利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

79 条记录 (耗时 0.024 秒)

    Cooling device and electronic device
    1.
    发明申请
    Cooling device and electronic device 审中-公开
    冷却装置和电子装置

    公开(公告)号：US20060144573A1

    公开(公告)日：2006-07-06

    申请号：US11362924

    申请日：2006-02-28

    申请人： Kazuhiro Nitta ,  Masumi Suzuki ,  Michimasa Aoki ,  Keizou Takemura ,  Kenji Katsumata

    发明人： Kazuhiro Nitta ,  Masumi Suzuki ,  Michimasa Aoki ,  Keizou Takemura ,  Kenji Katsumata

    IPC分类号： H05K7/20

    CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a cooling device, an electronic component is attached to one surface on one side of a heat pipe so that heat can be conveyed, a first heat-radiating fin is provided on another surface on another side of the heat pipe, a first fan unit that sends an airflow to the first heat-radiating fin is provided on one side of the heat pipe, and a first duct that guides the airflow produced by the first fan unit to the first heat-radiating fin is provided on the other surface of the heat pipe.

    摘要翻译： 在冷却装置中，将电子部件安装在热管的一侧的一个面上，以便能够输送热量，在所述热管的另一侧的另一面上设置有第一散热片，第一风扇单元 在所述热管的一侧设置有向所述第一散热片发送气流的第一导流管，将由所述第一风扇单元产生的气流引导到所述第一散热片的第一导管设置在所述第一散热片的另一面上 热管。

    Radiator and electronic apparatus having coolant pathway
    4.
    发明申请
    Radiator and electronic apparatus having coolant pathway 审中-公开
    具有冷却剂通道的散热器和电子设备

    公开(公告)号：US20120055654A1

    公开(公告)日：2012-03-08

    申请号：US13137654

    申请日：2011-08-31

    申请人： Kenji Katsumata ,  Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda ,  Masaru Sugie ,  Shinichirou Kuono ,  Hiroshi Muto

    发明人： Kenji Katsumata ,  Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda ,  Masaru Sugie ,  Shinichirou Kuono ,  Hiroshi Muto

    IPC分类号： F28F13/00 ,  F28D1/00

    CPC分类号： H01L23/467 ,  F28D1/047 ,  F28D1/0472 ,  F28D15/00 ,  F28D2021/0031 ,  F28F2210/02 ,  F28F2210/10 ,  G06F1/20 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A radiator includes a core unit, which includes a flow inlet which coolant enters, a flow outlet from which the coolant exits, a plurality of coolant pathways including at least an outer coolant pathway, an inner coolant pathway, a branching point, and a merging point, the outer coolant pathway being disposed to surround the inner coolant pathway, the coolant being divided at the branching point and merging at the merging point, and a connecting pathway to connect between the merging point of the outer coolant pathway and the branching point of the inner coolant pathway, wherein the flow inlet is in communication with a branching point of an outermost one of the plurality of coolant pathways, and the flow output is in communication with a merging point of an innermost one of the plurality of coolant pathways.

    摘要翻译： 散热器包括芯单元，其包括冷却剂进入的流入口，冷却剂从其流出的流出口，多个冷却剂通路，至少包括外部冷却剂通道，内部冷却剂通道，分支点和合并 所述外部冷却剂通道被设置为围绕所述内部冷却剂通道，所述冷却剂在所述分支点处被分割并在所述汇合点处汇合，以及连接路径以连接所述外部冷却剂通道的汇合点和所述外部冷却剂通道的分支点 所述内部冷却剂通道，其中所述流入口与所述多个冷却剂通道中的最外部冷却剂通道的分支点连通，并且所述流动输出与所述多个冷却剂通道中的最内部冷却剂通道的汇合点连通。

    HEAT SINK, LIQUID COOLING UNIT, AND ELECTRONIC APPARATUS
    6.
    发明申请
    HEAT SINK, LIQUID COOLING UNIT, AND ELECTRONIC APPARATUS 审中-公开
    散热器，液体冷却单元和电子设备

    公开(公告)号：US20120055655A1

    公开(公告)日：2012-03-08

    申请号：US13198899

    申请日：2011-08-05

    申请人： Michimasa Aoki ,  Masumi Suzuki ,  Yosuke Tsunoda ,  Masaru Sugie ,  Shinichirou Kouno ,  Hiroshi Muto ,  Kenji Katsumata

    发明人： Michimasa Aoki ,  Masumi Suzuki ,  Yosuke Tsunoda ,  Masaru Sugie ,  Shinichirou Kouno ,  Hiroshi Muto ,  Kenji Katsumata

    IPC分类号： F28F13/00 ,  F28F7/00

    CPC分类号： G06F1/203

    摘要： A heat sink for absorbing heat which is generated by an electronic module by a coolant which flows through its internal portion, provided with a first heat sink part which is contiguous with the electronic module, a second heat sink part which is contiguous with the electronic module, and a heat discharger which is arranged spaced from the first heat sink part and second heat sink part at an opposite side from the electronic module and which is arranged in a flow path between the first heat sink part and second heat sink part.

