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1.发明申请Semiconductor Package, Method for Manufacturing the Same, Semiconductor Module, and Electronic Device 审中-公开半导体封装，其制造方法，半导体模块和电子器件公开(公告)号：US20090256229A1
公开(公告)日：2009-10-15
申请号：US12085152
申请日：2006-11-01
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14625 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00
摘要： In a camera module (1) of the present invention, a lens member (20) is attached to a semiconductor package (10). The semiconductor package (10) includes: an image sensor (11) mounted on a wiring board (13); and a wire 15 through which the wiring board (13) is electrically connected to the image sensor (11). The image sensor (11) and the wire 15 are sealed with mold resin (14). A step (18) is formed around the perimeter of the surface of the mold resin (14), and the semiconductor package (10) and the lens member (20) are joined by fitting the step (18) and a projection (23) of a lens holder (22). With this arrangement, it is possible to realize a small semiconductor module that allows for highly precise alignment between the semiconductor package and a mounting component to which the semiconductor package is joined.
摘要翻译： 在本发明的摄像机模块（1）中，透镜构件（20）附接到半导体封装（10）。 半导体封装（10）包括：安装在布线板（13）上的图像传感器（11）; 以及配线基板（13）与图像传感器11电连接的布线15。 图像传感器（11）和线15用模制树脂（14）密封。 在模具树脂（14）的表面的周边周围形成有台阶（18），半导体封装（10）和透镜部件（20）通过嵌合台阶（18）和突起（23）而接合， 的透镜架（22）。 利用这种布置，可以实现允许半导体封装与半导体封装被连接的安装部件之间的高精度对准的小型半导体模块。
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公开(公告)号：US10286615B2
公开(公告)日：2019-05-14
申请号：US14345853
申请日：2012-07-23
摘要： A lens molding apparatus (100) of the present invention includes: a mold (1) having a transfer surface (1a); a mold (2) having a transfer surface (2a); heating devices (3a and 3b) for curing, by heating, a resin material which is supplied to the transfer surface (1a) and against which the transfer surface (2a) is pressed; a pressure control section (6) for controlling a support device (4) so that the support device (4) applies a pressure on the resin material; and a DC power source (7) for forming an electric field by applying a voltage between the molds (1 and 2).
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公开(公告)号：US09643345B2
公开(公告)日：2017-05-09
申请号：US14123759
申请日：2012-06-07
CPC分类号： B29C37/0003 , B29C33/44 , B29C43/021 , B29C43/50 , B29C45/568 , B29C2043/5092 , B29D11/00192 , B29D11/00432 , B29L2011/0016
摘要： A lens molding apparatus (100) of the present invention includes: a mold (1) having a transfer surface (1a) for transferring a predetermined lens shape to a resin material; a mold (2) having a transfer surface (2a) for transferring a predetermined lens shape to the resin material; a support device (3) for moving the mold (1); a heating device (4) curing the resin material so as to form a lens, the resin material having been supplied between the transfer surface (1a) and the transfer surface (2a); and an ultrasonic vibrator (5) applying vibration from a side surface of the mold (1 or 2) so as to form a gap at least at a part between the transfer surface (1a or 2a) and the lens.
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公开(公告)号：US20140191429A1
公开(公告)日：2014-07-10
申请号：US14124151
申请日：2012-06-07
CPC分类号： B29C37/0003 , B29C33/44 , B29C43/021 , B29C43/36 , B29C43/50 , B29C43/52 , B29C43/56 , B29C45/568 , B29C2043/5092 , B29D11/00009 , B29D11/00432 , B29L2011/0016
摘要： A lens molding apparatus of the present invention includes: a mold having a transfer surface for transferring a predetermined lens shape to a dielectric resin; a mold having a transfer surface for transferring a predetermined lens shape to the dielectric resin; a support device moving the mold; a heating device heating the dielectric resin so as to form a resin molded product, the dielectric resin having been supplied on the transfer surface; a DC power source forming an electric field by application of direct-current voltage between the mold and the mold; and switches switching a direction of the electric field between a direction from the mold to the mold and a direction from the mold to the mold.
