摘要:
Fibrous activated carbon having a pH not more than 5 which is suitable for recovering halogenated hydrocarbon solvents is disclosed. The fibrous activated carbon is obtained by acid treating raw fibrous activated carbon.
摘要:
A method for manufacturing activated carbon fibers is disclosed. The method is comprised of the steps of:(1) causing an acrylic fiber to contain therein a treating agent selected from the group consisting of phosphorus and boron compounds in a concentration of 0.01 to 0.3% by weight as phosphorus or boron based on the weight of the fiber;(2) preoxidizing the acrylic fiber in an oxidizing atmosphere at a temperature exceeding 200.degree. C. and giving a core ratio of 18% until the amount of bonded oxygen becomes not less than 15% by weight based on the weight of the fiber thereby producing a preoxidized fiber;(3) adjusting the concentration of the treating agent in the preoxidized fiber to a level in the range of 0.04 to 1% by weight based on the thus obtained preoxidized fiber; and(4) thereafter activating the fiber at a temperature in the range of 900.degree. to 1,300.degree. C. The resulting fiber has improved high strength, high adsorbing ability and high processibility.
摘要:
An activated carbon fiber spun yarn having excellent workability and adsorptive property is disclosed. The activated carbon fiber spun yarn comprising activated carbon fibers having a specific surface area of 500 to 1,500 m.sup.2 /g, a ductility of at least 0.5%, and a tensile strength of at least 10 kg/mm.sup.2 and derived from acrylonitrile-based fibers. The spun yarn has a twist coefficient of 30 to 60.
摘要翻译:公开了一种具有优异的加工性和吸附性能的活性炭纤维纱。 活性炭纤维细纱包含比表面积为500〜1500m2 / g,延展性为0.5%以上的活性炭纤维,拉伸强度为10kg / mm 2以上,来自丙烯腈系纤维。 纺纱的扭曲系数为30〜60。
摘要:
A semiconductor integrated circuit device includes cells A-1, B-1, and C-1 that have the same logic. Cell B-1 has cell width W2 larger than a cell width of cell A-1, but gate length L1 of a MOS transistor is equal to that of cell A-1. Cell C-1 has cell width W2 equal to a cell width of cell B-1, but has a MOS transistor having large gate length L2. A circuit delay of cell C-1 becomes large as compared with that of cells A-1 and B-1, but leak current becomes small. Therefore, by replacing cell A-1 adjacent to a space area with cell B-1, and by replacing cell B-1 in a path having room in timing with cell C-1, for example, leak current can be suppressed without increasing a chip area.
摘要:
It is an object of the invention to effectively absorb a power noise and to implement the stable operation of a circuit. The invention provides a semiconductor device comprising a bypass capacitor including an MOS structure having a gate electrode formed to be extended from a power wiring region to a portion provided under an empty region which is adjacent to the power wiring region and has no other functional layer, and formed through a capacitive insulating film on a diffusion region having one conductivity type, and a substrate contact formed under a ground wiring region and fixing a substrate potential, wherein the bypass capacitor has a contact to come in contact with the power wiring which is formed on a surface of the gate electrode and has the diffusion region having the one conductivity type and a diffusion region of the substrate contact connected to each other.
摘要:
Operation analysis is performed for a semiconductor integrated circuit designed by using substrate bias control technology. Power supply potential and substrate potential are analyzed by using circuit information of the semiconductor integrated circuit, and from obtained power supply potential waveform information and substrate potential waveform information, potential difference information indicating a difference value between the power supply potential and the substrate potential is obtained. On the basis of this potential difference information, effects on circuit delay due to substrate noise are analyzed using a delay library showing a relationship between the difference value and the effects on circuit delay. Further, a determination is performed as to whether the difference value exceeds a predetermined difference restriction value.
摘要:
Operation analysis is performed for a semiconductor integrated circuit designed by using substrate bias control technology. Power supply potential and substrate potential are analyzed by using circuit information of the semiconductor integrated circuit, and from obtained power supply potential waveform information and substrate potential waveform information, potential difference information indicating a difference value between the power supply potential and the substrate potential is obtained. On the basis of this potential difference information, effects on circuit delay due to substrate noise are analyzed using a delay library showing a relationship between the difference value and the effects on circuit delay. Further, a determination is performed as to whether the difference value exceeds a predetermined difference restriction value.
摘要:
In a method of analyzing a power noise based on the circuit information of a semiconductor integrated circuit device, the power noise is analyzed in consideration of the influence of the impedance of a substrate. Consequently, the impedance of the substrate which has not been conventionally considered is taken into consideration. Thus, precision in the analysis can be enhanced more greatly.
摘要:
In contrast with a known dynamic gate-level simulation method, a method of analyzing electromagnetic interference (an EMI analysis method) according to the present invention enables estimation of EMI noise, by means of calculating signal propagation of each node through use of the signal propagation probability technique, and calculating variation time of each node through use of “the Static timing analysis technique”. In short, the present invention is characterized in calculating a frequency characteristic from the relationship between toggle probability of each node and delay in each node.
摘要:
The resistance value of a supply line (Rline), the resistance value of a decoupling capacitor (Rcap), and the resistance value of a transistor (Rmos) are separately calculated from mask layout information 31 of a semiconductor integrated circuit. The resistance value between external terminals (Ri) is calculated from the resistance value Rline, the resistance value Rcap, and the resistance value Rmos.