Aller , Dat Phat Le , Donald Wesley Hamp , Barry Weinstein , Raymond August Murphy
IPC分类号： C07C251/86 , C07C255/24 , C07C275/28 , C07C311/51 , C07C323/48 , C07C327/56 , C07D207/34 , C07D213/54 , C07D213/86 , C07D213/87 , C07D241/24 , C07D303/38 , C07D307/58 , C07D307/68 , C07D333/38 , A01N33/26 , A01N43/36 , A01N43/40 , A01N43/653
CPC分类号： C07D213/54 , C07C251/86 , C07C255/24 , C07C275/28 , C07C311/51 , C07C323/48 , C07C327/56 , C07D207/34 , C07D213/86 , C07D213/87 , C07D241/24 , C07D303/38 , C07D307/58 , C07D307/68 , C07D333/38 , C07C2101/04 , C07C2101/14 , C07C2101/16 , C07C2102/10
摘要： This invention relates to N'-substituted-N,N'-disubstitutedhydrazines of formula I ##STR1## wherein X and X' are independently O, S, or NR; A' and B' are independently substituted or unsubstituted aryl or aromatic heterocycle; wherein F is alkyl, alkenyl, or aralkyl; and wherein E is a tertiary carbon containing organic radical having a total of at least four carbon and halogen atoms but not more than six halogen atoms, or a non-tertiary carbon containing non-haloalkyl organic or organometallic radical having at least five atoms other than hydrogen, oxygen and halogen which are useful as insecticides, compositions containing those compounds, methods of producing the compounds, and methods of their use. More particularly, the invention relates to insect growth regulating compounds and compositions, and methods of using such compounds and compositions. Compounds of the present invention are particularly suitable for controlling plant-destructive insects in crops of cultivated plants, ornamentals and forestry.
摘要翻译： 本发明涉及式I的N' - 取代-N，N'-二取代肼，其中X和X'独立地是O，S或NR; A'和B'独立地是取代或未取代的芳基或芳族杂环; 其中F是烷基，烯基或芳烷基; 并且其中E是具有总共至少四个碳原子但不超过六个卤素原子的含叔碳原子的有机基团，或具有至少五个原子的含非卤代烷基有机或有机金属基的非叔碳原子 可用作杀虫剂的氢，氧和卤素，含有这些化合物的组合物，制备化合物的方法及其使用方法。 更具体地说，本发明涉及昆虫生长调节化合物和组合物，以及使用这些化合物和组合物的方法。 本发明的化合物特别适用于在栽培植物，观赏植物和林业作物中控制植物破坏性昆虫。
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