公开(公告)号：US5641996A

公开(公告)日：1997-06-24

申请号：US593675

申请日：1996-01-29

申请人： Kazunori Omoya ,  Takashi Oobayashi ,  Wataru Sakurai ,  Mitsuru Harada ,  Yoshihiro Bessho

发明人： Kazunori Omoya ,  Takashi Oobayashi ,  Wataru Sakurai ,  Mitsuru Harada ,  Yoshihiro Bessho

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/485 ,  H01L23/28

CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L24/12 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/351

摘要： An improved semiconductor unit package is disclosed. This package is implemented by a semiconductor device having an electrode pad, a substrate having a terminal electrode, a bump electrode formed on the electrode pad, a conductive adhesion layer with flexibility, and an encapsulating layer formed by curing a composition the viscosity and thixotropy index of which are below 100 Pa.multidot.s and below 1.1, respectively. Such a composition essentially consists of (A) a resin binder that contains, for example, a polyepoxide, an acid anhydride, and a rheology modifier and (B) a filler. The rheology modifier is one capable of impeding interaction between a free acid contained in the acid anhydride and a polar group at the surface of the filler. An encapsulant with improved flowability is used, so that the encapsulant readily flows and spreads to fill a gap between the semiconductor device and the substrate with no air bubbles. This achieves semiconductor unit packages with high reliability and productivity.

摘要翻译： 公开了一种改进的半导体单元封装。 该封装由具有电极焊盘，具有端子电极的基板，形成在电极焊盘上的突起电极，具有柔软性的导电性粘合层的半导体装置，以及通过使组合物固化而形成的密封层和触变性指数 分别低于100个百分点和1.1以下。 这种组合物基本上由（A）含有例如聚环氧化物，酸酐和流变改性剂的树脂粘合剂组成，（B）填料。 流变改性剂是能够阻碍酸酐中所含的游离酸与填料表面的极性基团之间的相互作用的改性剂。 使用具有改善的流动性的密封剂，使得密封剂容易流动和扩散以填充半导体器件和衬底之间的间隙，而没有气泡。 这实现了具有高可靠性和生产率的半导体单元封装。

公开(公告)号：US6139777A

公开(公告)日：2000-10-31

申请号：US304700

申请日：1999-05-04

申请人： Kazunori Omoya ,  Takeshi Suzuki ,  Tatsuo Ogawa ,  Takashi Oobayashi

发明人： Kazunori Omoya ,  Takeshi Suzuki ,  Tatsuo Ogawa ,  Takashi Oobayashi

IPC分类号： H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H01B1/22 ,  B05D5/12 ,  H05K1/00

CPC分类号： H05K3/462 ,  H05K1/095 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901

摘要： A paste for via-hole filling is provided, and the paste comprises at least (a) 30-70 volume % of conductive particles whose average diameter ranges from 0.5 to 20 .mu.m and whose specific surface area ranges from 0.05 to 1.5 m.sup.2 /g, and (b) 70-30 volume % of resin comprising at least 10 weight % of epoxy resin comprising at least one epoxy group per molecule, in which the total amount of a hydroxyl group, an amino group and a carboxyl group is not more than 5 mol % of the epoxy group, and the epoxy equivalent ranges from 100 to 350 g/eq. The conductive paste for filling via-holes and a printed circuit board comprising thereof can be used to provide an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener and a dispersant if necessary. The paste having low viscosity and low volatility is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foils on both sides to attain a printed circuit board where both sides are electrically connected by inner-via-hole.

摘要翻译： 提供了一种用于通孔填充的糊料，并且该糊料至少包含（a）30-70体积％的导电颗粒，其平均直径范围为0.5至20μm，比表面积为0.05至1.5m 2 / g ，和（b）70-30体积％的树脂，其包含每分子至少10重量％的包含至少一个环氧基的环氧树脂，其中羟基，氨基和羧基的总量不多 不大于5mol％的环氧基，并且环氧当量为100-350g / eq。 用于填充通孔的导电膏和包括其的印刷电路板可以用于在电极层之间提供内通孔连接，而不使用通孔电镀技术。 如果需要，导电糊包含金属颗粒如铜，环氧树脂，固化剂和分散剂。 使用具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。 然后，将该基板与两侧的铜箔一起加热加压，以获得印刷电路板，其中两侧通过内通孔电连接。