    摘要翻译： 一种用于吸收热量的散热器，其由通过其内部部分流过的冷却剂由电子模块产生，设置有与所述电子模块邻接的第一散热部分，与所述电子模块邻接的第二散热器部分 以及放热器，其与第一散热部和第二散热部隔开设置在与电子模块相反的一侧，并且布置在第一散热部和第二散热部之间的流路中。

    RFID tag
    8.
    发明授权
    RFID tag 有权
    RFID标签

    公开(公告)号：US07951249B2

    公开(公告)日：2011-05-31

    申请号：US11704321

    申请日：2007-02-09

    申请人： Shunichi Kikuchi ,  Masumi Suzuki ,  Michimasa Aoki

    发明人： Shunichi Kikuchi ,  Masumi Suzuki ,  Michimasa Aoki

    IPC分类号： B32B41/00

    CPC分类号： G06K19/0773 ,  B31D1/028 ,  G06K19/07749 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1062 ,  H01L2224/0401

    摘要： The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.

    摘要翻译： 本发明提供了热扩散性优异的RFID标签。 RFID标签包括：基座，设置在基座上并形成通信天线的天线图案，与天线图形电连接并通过天线进行无线通信的电路芯片，与所述天线图案紧密接触地设置的盖 该基底以覆盖包括电路芯片的规定区域以外的天线图案，以及覆盖规定区域并与电路芯片热接触的绝缘热扩散材料。 绝缘热扩散材料的导热系数高于盖的热导率。

    Heat sink with non-uniform fins and transverse protrusion
    9.
    发明授权
    Heat sink with non-uniform fins and transverse protrusion 失效
    散热片具有不均匀的翅片和横向突起

    公开(公告)号：US07684190B2

    公开(公告)日：2010-03-23

    申请号：US10745538

    申请日：2003-12-29

    申请人： Michimasa Aoki ,  Masumi Suzuki

    发明人： Michimasa Aoki ,  Masumi Suzuki

    IPC分类号： H05K7/20

    CPC分类号： H01L23/3672 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink includes a generally rectangular flat base, a plurality of fins provided on the surface of the base in parallel to each other, a protrusion provided on the surface of the base along substantially the overall width of the base in the transverse direction to the fins. The fins become gradually shorter on one end side of the base. The ends of the fins are arranged on an oblique line with respect to a line perpendicular to the fins.

    摘要翻译： 散热器包括大致矩形的平坦的基座，在基座的表面上彼此平行地设置的多个翅片，沿着基部的整个宽度沿着横向方向设置在基部的表面上的突起 翅片。 翅片在基座的一端侧逐渐变短。 翅片的端部相对于垂直于翅片的线布置在倾斜的线上。

    Printed circuit board having larger space for electronic components and contributing to efficient cooling
    10.
    发明授权
    Printed circuit board having larger space for electronic components and contributing to efficient cooling 有权
    印刷电路板具有较大的电子元件空间，有助于有效的冷却

    公开(公告)号：US07248473B2

    公开(公告)日：2007-07-24

    申请号：US10947207

    申请日：2004-09-23

    申请人： Masuo Ohnishi ,  Masumi Suzuki ,  Michimasa Aoki

    发明人： Masuo Ohnishi ,  Masumi Suzuki ,  Michimasa Aoki

    IPC分类号： H05K7/20

    CPC分类号： G06F1/203 ,  G06F2200/201 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/09072

    摘要： An intake opening is defined in a printed circuit board inside a fan cover mounted on the printed circuit board. The intake opening has a particular extent inside the fan cover. This intake opening contributes to improvement in the cooling efficiency of a fan as compared with a conventional intake opening. Moreover, the intake opening allows a sufficient space to remain on the front and back surfaces of the printed circuit board inside the fan cover. Electronic components and/or wiring patterns may be disposed in the space. This contributes to disposition of electronic components and/or wiring patterns at a higher density on the printed circuit board.

    摘要翻译： 在安装在印刷电路板上的风扇盖内的印刷电路板中限定进气口。 进气口在风扇盖内部具有特定的范围。 与常规进气口相比，该进气口有助于提高风扇的冷却效率。 此外，进气口允许在风扇盖内的印刷电路板的前表面和后表面上留有足够的空间。 电子部件和/或布线图案可以设置在该空间中。 这有助于在印刷电路板上以更高的密度布置电子部件和/或布线图案。