摘要:
In a semiconductor device, an opening having a high aspect ratio from a back surface of a GaAs substrate and is formed by anisotropic dry etching. After an Au film is deposited on the entire back surface of the GaAs substrate, including inside of the opening, a Ni alloy is non-electrolytically plated. The Ni film can also be deposited on the inner wall and bottom of the opening. An IC substrate or FET may have the Ni film only at an area corresponding to the via hole. The back surface of the IC substrate or FET and the front surface of a package substrate are bonded to each other by AuSn solder poorly wetting the Ni film.
摘要:
In a semiconductor device, an opening having a high aspect ratio extends from a back surface of a GaAs substrate and is formed by anisotropic dry etching. After an Au film is deposited on the entire back surface of the GaAs substrate, including inside of the opening, a Ni alloy is non-electrolytically plated. The Ni film can also be deposited on the inner wall and the bottom of the opening. An IC substrate or FET may have the Ni film only at an area corresponding to the via hole. The back surface of the IC substrate or FET and the front surface of a package substrate are bonded to each other by AuSn solder poorly wetting the Ni film.
摘要:
A semiconductor device includes a semiconductor substrate and an electrode disposed on a major surface of the semiconductor substrate. A via hole is formed on a center of the electrode so as to open from a surface of the electrode to a place under the surface of the semiconductor substrate. A via-hole foundation electrode for inhibiting diffusion from a metal layer is formed inside the via hole and on the surface of the electrode, a via-hole electrode is formed on the surface of the via-hole foundation electrode. A back via hole is formed on the back of the semiconductor substrate opposite to the major surface thereof, and opened from the back of the semiconductor substrate to the via-hole electrode. A back via-hole electrode is formed on the back of the semiconductor substrate including the inside of the back via hole.
摘要:
A field effect transistor includes a semi-insulating semiconductor substrate; a buffer layer disposed on the substrate and having a high resistance; a first semiconductor layer disposed on the buffer layer and having a relatively high concentration of a dopant impurity; a second semiconductor layer disposed on the first semiconductor layer and having a relatively low concentration of a dopant impurity; a third semiconductor layer disposed on the second semiconductor layer and having a relatively high concentration of a dopant impurity; a fourth semiconductor layer disposed on the third semiconductor layer; and a gate electrode, a source electrode, and a drain electrode disposed on the fourth semiconductor layer wherein the electron affinity of the second semiconductor layer is larger than that of the first and third semiconductor layers, and the difference between the electron affinities of the first and second semiconductor layers proximate their junction is larger than the difference between the electron affinities of the second and third semiconductor layers proximate their junction. The linearity of an output signal with respect to an input signal is improved so that the field effect transistor has improved distortion characteristics and reduced noise on adjacent lines in frequency multiplexed communication.
摘要:
In an optical deflector of a polygonal mirror type, a rotating shaft is supported by a pair of journal bearings of a herringbone dynamic pressure type and a magnetic thrust bearing. The magnetic thrust bearing comprises first and second annular magnets. The first annular magnet is coaxially fixed to the shaft and has a first magnetic pole arrangement on its outer surface. The second annular magnet is fixed to a housing, and has its inner surface opposed to the outer surface of the first magnet and magnetized with a pole arrangement different from the pole arrangement of the first magnet, so that the first and second magnet attract one another to suspend the shaft. Ferromagnetic plates are fixed on both upper and lower surfaces of the first and second magnets.
摘要:
Barrel polishing is effected while causing a mass (M) consisting of work and media (polishing material) to rotation-flow by rotating a rotary disk installed in the bottom of a polishing tank by a drive motor. A load on the drive motor for the rotary disk is preset as by a load current value, and the flow of the mass (M) in the polishing tank is controlled, thereby effecting polishing while maintaining the load on the drive motor within the preset range.
摘要:
In a duplex type coating apparatus, a left-right pair of dies and are disposed on opposite sides of a carrying path of a web, the dies and are each made up of an upper member and a lower member, a tip part of the lower member projects further toward the carrying path than a tip part of the upper member, and coating liquid discharge passages are inclined in the direction of the carrying path of the web. As a result, because the same amount of coating liquid is discharged from each of the dies and coated onto each side of the web, it is possible to carry out coating at the same coating thickness and in the same position on both sides of the web.
摘要:
A high resistance compound semiconductor layer included in a semiconductor device including a plurality of compound semiconductor layers having different compositions includes a compound semiconductor that is vapor phase grown employing an organic metal compound including In, an organic metal compound including Al, and a hydrogenated compound or an organic metal compound including As. The high resistance compound semiconductor layer includes p type impurities having a concentration that positions the Fermi level of the compound semiconductor approximately at the center of the band gap of the compound semiconductor. Therefore, it is possible to produce a high resistance AlInAs layer that has less impurities that are diffused into an adjacent compound semiconductor layer.
摘要:
The upper portion of a frame of a lapping device is provided with a device for supplying a workpiece, a grindstone, and a delivering device, and a movable arm is horizontally and movably supported by a support column of the frame in such a manner that the arm moves above the supplying device, grindstone, and the delivering device. The movable arm is provided with an device for autorotating the workpiece, the autorotating device being able to move upwardly or downwardly through the pressurizing device, and the movable arm further being provided with a device for holding the workpiece beneath the autorotating device. The workpiece is transported by the holding device to a position above the grindstone, and is brought into abutment with the grindstone by a holding member which is disposed at the lower end of the autorotating device, whereby it is ground with being rotated.
摘要:
Inorganic media for barrel finishing produced by sintering a media green body formed from a mixed material comprising clay fine grains as a binder, abrasive grains and aluminum hydroxide fine grains as a brittleness imparting agent. The inorganic media is excellent in finishing performance, with which rough finishing can be conducted by dry barrel finishing.