摘要翻译： 本发明的透镜成型装置包括：具有用于将预定透镜形状转印到电介质树脂的转印面的模具; 具有用于将预定透镜形状传送到电介质树脂的转印表面的模具; 移动模具的支撑装置; 加热装置，加热所述介电树脂以形成树脂成型品，所述电介质树脂已被供给到所述转印面上; 通过在模具和模具之间施加直流电压形成电场的直流电源; 并且切换从模具到模具的方向和从模具到模具的方向上的电场方向。
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公开(公告)号：US08815129B2
公开(公告)日：2014-08-26
申请号：US12893113
申请日：2010-09-29
CPC分类号： B29D11/00009 , G02B3/0031
摘要： In order to realize a device and a method each capable of forming a lens with high accuracy and low costs, a lens forming device of the present invention includes a metal mold, an insulating substrate, a stage, a power source, a switch, and a UV radiating device. Dielectric resin is supplied onto the insulating substrate and a transfer surface of the metal mold is pressed to the dielectric resin so as to transfer a lens shape to the dielectric resin. At that time, the power source applies a voltage on the metal mold to generate an electric field between the metal mold and the insulating substrate so that an electrostatic attraction causes the dielectric resin to be attracted toward the transfer surface of the metal mold while the top of the dielectric resin has a sharp cuspate shape. Consequently, bubbles are less likely to be invade between the transfer surface and the dielectric resin, allowing transferring a highly accurate lens shape to the dielectric resin.
摘要翻译： 为了实现能够以高精度和低成本形成透镜的装置和方法，本发明的透镜形成装置包括金属模具，绝缘基板，载物台，电源，开关和 UV辐射装置。 将绝缘树脂供给到绝缘基板上，并将金属模的转印面压到电介质树脂上，以将透镜形状转印到电介质树脂上。 此时，电源在金属模具上施加电压以在金属模具和绝缘基板之间产生电场，使得静电吸引导致电介质树脂被吸引到金属模具的转印表面，而顶部 的电介质树脂具有尖锐的尖端形状。 因此，转移面和电介质树脂之间的气泡不太可能侵入，从而将高精度的透镜形状转印到电介质树脂上。
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6.发明授权公开(公告)号：US08657410B2
公开(公告)日：2014-02-25
申请号：US13562578
申请日：2012-07-31
IPC分类号： B41J2/16
CPC分类号： B41J2/1606 , B41J2/1433 , B41J2/162
摘要： A liquid discharging nozzle of the present invention includes (i) a liquid reservoir for reserving a discharging liquid and (ii) a discharging tube connected to a bottom part of the liquid reservoir. A water-repellent layer is provided on an inner surface of the discharging tube, on an inner surface of the discharging tube, and on an inner surface of the liquid reservoir, and is a fluorinated water-repellent layer. An aluminum oxide layer and a silicon oxide layer are used as foundation layers of the fluorinated water-repellent layer. The aluminum oxide layer, the silicon oxide layer, and the fluorinated water-repellent layer, which are stacked together, have a combined thickness of not more than 25 nm. The fluorinated water-repellent layer alone has a thickness of 1 nm to 4 nm.
摘要翻译： 本发明的液体排出喷嘴包括（i）用于储存排出液体的液体储存器，和（ii）连接到储液器的底部的排出管。 在排出管的内表面，排出管的内表面和储液器的内表面上设置有防水层，并且是氟化防水层。 氧化铝层和氧化硅层用作氟化防水层的基层。 堆叠在一起的氧化铝层，氧化硅层和氟化防水层的组合厚度不大于25nm。 仅氟化防水层的厚度为1nm〜4nm。
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7.发明申请LIQUID DISCHARGING NOZZLE AND METHOD FOR RECOVERING WATER-REPELLENT LAYER OF THE LIQUID DISCHARGING NOZZLE 有权液体排放喷嘴的液体排放喷嘴和回收液体排放喷嘴的水层的方法公开(公告)号：US20130033545A1
公开(公告)日：2013-02-07
申请号：US13562578
申请日：2012-07-31
CPC分类号： B41J2/1606 , B41J2/1433 , B41J2/162
摘要： A liquid discharging nozzle of the present invention includes (i) a liquid reservoir for reserving a discharging liquid and (ii) a discharging tube connected to a bottom part of the liquid reservoir. A water-repellent layer is provided on an inner surface of the discharging tube, on an inner surface of the discharging tube, and on an inner surface of the liquid reservoir, and is a fluorinated water-repellent layer. An aluminum oxide layer and a silicon oxide layer are used as foundation layers of the fluorinated water-repellent layer. The aluminum oxide layer, the silicon oxide layer, and the fluorinated water-repellent layer, which are stacked together, have a combined thickness of not more than 25 nm. The fluorinated water-repellent layer alone has a thickness of 1 nm to 4 nm.
