HDD suspension and its manufacture
    1.
    发明申请
    HDD suspension and its manufacture 审中-公开
    硬盘悬挂及其制造

    公开(公告)号:US20060073316A1

    公开(公告)日:2006-04-06

    申请号:US11253564

    申请日:2005-10-20

    IPC分类号: B32B3/00

    摘要: This invention relates to an HDD suspension and a process for its manufacture with high productivity and reliability. The HDD suspension of this invention is manufactured from a laminate composed of a stainless steel substrate, an insulating resin layer and a metal foil by wet-etching the laminate by the use of a basic fluid. The insulating layer of the laminate is composed of plural layers of polyimide, every constituent layer exhibits a mean etching rate of 0.5 μM/min or more by a 50 wt % aqueous solution of KOH at 80° C., the layers in contact with the stainless steel substrate and the metal foil are those of polyimide (B) exhibiting a glass transition temperature of 300° C. or less and the adhesive strength between the layer of polyimide (B) and either the stainless steel substrate or the metal foil is 0.5 kN/m or more.

    摘要翻译: 本发明涉及一种具有高生产率和可靠性的HDD悬架及其制造方法。 本发明的HDD悬架通过使用碱性流体湿法蚀刻层压体由由不锈钢基板,绝缘树脂层和金属箔组成的叠层制造。 层叠体的绝缘层由多层聚酰亚胺构成,各构成层通过在80℃下的50重量%的KOH水溶液表现出0.5μmM/ min以上的平均蚀刻速度,与 不锈钢基材和金属箔是玻璃化转变温度为300℃以下的聚酰亚胺(B),并且聚酰亚胺(B)与不锈钢基材或金属箔之间的粘合强度为0.5 kN / m以上。

    Production process of electronic component using wet etching, electronic component, and suspension for hard disk
    5.
    发明授权
    Production process of electronic component using wet etching, electronic component, and suspension for hard disk 有权
    使用湿蚀刻,电子元件和硬盘悬挂的电子元件的生产工艺

    公开(公告)号:US06709988B2

    公开(公告)日:2004-03-23

    申请号:US10107801

    申请日:2002-03-28

    IPC分类号: H01L21302

    CPC分类号: H05K3/002 H05K3/064

    摘要: The present invention relates to a production process which, in the production of an electronic component by wet etching of an insulating layer in a laminate, is low in cost, does not use any organic solvent, which poses a problem of waste treatment. The production process of an electronic component comprises the steps of: wet etching a laminate of conductive inorganic material layer—insulating layer—conductive inorganic material layer or a laminate of conductive inorganic material layer—insulating layer to pattern the conductive inorganic material layer; and then performing wet etching to pattern the insulating layer. The patterning of the insulating layer by wet etching is carried out in a continuous form using a dry film resist; and, the dry film resist is laminated by roll pressing onto the laminate under a reduced pressure of not more than 80 KPa.

    摘要翻译: 本发明涉及一种制造方法,在通过湿式蚀刻层叠体中的绝缘层的电子部件的制造中,成本低,不使用任何有机溶剂,这导致废物处理的问题。 电子部件的制造方法包括以下步骤:湿式蚀刻导电无机材料层 - 绝缘层 - 导电无机材料层或导电无机材料层 - 绝缘层的层压体的层压体,以对导电无机材料层进行图案化; 然后进行湿蚀刻以对绝缘层进行图案化。 通过湿式蚀刻对绝缘层的图案化使用干膜抗蚀剂以连续形式进行; 并且通过在不超过80KPa的减压下通过辊压将层压薄膜层压到层压板上。