摘要翻译： 本发明的液体排出喷嘴包括（i）用于储存排出液体的液体储存器，和（ii）连接到储液器的底部的排出管。 在排出管的内表面，排出管的内表面和储液器的内表面上设置有防水层，并且是氟化防水层。 氧化铝层和氧化硅层用作氟化防水层的基层。 堆叠在一起的氧化铝层，氧化硅层和氟化防水层的组合厚度不大于25nm。 仅氟化防水层的厚度为1nm〜4nm。
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8.发明申请Optical element, optical element wafer, optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device 有权光学元件，光学元件晶片，光学元件晶片模块，光学元件模块，光学元件模块的制造方法，电子元件晶片模块，电子元件模块的制造方法，电子元件模块和电子信息装置公开(公告)号：US20100073533A1
公开(公告)日：2010-03-25
申请号：US12586482
申请日：2009-09-23
申请人： Yuji Yano , Takahiro Nakahashi , Tetsuya Tamiya
发明人： Yuji Yano , Takahiro Nakahashi , Tetsuya Tamiya
CPC分类号： B29D11/00432 , G02B7/021 , G02B13/0085 , Y10T83/0405 , Y10T156/1075
摘要： An optical element according to the present invention includes: an optical surface at a center portion thereof; a spacer section having a predetermined thickness on an outer circumference side of the optical surface; a support plate including one or a plurality of through holes penetrating the optical surface, inside a transparent resin material; and a penetrating portion and/or a concave portion for releasing the resin material when forming resin, in a further outer peripheral portion of the support plate.
摘要翻译： 根据本发明的光学元件包括：在其中心部分处的光学表面; 在所述光学表面的外周侧具有预定厚度的间隔部分; 在透明树脂材料的内部包括贯穿光学面的一个或多个通孔的支撑板; 以及在支撑板的另一外周部分中形成树脂时用于释放树脂材料的穿透部分和/或凹部。
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公开(公告)号：US20140217626A1
公开(公告)日：2014-08-07
申请号：US14345853
申请日：2012-07-23
IPC分类号： B29D11/00
CPC分类号： B29D11/00413 , B29C43/021 , B29C43/36 , B29C43/56 , B29C43/58 , B29C2043/568 , B29C2043/5808 , B29D11/0048 , B29L2011/0016
摘要： A lens molding apparatus (100) of the present invention includes: a mold (1) having a transfer surface (1a); a mold (2) having a transfer surface (2a); heating devices (3a and 3b) for curing, by heating, a resin material which is supplied to the transfer surface (1a) and against which the transfer surface (2a) is pressed; a pressure control section (6) for controlling a support device (4) so that the support device (4) applies a pressure on the resin material; and a DC power source (7) for forming an electric field by applying a voltage between the molds (1 and 2).
摘要翻译： 本发明的透镜成型装置（100）包括：具有转印面（1a）的模具（1） 具有转印表面（2a）的模具（2）; 加热装置（3a和3b），用于通过加热固化供给到转印表面（1a）并且转印表面（2a）被按压的树脂材料; 用于控制支撑装置（4）的压力控制部分（6），使得支撑装置（4）对树脂材料施加压力; 和用于通过在模具（1和2）之间施加电压来形成电场的直流电源（7）。
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公开(公告)号：US20140103552A1
公开(公告)日：2014-04-17
申请号：US14123759
申请日：2012-06-07
IPC分类号： B29C37/00
CPC分类号： B29C37/0003 , B29C33/44 , B29C43/021 , B29C43/50 , B29C45/568 , B29C2043/5092 , B29D11/00192 , B29D11/00432 , B29L2011/0016
摘要： A lens molding apparatus (100) of the present invention includes: a mold (1) having a transfer surface (1a) for transferring a predetermined lens shape to a resin material; a mold (2) having a transfer surface (2a) for transferring a predetermined lens shape to the resin material; a support device (3) for moving the mold (1); a heating device (4) curing the resin material so as to form a lens, the resin material having been supplied between the transfer surface (1a) and the transfer surface (2a); and an ultrasonic vibrator (5) applying vibration from a side surface of the mold (1 or 2) so as to form a gap at least at a part between the transfer surface (1a or 2a) and the lens.
摘要翻译： 本发明的透镜成型装置（100）包括：具有用于将规定的透镜形状转印到树脂材料的转印面（1a）的模具（1） 具有用于将预定透镜形状传送到树脂材料的转印面（2a）的模具（2） 用于移动模具（1）的支撑装置（3）; 加热装置（4）固化所述树脂材料以形成透镜，所述树脂材料已经供应在所述转印表面（1a）和转印表面（2a）之间; 以及从模具（1或2）的侧面施加振动的超声波振动器（5），以至少在转印面（1a或2a）与透镜之间的部分形成间隙。
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